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Neuigkeiten

  • 2017-12-21 ATP veröffentlicht DDR4-2666 DRAMs für die neuesten Intel® Xeon® Scalable und 8th Gen Intel® Core ™ Prozessoren
    ATP Electronics, führender Anbieter hochleistungsstarker, hochwertiger und zuverlässiger NAND-Flash- und DRAM-Speichermodule bietet nun erstmals DDR4 DRAM Module mit 2666MHZ und Low Voltage für Intel® Xeon® Platinum, Gold, Silber und Bronze Scalable Prozessoren und für die 8te-Generation Intel® Core™ i7/i5/i3 Prozessoren an.
  • 2016-11-16 ATP at Full Steam for Electronica 2016
    Taipei, Taiwan (November 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.
  • 2016-10-17 ATP Introduces Industry’s First DDR3L-1866 ECC SODIMM
    Well-suited for Intel Apollo Lake based IoT and embedded platforms, ATP's industry’s first DDR3L ECC SODIMM technology is capable of operating at 1866MHz.
  • 2016-03-28 ATP Furthers Support of Micron Legacy DRAM Modules
    Continues to manufacture SDR/DDR1 Modules on Micron EOL List
  • 2016-02-15 ATP präsentiert seine Automotive Lösungen auf der EW2016
    Und stellt die neue SATA III Produktfamilie vor
  • 2016-11-16 ATP at Full Steam for Electronica 2016
    Taipei, Taiwan (November 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.
  • 2016-10-17 ATP Introduces Industry’s First DDR3L-1866 ECC SODIMM
    Well-suited for Intel Apollo Lake based IoT and embedded platforms, ATP's industry’s first DDR3L ECC SODIMM technology is capable of operating at 1866MHz.
  • 2016-03-28 ATP Furthers Support of Micron Legacy DRAM Modules
    Continues to manufacture SDR/DDR1 Modules on Micron EOL List
  • 2016-02-15 ATP präsentiert seine Automotive Lösungen auf der EW2016
    Und stellt die neue SATA III Produktfamilie vor

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