Low 1.2V power design, massive density, and speed deliver accelerated performance and cost-effective scalability
Taipei, Taiwan (October 2017) – ATP Electronics, a leading manufacturer of high-performance cost-effective DRAM modules, announces the release of fast, low-power DDR4 solutions for the latest Intel® Xeon® Platinum, Gold, Silver and Bronze Scalable processors and 8th-generation Intel® Core™ i7/i5/i3 processors.
ATP’s latest DDR4 solutions are ideal for high-performance computing (HPC) applications requiring high density, low power, great scalability and efficiency, suchas telecommunication infrastructures, networking storage systems, network-attached storage (NAS) servers, micro/cloud servers, and embedded systems like industrial PCs.
Built-in enterprise-level density dramatically increases the capabilities of growing embedded and cloud computing environments to meet large-scale, memory-intensive workloads.
The 1.2V low power design delivers optimal savings, keeping systems cool without escalating power bills. The latest Intel® Xeon® Scalable processors provide native support for six memory channels that can operate at the same speed even at full load, so ATP’s DDR4-2666 modules ensure a big boost in performance and productivity with their fast 2666 MT/s data rate. The increased interface speed from 2400/MTs to 2666 MT/s amplifies theoretical peak performance by 15%.
By implementing the 8 Gbit IC design, ATP DDR4 modules enable cost-effective scalability and expansion of memory footprints to keep pace with future requirements. Each module undergoes rigorous testing to ensure reliability and long-term endurance.
ATP unbuffered DDR4-2666 modules are available in SODIMM, UDIMM, ECC UDIMM, ECC SODIMM, and ECC mini-DIMM. Registered DIMMs (RDIMMs) are also available.
For more information, please contact ATP regional sales, distributors, or send your inquiries to Info@atpinc.com.