Maximum Performance in Any Environment
ATP Industrial Grade microSD Cards is optimized for demanding enterprise mobility applications such as Point of Sales, bar coding, data collection, where mission-critical data requires the highest level of reliability, durability, and data integrity.
ATP's SIP (System-In-Packaging) manufacturing process encapsulates all exposed components and points of failure to ensure the products are fully waterproof, shockproof, and ESD (Electro-Static Discharge) proof. ATP Industrial Grade microSD Cards can withstand at least a storage temperature range of -40 to 85 degrees Celsius and an operating temperature range of -40 to 85 degrees Celsius.
In addition to this temperature range, the cards are completely waterproof, dustproof, and ESD (Electro-Static Discharge) proof. All ATP Industrial Grade microSD cards are produced under a stringent RoHs and Green Package compliant manufacturing process to guarantee a consistent high level of build quality and performance.
The ATP Industrial Grade microSD cards have been previously tested and qualified by major handheld companies such as Intermec, Motorola, Janam, LXE, Honeywell and Datalogic for Point of Sales, bar coding, data collection, radio frequency identification (RFID), and enterprise mobility applications.
The ATP Industrial Grade microSD cards are tested rigorously with Motorola in Motorola Validated PLUS (MVP) and Motorola Solutions Independent Hardware Vendor (IHV) program, ensuring interoperability between Motorola handheld devices and ATP industrial grade flash memory cards, thus also highlighting the two companies’ strong engineering partnership.
ATP Industrial microSD cards deliver outstanding performance with read speed (seq) up to 19MB/sec and write speed (seq) up to 17MB/sec
All ATP Industrial Grade CF, SD, USB drives, and SSDs are constructed using best-in-class SLC (Single-Level Cell) components with enhanced Error Correction Code (ECC) functions and wear leveling algorithms. This results in MTBF ratings over 2 million hours and the highest write cycle lifetimes in the industry. ATP's SIP (System-In-Packaging) manufacturing process encapsulates all exposed components and points of failure to ensure the products are fully waterproof, shockproof, and ESD (Electro-Static Discharge) proof.
Full Manufacturer Support and Product Consistency
Being a true manufacturer gives ATP the ability to support customers with a fixed BOM policy, ensuring both consistent compatibility and performance. ATP also fully supports its customers with product customization and tuning to optimize performance in particular or specialized applications.
| ||Endurance |
Not commonly known is issue of program/erase cycle lifetimes on NAND flash technology. The storage can only be erased and programmed to a finite number of times. Current SLC (Single Level Cell) technology is rated for at least 20 times more program/erase cycles than current MLC (Multi Level Cell) technology. In heavy erase/program applications, SLC is highly recommended to avoid pre-mature storage failure. Due to the fact that MLC is consumer/volume driven, within the next couple years MLC technology will continue to erode in program/erase cycle ability in order to have a lower cost/density. The new MLC die being used, starting 2010, is downrated from 10,000 cycles to 5,000 cycles. The upcoming 3-Bit MLC technology (a.k.a. TLC) has an exponentially lower number of program/erase cycles. SLC technology, targeting embedded and mission critical applications, will continue to maintain an emphasis on endurance and reliability.
Wide Temp IC Packaging Configurations
In order to meet the operating temperature range of -40C to 85C, only very particular flash IC and IC packaging configurations may be used. These configurations may allow for wider temp operation, but will also reflect the cost.
Production Level Burn-In
100% of all ATP Industrial Grade products go through multi-cycle, multi data pattern burn in testing. This is to screen against any possible early fallout occasionally seen in any semiconductor technology. This is compared to ATP commercial grade product which goes through a block-level functional test.
Supply Chain Stability and Fixed/Controlled BOM
MLC is above mentioned as the consumer/volume driven technology, with the main emphasis on cost/density. MLC flash generation changes and die revisions occur more frequently than SLC, with less time allowance for re-qualification With MLC, this makes it inherently difficult to support a single IC configuration over a long product life cycle as compared to SLC which typically only has a die revision change for the same density in several year time spans. With SLC technology, longer term support is possible allowing for a single BOM to be supported for several years.
Due to the lower complexity in managing SLC flash, the write performance for SLC at the IC level is typically twice as fast. With controller multiplexing this can be reduced, but this accounts for the main delta in read speed versus write speed in retail flash products today.
ATP provides in-house testing (endurance, signal integrity and protocol compatibility) and custom firmware tuning or firmware setting adjustment for enterprise level handheld and mobile devices. ATP also provides 100% failure analysis on all reported usage anomalies and inventory cross-shipments to minimize field or production down time.