Industrial Grade DRAM Modules help IPC and embedded systems meet their additional requirements for further protection against vibration, temperature extremes, or other harsh environmental conditions.

ATP also provides a complete ULP and VLP Industrial Grade product line of DDR3/DDR2/DDR/SDRAM modules.

With a height of only 0.7 inches, ATP's ULP (Ultra Low Profile) memory modules surpass JEDEC's most stringent height requirements of DDR3 VLP (Very Low Profile) DIMM, which is 0.738 inches. The ATP DDR3 ULP RDIMM family is fully compliant with JEDEC's PC3-10600 specifications and is available in 1GB, 2GB, and 4GB densities.

ATP VLP and ULP DDR3/DDR2/DDR/SDRAM modules enable powerful and compact computing power within blade servers and embedded systems. The modules are designed to overcome space constraints and improve thermal performance by maximizing airflow over and through the DIMMs, thus ideal for blade servers, networking, rack-mounted telecommunications equipment and embedded computing.

ATP can deliver a variety of options including conformal coating and elevated temperature burn-in testing.