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Neuigkeiten

  • 2018-10-01 Micron und ATP geben Zusammenarbeit bei DDR2 Continuity Programm bekannt
    Micron Technology Inc. und ATP Electronics, Inc, zwei führende Hersteller hochwertiger Speichermedien, haben sich zusammengeschlossen um die Langzeitverfügbarkeit von DDR2 Legacy DRAM Modulen sicherzustellen. ATP wird hierbei Micron’s DDR2 SoDIMMs, UDIMMs und RDIMMs weiter produzieren, nachdem Micron diese Module abgekündigt hat.
  • 2018-07-27 ATP e.MMC: Built Small for Big Industrial Storage Demands
    Fueled by continuous big data generation, the ongoing industrial revolution requires storage solutions that offer not only high performance, but also uncompromising reliability and maximum endurance. ATP Electronics, a leading manufacturer of industrial memory and storage solutions, tackles these tough storage demands with its new industrial e.MMC product family.
  • 2018-07-20 ATP Miniature Storage Powerhouses Take Center Stage at FMS 2018
    Lean and Mean Solutions Tackle Big Data Demands of the IoT Era The volume of data traffic is growing by the minute, and ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, is meeting colossal storage demands with its latest portfolio built for space-restricted embedded, industrial, and automotive systems. ATP shows off its extensive array of flash memory and storage products at the Flash Memory Summit 2018 in Sta. Clara, USA from August 7 to 9.
  • 2018-05-30 ATP's Statement on GDPR and how we are committed your protect privacy and personal data
    ATP Electronics has always been committed to protecting privacy and personal data, and has been taking all necessary measures to ensure compliance to the GDPR, as well as to all relevant international laws and regulations.
  • 2018-04-20 ATP Goes Full Throttle on IIoT's Data-Driven Industrial Evolution with iTemp NVMe™, 3D NAND, DRAM at Embedded Systems Expo (ESEC Spring) Japan
    ATP Electronics is full speed ahead in meeting the data storage challenges of the IIoT age with its fast iTemp NVMe™ SSDs, reliable 3D NAND-based memory cards and rugged DRAM for industrial and embedded applications at the Embedded Systems Expo
  • 2018-02-13 ATP Gears Up for Age of Autonomous Systems, Showcases iTemp NVMe™ M.2 SSDs at Embedded World 2018
    ATP Electronics, unveils its flagship NVMe™ solid state drive (SSD) modules with industrial temperature support at Embedded World 2018 in Nuremberg, Germany from February 27 to March 1, 2018.
  • 2018-01-25 ATP's Industrial Temperature PCIe/NVMe SSDs bieten Zuverlässigkeit bei höchster Geschwindigkeit
    ATP Electronics, führender Hersteller industrieller Speichermedien, leitet den nächsten Technologiesprung für industrielle SSDs ein und bringt seine erste Generation von PCIe/NVMe SSDs mit erweitertem Temperaturbereich (-40°C bis +85°C) auf den Markt. Sie basieren auf dem M.2 Formfaktor und eignen sich besonders für anspruchsvolle Anwendungen mit hohen Anforderungen an Temperaturbeständigkeit und Geschwindigkeit.
  • 2017-12-21 ATP veröffentlicht DDR4-2666 DRAMs für die neuesten Intel® Xeon® Scalable und 8th Gen Intel® Core ™ Prozessoren
    ATP Electronics, führender Anbieter hochleistungsstarker, hochwertiger und zuverlässiger NAND-Flash- und DRAM-Speichermodule bietet nun erstmals DDR4 DRAM Module mit 2666MHZ und Low Voltage für Intel® Xeon® Platinum, Gold, Silber und Bronze Scalable Prozessoren und für die 8te-Generation Intel® Core™ i7/i5/i3 Prozessoren an.
  • 2016-11-16 ATP at Full Steam for Electronica 2016
    Taipei, Taiwan (November 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.
  • 2016-11-16 ATP at Full Steam for Electronica 2016
    Taipei, Taiwan (November 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.

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