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The Extended-Lifespan Industrial Grade CompactFlash Card with S.M.A.R.T. Tool, Which Helps Predict Storage Failure
By utilizing pre-screened SLC NAND flash memory and advanced Global Wear Leveling technology, the ATP Industrial Grade CompactFlash Card has enhanced endurance levels and a longer product lifespan. The ATP Industrial Grade CF card implements the StaticDataRefresh technology, which monitors the error bit levels during each read operation to ensure data integrity, and the EarlyRetirement technology prevents data loss from weak blocks.
The ATP Industrial Grade CF card has also incorporated the S.M.A.R.T. (Self-Monitoring, Analysis, and Reporting Technology) function which monitors various parameters of endurance and reliability, indicating activity that is out of the normal range. This information helps predict storage failure for preventative action.
ATP Industrial Grade CompactFlash card is an ideal fit for embedded storage applications that have space constraints and require high performance and reliability. The ATP
Industrial Grade CF card series is specifically designed for embedded applications, such as POS, kiosk, embedded, medical and automotive, where mission-critical data requires the highest level of reliability, durability, and data integrity.
- Compliant with CF specification 4.1
- Enhanced endurance by Global Wear Leveling and bad block management
- 13/24 bit BCH-ECC engines can correct up to 24 bit errors per 1,024 byte data
- Prevents data loss with StaticDataRefresh & EarlyRetirement Technology
- S.M.A.R.T. function support for lifespan monitoring
- Built-in 2.6V voltage detector for power fail detection
- Power saving mode (automatic sleep and wake-up mechanism)
ATP SMART Life Monitor
ATP SMART Life Monitor (Self-Monitoring, Analysis, and Reporting Technology) application monitors various parameters of ATP Industrial Grade CF's endurance and reliability—Remaining Life, Raw Read Error Rate, Erase Count and more—reminding you if any of them is out of the normal range. These information helps predict drive failure while there is still time to take preventive action, such as copying the data to a replacement device.
- A true manufacturer of both flash and DRAM products.
- In-house design, testing, and product tuning at both the system and component levels.
- Long term supply chain commitment.
- Custom flash designs
- Firmware customization and tuning available
Controlled Bill of Materials (BOM)
- Quality and engineering documents provided
- Long product life cycles with buffer inventory support and advance PCN/EOL
100% Tested for Reliability and Consistency
- Extended and industrial temperature testing
- Environmental testing
- Application testing
| ||Endurance |
Not commonly known is issue of program/erase cycle lifetimes on NAND flash technology. The storage can only be erased and programmed to a finite number of times. Current SLC (Single Level Cell) technology is rated for at least 20 times more program/erase cycles than current MLC (Multi Level Cell) technology. In heavy erase/program applications, SLC is highly recommended to avoid pre-mature storage failure. Due to the fact that MLC is consumer/volume driven, within the next couple years MLC technology will continue to erode in program/erase cycle ability in order to have a lower cost/density. The new MLC die being used, starting 2010, is downrated from 10,000 cycles to 5,000 cycles. The upcoming 3-Bit MLC technology (a.k.a. TLC) has an exponentially lower number of program/erase cycles. SLC technology, targeting embedded and mission critical applications, will continue to maintain an emphasis on endurance and reliability.
Wide Temp IC Packaging Configurations
In order to meet the operating temperature range of -40C to 85C, only very particular flash IC and IC packaging configurations may be used. These configurations may allow for wider temp operation, but will also reflect the cost.
Production Level Burn-In
100% of all ATP Industrial Grade products go through multi-cycle, multi data pattern burn in testing. This is to screen against any possible early fallout occasionally seen in any semiconductor technology. This is compared to ATP commercial grade product which goes through a block-level functional test.
Supply Chain Stability and Fixed/Controlled BOM
MLC is above mentioned as the consumer/volume driven technology, with the main emphasis on cost/density. MLC flash generation changes and die revisions occur more frequently than SLC, with less time allowance for re-qualification With MLC, this makes it inherently difficult to support a single IC configuration over a long product life cycle as compared to SLC which typically only has a die revision change for the same density in several year time spans. With SLC technology, longer term support is possible allowing for a single BOM to be supported for several years.
Due to the lower complexity in managing SLC flash, the write performance for SLC at the IC level is typically twice as fast. With controller multiplexing this can be reduced, but this accounts for the main delta in read speed versus write speed in retail flash products today.
ATP provides in-house testing (endurance, signal integrity and protocol compatibility) and custom firmware tuning or firmware setting adjustment for enterprise level handheld and mobile devices. ATP also provides 100% failure analysis on all reported usage anomalies and inventory cross-shipments to minimize field or production down time.