With its compact size, high performance and conformity with JEDEC standard MO-300A, the mSATA Industrial Grade Embedded Module with PowerProtector is ideal for mission-critical embedded storage applications that have space constraints and require high performance and reliability.
mSATA design is based on JEDEC standard MO-300A with the ubiquitous SATA-II, 3Gbps interface. Measuring only 2.0 x 1.2 inches (51 x 30 mm) mSATA SSDs are extremely compact and lightweight. ATP mSATA Industrial Grade Embedded Module uses an existing mini PCIe connector with a modified SATA pinout.
The ATP Industrial Grade mSATA Embedded Module offers an alternative solution for space constrained embedded applications such as IPC, automation, Blades, AdvancedTCA, PC/104, Networking, digital signages, rugged notebook, and enhances the capability, performance and reliability of all the aforementioned mission critical applications.
The ATP mSATA Industrial Grade Embedded Module with PowerProtector guarantees reliable controller and lasting NAND flash operations with a backup power circuit during a power failure. The standalone design of PowerProtector ensures a sufficient amount of reserve power for any abnormalities such as unstable voltages and power outages.
To provide further data integrity, ATP PowerProtector technology allows the ATP mSATA to intelligently manage read and write process, under a sudden power failure, beating the technical limitations offered by existing power failure protection solutions. Unlike SuperCap, the most common power failure backup solution on the market, PowerProtector offers a standalone hardware design that does not require specific controllers or customized firmware, as the SuperCap designs are sensitive to temperature change and have a tendency of losing capacitance and functionality at extreme temperatures, especially in industrial environments. The ATP PowerProtector’s leaner requirements for board footprint allows for support in smaller form factors such as mSATA.
Featuring a native 3Gb/s industry standard SATA interface and SLC NAND flash components, ATP mSATA Industrial Grade Embedded Module offers ultra-fast read performance of up to 260 MB/s and write performance of up to 220 MB/s. ATP mSATA Industrial Grade Embedded Modules support key flash management features including global wear leveling, error checking and correction as well as drive monitoring (S.M.A.R.T.), providing our clients with the high reliability and endurance.
- Adheres to the JEDEC mechanical specification MO-300A
- Compliant with Serial ATA Revision 2.6
- Ultimate solution for small form factor embedded and industrial applications, such as rugged notebook, IPC, automation, or digital signage.
- Compatible with SATA 1.5Gbps and SATA 3.0Gbps transfer rates
- Supports PIO mode 0~4, MDMA mode 0~2, UDMA mode 0~6
- Enhanced endurance by Global Wear Leveling
- Support TRIM command (Windows 7 and up, latest Linux Kernel), Off-line TRIM utility available for Windows XP/2000/2003/Vista
- Supports S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) ATA feature set
- SecureErase for secure data erasing
- Built-in power failure data protection technology (PowerProtector)
- RoHS compliant and CE, FCC certification
| ||Endurance |
Not commonly known is the issue of program/erase cycle lifetimes on NAND flash technology. The storage can only be erased and programmed to a finite number of times. Current SLC (Single Level Cell) technology is rated for at least 20 times more program/erase cycles than current MLC (Multi Level Cell) technology. In heavy erase/program applications, SLC is highly recommended to avoid pre-mature storage failure. Due to the fact that MLC is consumer/volume driven, within the next couple years MLC technology will continue to erode in program/erase cycle ability in order to have a lower cost/density. The new MLC die being used, starting 2010, is downrated from 10,000 cycles to 5,000 cycles.
Wide Temp IC Packaging Configurations
In order to meet the operating temperature range of -40C to 85C, only very particular flash IC and IC packaging configurations may be used. These configurations may allow for wider temp operation, but will also reflect the cost.
Production Level Burn-In
100% of all ATP Industrial Grade products go through multi-cycle, multi data pattern burn in testing. This is to screen against any possible early fallout occasionally seen in any semiconductor technology.
Supply Chain Stability and Fixed/Controlled BOM
MLC is above mentioned as the consumer/volume driven technology, with the main emphasis on cost/density. MLC flash generation changes and die revisions occur more frequently than SLC, with less time allowance for re-qualification With MLC, this makes it inherently difficult to support a single IC configuration over a long product life cycle as compared to SLC which typically only has a die revision change for the same density in several year time spans. With SLC technology, longer term support is possible allowing for a single BOM to be supported for several years.
Due to the lower complexity in managing SLC flash, the write performance for SLC at the IC level is typically twice as fast. With controller multiplexing this can be reduced, but this accounts for the main delta in read speed versus write speed in retail flash products today.
ATP also provides in-house testing (endurance, signal integrity and protocol compatibility) and custom firmware tuning or firmware setting adjustment. ATP also provides 100% failure analysis on all reported usage anomalies and inventory cross-shipments to minimize field or production down time.