The horizontal SATA embedded module provides ultra-fast performance by utilizing SATA interface with read speed: 61MB/Sec and write speed: 54MB/Sec.
It’s designed for enterprise and industrial applications that require high read/write performance in a small form factor. The module (extended temperature version) utilizes industrial grade temperature SLC (Single-Level Cell) NAND flash providing extended operating temperature range of -40°C to +85°C (available soon) and a significant longer life span than regular MLC (Multi-Level Cell).
- Power consumption on idle mode is 0.65W and 1.25W on operational mode
- Compliant with Serial ATA Revision 2.6
- Supports PIO mode 0~4, MDMA mode 0~2,UDMA mode 0~6
- Compatible with SATA 1.5Gbps and SATA 3.0Gbps transfer rates
- Enhanced endurance by Global wear-leveling
- Supports S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) ATA feature set
- SMART tool for Windows 2000/XP/Vista/7 and Linux
- Supports TRIM command
- Data integrity under power-cycling
Special S.M.A.R.T. Tool
ATP’s S.M.A.R.T. (Self-Monitoring, Analysis, and Reporting Technology) tool monitors various parameters of ATP Embedded Module's endurance and reliability—Remaining Life, Raw Read Error Rate, Erase Count and more—reminding you if any of them is out of the normal range. These information helps predict drive failure while there is still time to take preventive action, such as copying the data to a replacement device.
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Not commonly known is issue of program/erase cycle lifetimes on NAND flash technology. The storage can only be erased and programmed to a finite number of times. Current SLC (Single Level Cell) technology is rated for at least 20 times more program/erase cycles than current MLC (Multi Level Cell) technology. In heavy erase/program applications, SLC is highly recommended to avoid pre-mature storage failure. Due to the fact that MLC is consumer/volume driven, within the next couple years MLC technology will continue to erode in program/erase cycle ability in order to have a lower cost/density. The new MLC die being used, starting 2010, is downrated from 10,000 cycles to 5,000 cycles.
Wide Temp IC Packaging Configurations
In order to meet the operating temperature range of -40C to 85C, only very particular flash IC and IC packaging configurations may be used. These configurations may allow for wider temp operation, but will also reflect the cost.
Production Level Burn-In
100% of all ATP Industrial Grade products go through multi-cycle, multi data pattern burn in testing. This is to screen against any possible early fallout occasionally seen in any semiconductor technology.
Supply Chain Stability and Fixed/Controlled BOM
MLC is above mentioned as the consumer/volume driven technology, with the main emphasis on cost/density. MLC flash generation changes and die revisions occur more frequently than SLC, with less time allowance for re-qualification With MLC, this makes it inherently difficult to support a single IC configuration over a long product life cycle as compared to SLC which typically only has a die revision change for the same density in several year time spans. With SLC technology, longer term support is possible allowing for a single BOM to be supported for several years.
Due to the lower complexity in managing SLC flash, the write performance for SLC at the IC level is typically twice as fast. With controller multiplexing this can be reduced, but this accounts for the main delta in read speed versus write speed in retail flash products today.
ATP also provides in-house testing (endurance, signal integrity and protocol compatibility) and custom firmware tuning or firmware setting adjustment. ATP also provides 100% failure analysis on all reported usage anomalies and inventory cross-shipments to minimize field or production down time.