The ATP SlimSATA with PowerProtector guarantees reliable controller and lasting NAND flash operations with a backup power circuit during a power failure. The standalone design of PowerProtector ensures a sufficient amount of reserve power for any abnormalities such as unstable voltages and power outages.
PowerProtector’s patent pending technology allows the ATP SlimSATA Industrial Grade Embedded Module to intelligently manage critical active components which ensures data integrity, increased productivity, and an overall decreased cost of ownership. PowerProtector is designed to combat the technical limitations offered by existing power failure protection solutions. Unlike SuperCap, the most common power failure backup solution on the market, PowerProtector offers a stand alone hardware design that does not require specific controllers or customized firmware.
The ATP PowerProtector’s leaner requirements for board footprint also allows for support in smaller form factors such as SlimSATA. The solid state capacitor found in PowerProtector is a critical component that allows it to surpass the natural limitations of SuperCap designs which are sensitive to temperature change and have a tendency of losing capacitance and functionality at extreme temperatures, especially in industrial environments.
With its small size and ratified JEDEC standard, MO-297A ATP Slim SATA Embedded Module is an ideal fit for embedded solid state storage applications. The compact design of the Slim SATA solution makes the module the ideal structure for SSD solutions that have space constraints and require high performance and reliability.
ATP Slim SATA Industrial Grade Embedded Module adheres to the JEDEC standard, as well as CE, FCC and RoHS industry compliance and regulatory standards. The small size and high density of the Slim SATA makes the module an ideal alternative to the 2.5 Inch HDD/SSD for operating system drive.
The ATP SlimSATA Industrial Grade Embedded Module offers an alternative solution for space constrained embedded applications such as IPC, Blades, Advanced TCA, Networking hosts, POS machines, and enhances the capability, performance and reliability of different applications.
Featuring a native 3Gb/s industry standard SATA interface and SLC NAND flash componets, ATP Slim SATA Embedded Module offers ultra-fast read performance of up to 115.6 MB/s and write performance of up to 101.9 MB/s.
ATP addresses the market needs of smaller and more efficient memory modules which provide the same performance and reliability of larger alternatives. The Slim SATA Module, with its compact design and superior performance capability, is the ultimate solution for embedded solid state storage applications requiring optimal operating capabilities.
ATP Slim SATA Industrial Grade Embedded Modules support key flash management features including global wear-leveling, error checking and correction as well as drive monitoring (S.M.A.R.T.), providing our clients with the high reliability and endurance.
Adheres to the JEDEC mechanical specification MO-297A
Compliant with Serial ATA Revision 2.6
Compatible with SATA 1.5Gbps and SATA 3.0Gbps transfer rates
Supports PIO mode 0~4, MDMA mode 0~2, UDMA mode 0~6
Enhanced endurance by Global Wear-Leveling
Supports 48bit LBA addressing with larger max transfer size
Supports S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) ATA feature set
Built-in power failure data protection technology (PowerProtector)
Onboard firmware status LED
RoHS compliant and CE, FCC certification
| ||Endurance |
Not commonly known is issue of program/erase cycle lifetimes on NAND flash technology. The storage can only be erased and programmed to a finite number of times. Current SLC (Single Level Cell) technology is rated for at least 20 times more program/erase cycles than current MLC (Multi Level Cell) technology. In heavy erase/program applications, SLC is highly recommended to avoid pre-mature storage failure. Due to the fact that MLC is consumer/volume driven, within the next couple years MLC technology will continue to erode in program/erase cycle ability in order to have a lower cost/density. The new MLC die being used, starting 2010, is downrated from 10,000 cycles to 5,000 cycles.
Wide Temp IC Packaging Configurations
In order to meet the operating temperature range of -40C to 85C, only very particular flash IC and IC packaging configurations may be used. These configurations may allow for wider temp operation, but will also reflect the cost.
Production Level Burn-In
100% of all ATP Industrial Grade products go through multi-cycle, multi data pattern burn in testing. This is to screen against any possible early fallout occasionally seen in any semiconductor technology.
Supply Chain Stability and Fixed/Controlled BOM
MLC is above mentioned as the consumer/volume driven technology, with the main emphasis on cost/density. MLC flash generation changes and die revisions occur more frequently than SLC, with less time allowance for re-qualification With MLC, this makes it inherently difficult to support a single IC configuration over a long product life cycle as compared to SLC which typically only has a die revision change for the same density in several year time spans. With SLC technology, longer term support is possible allowing for a single BOM to be supported for several years.
Due to the lower complexity in managing SLC flash, the write performance for SLC at the IC level is typically twice as fast. With controller multiplexing this can be reduced, but this accounts for the main delta in read speed versus write speed in retail flash products today.
ATP also provides in-house testing (endurance, signal integrity and protocol compatibility) and custom firmware tuning or firmware setting adjustment. ATP also provides 100% failure analysis on all reported usage anomalies and inventory cross-shipments to minimize field or production down time.