> テクノロジーとソリューション > テクノロジー > 金メッキ厚み

テクノロジーとソリューション

金メッキ厚み

メッキ厚、強度の増強

コネクタのメッキ厚は薄いと酸化した際に、ピンホール接触不具合への原因となります。

ATP  DRAMモジュール間の信号伝送の品質を確保するために、ATPは他社のDRAMモジュールに 比べ「より厚い」6~12層基板 と共に、特別の30μ”厚のゴールド接点メッキを利用しています。

 

6および12層基板はより高速時の信号品質を保証します。

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