ATP at Embedded World 2022: WE BUILD WITH YOU!

    

Taipei, Taiwan (June 2022) – ATP Electronics, the global leader in specialized storage and memory solutions, will showcase its latest offerings and customizable solutions aimed at meeting unique application requirements at Embedded World 2022 at Hall 1-212 of Nuremberg Exhibition Center in Germany from June 21 to 23, 2022.

Partners and visitors can expect to see ATP’s new industrial DDR5 memory modules, NVMe solid-state drives (SSDs) with PCI Express (PCIe) Generation 4.0 x4 lanes, as well as customizable thermal and high-endurance solutions at Embedded World’s first live exhibit after two years.

DDR5, NVMe PCIe 4.0: New Generation of Speed, Reliability and Efficiency

ATP’s DDR5 memory modules are expected to deliver performance and reliability improvements over the previous generation, especially for critical computing applications. DDR5 offers twice the speed, four times the capacity, and greater power efficiency over its previous generation.

Upcoming NVMe M.2 2280 and U.2 SSDs built on over 100 layers of 3D TLC NAND will have the PCIe Gen. 4.0 interface, which doubles the PCIe 3.0 data transfer rate from 8 GT/s (giga transfers per second) per lane to 16 GT/s per lane. Using four PCIe lanes, the SSDs will operate at a maximum theoretical transfer rate of 64 GT/s, compared with 32 GT/s via PCIe 3.0. With this significant bandwidth increase, PCIe Gen. 4.0 x4 SSDs enable faster data transmission and lower latency.

WE BUILD WITH YOU: Unique Solutions for Unique Challenges

ATP is fully capable of addressing any variety of embedded/industrial usage cases through specialized configurations that support unique memory and storage requirements. To highlight this capability, ATP is exhibiting products that demonstrate the following pillars of customization.

Thermal. ATP offers customizable thermal solutions for NVMe Gen. 3 and Gen. 4 M.2 and U.2 solid-state drives (SSDs) that combine ATP-built hardware and firmware, as well as simulation and testing systems. Depending on customer and application criteria, as well as available space within host systems, ATP can offer copper foil and 4 or 8 mm fin-type heatsink to dissipate heat. The ATP Dynamic Thermal Throttling mechanism is a firmware-based mechanism that prevents extreme temperature increase by continuously detecting device temperature.

Endurance. Serial ATA (SATA) and NVMe SSDs manufactured using a new die package break 3D triple-level cell (TLC) endurance limits. A750Pi /N750Pi Series are configured as full-drive pseudo single-level cell (pSLC), achieving near-SLC levels with at least 50% higher endurance. A650Si/Sc and N650Si/Sc Series SSDs in native TLC, meanwhile, have 66% higher endurance that reaches near-MLC levels.

Likewise, the new e.MMC E750Pi/Pc Series is built with 3D TLC NAND flash but configured as pSLC to offer endurance on par with SLC, while E650Si/Sc Series in native TLC has near-MLC endurance. For customers looking for e.MMC size flexibility, ATP offers customizable package solutions in sizes such as 9 x 10 mm and 11.5 x 13 mm.

Also, watch out for high-endurance SD/micro SD Card offerings built for dashcams and digital video recorders (DVRs), offering up to 109,401 hours of continuous video recording, to be launched soon!

The following table provides a summary of key features.

 

SATA

NVMe

e.MMC

SD/microSD

Form Factor(s)

M.2 2280/2242, 2.5” & mSATA

M.2 2280

153-ball FBGA

SD/microSD Card

Endurance

Endurance on par with MLC/SLC flash

Endurance on par with MLC/SLC flash

Capacities

Native TLC

120 to 1920 GB (A650Si/Sc)

120 to 960 GB (N650Si/N650Sc)

32 to 64 GB (E650Si/Sc)

32 to 64 GB (S750Pi)

32 to 256 GB (S650Si/S650Sc)

pSLC

80 to 640 GB (A750Pi)

40 to 320 GB (N750Pi)

10 to 21 GB (E750Pi/Pc)

32 to 64 GB (S750Sc)

I-Temp Support

A750Pi/A650Si

N750Pi/N650Si

E750Pi/E650Si

S750Pi/S650Si

Power-Loss Protection

MCU-based design with Level 4
(data-in-flight) protection

Firmware-based, data-at-rest protection

Other Features

LDPC ECC & RAID support

LDPC ECC

LDPC ECC

End-to-end data path protection

SRAM Soft Error Detector and Recovery

Auto-Read Calibration (ARC), Read Retry

SED features (Optional)

 

 

 

 

Security

Also taking the spotlight in Embedded World 2022 are security solutions. Customizable SecurStor microSD Cards come with integrated features that provide data-at-rest protection, as well as a wide range of optional custom features tailored to an application’s individual requirements. SecurBoot ensures the integrity and validity of the stored system’s BIOS configuration, while SecurEncrypt protects the User Data area with hardware AES-256 XTS encryption, the highest level of hardware encryption without performance trade-off.

ATP SecurStor microSD cards are available in multi-level cell (MLC) NAND flash and are officially recommended as boot device for the Raspberry Pi OS (formerly, Raspbian).

 

For more information on these products, visit: https://www.atpinc.com/

Media Contact on the Press Release: Kelly Lin (Kellylin[at]tw.atpinc.com)

Follow ATP Electronics on LinkedIn: https://www.linkedin.com/company/atp-electronics

 

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About ATP

ATP Electronics (“ATP”) has dedicated 30 years of manufacturing excellence as the premier provider of memory and NAND flash storage products for rigorous embedded/industrial/automotive applications. As the “Global Leader in Specialized Storage and Memory Solutions,” ATP is known for its expertise in thermal and high-endurance solutions. ATP is committed to delivering add-on value, differentiation and best TCO for customers. A true manufacturer, ATP manages every stage of the manufacturing process to ensure quality and product longevity. ATP upholds the highest standards of corporate social responsibility by ensuring sustainable value for workers, the environment, and business throughout the global supply chain. For more information on ATP Electronics, please visit www.atpinc.com or contact us at info[at]atpinc.com.

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