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プレスリリース

  • 2016-11-16 ATP at Full Steam for Embedded Technology 2016
    Taipei, Taiwan (November 16, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products from Nov 16th to 18th at Embedded Technology 2016 in Yokohama, Japan. ATP booth will be located at # C-30-3.
  • 2016-10-17 ATPエレクトロニクス、業界初DDR3L-1866 ECC機能付きSODIMMリリース
    Intel Apollo-LakeをベースとしたIoT、組込み系システムではDDR3L-1866(1866MHz)ECC機能付とECC機能なしの2種類により最高のシステム性能を発揮します。一般的には、ECC機能付きSODIMMのDDR3L製品は1600MHzまでしかありません。ATP社では、更に性能アップした1866MHzを可能にしこれらのDRAMモジュール製品はシステムの互換性などに影響することもなく、耐性を維持し性能アップと検証済みでIntel社のAVL(Approved Vendor List)となっている製品です。

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