PCIe® NVMe M.2 Type 1620 HSBGA SSD

特点介绍

  • pSLC 模式具有 2 倍至 3 倍的持续性能*
  • 通过优化的热节流固件/散热片(HSBGA)实现高/稳定的性能
  • 优化功耗: 4 5 mW(电源状态4)
  • 无 DRAM 配置,支持主机内存缓冲区 (HMB)*
  • 提供可选的安全功能*
* 可根据项目进行定制

描述

采用 PCI Express(PCIe)接口并支持第 3 与第 4 代,ATP NVMe M.2 Type 1620 散热球栅阵列(HSBGA)SSD 可满足在空间、电源与安全等关键环境中的超高便携性与高可靠性需求。为克服狭小空间、发热、功耗限制与数据威胁,采用焊接式设计以增强抗振动与抗冲击能力,而小巧的占板面积将空间占用降至最低;若偏好可拆卸且可现场更换的设计,ATP 可将 HSBGA 以相同固件与 NAND 配置集成到 M.2 2230 模组。

ATP NVMe M.2 HSBGA SSD 采用 Ace Thermal Throttling(AceTT)技术,提供多达 18 个精细调校、循序渐进的热节流阶段。配置 Gen4 x2 通道的 HSBGA SSD 具备高能效,在典型运行期间可节省 20% 功耗,空闲时可节省 40%。为确保数据免遭恶意访问,部分 ATP M.2 SSD 内建自加密硬盘(SED)功能,例如高级 AES 256 位加密、硬件写保护、硬件安全擦除、安全启动,以及可选 TCG Opal 2.0。

规格最近更新: 2025-09-12 16:18

PCIe® Gen 3 NVMe M.2 Type 1620 HSBGA SSD
产品线PremiumSuperiorPremiumSuperior
产品名称N701Pi / N701PcN601Si 3N700Pi / N700PcN600Si / N600Sc
接口PCIe G4 x 2 1PCIe G4 x2 1PCIe G3 x4PCIe G3 x4
闪存类型3D TLC (pSLC mode) 3D TLC 3D TLC (pSLC mode)3D TLC
闪存类型291-Ball, HSBGA291-Ball, HSBGA291-Ball, HSBGA291-Ball, HSBGA
工作温度 (Tcase)1-40°C to 85°C / 0°C to 70°C-40°C to 85°C / 0°C to 70°C-40°C to 85°C / 0°C to 70°C-40°C to 85°C / 0°C to 70°C
功耗保护 選項Firmware BasedFirmware BasedFirmware BasedFirmware Based
自加密驱动器 選項AES 256-bit Encryption, TCG Opal 2.0 AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0-
容量80 GB to 320 GB240 GB to 960 GB40 GB to 160 GB120 GB to 480 GB
顺序读取速度 (MB/s) 高达3,5653,5602,0002,050
顺序写入速度 (MB/s) 高达3,2803,2801,6001,550
随机读取 IOPS 高达630,000630,000135,600138,000
随机写入 IOPS 高达755,000755,000112,000112,600
耐久力 (TBW)2 高达29,235 TB2,810 TB4,280 TB768 TB
可靠性 MTBF @ 25°C>3,000,000 hours>3,000,000 hours>2,000,000 hours>2,000,000 hours
尺寸 (mm)16.0 x 20.0 x 1.616.0 x 20.0 x 1.616.0 x 20.0 x 1.616.0 x 20.0 x 1.6
认证RoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACH
保固1 year1 year1 year1 year
1 外壳温度,SMART温度属性指示的复合温度。
2 在最高顺序写入值下。可能因密度、配置和应用而异。
 

订购信息

 

Featured SKUs
Product Line Capacity1 Operating Temperature2 Power Loss Protection3 SED4 P/N
1 Amount of actual usable storage that can be utilized.
2 Refers to Case Temperature range during device operation, as indicated by SMART temperature attributes.
3 Hardware + Firmware-based power loss protection design with Level 4 (data-in-flight) protection; Firmware-based power loss protection design with Level 1 (data-at-rest) protection.
4 Allows data written to and read from the SSD to be constantly and automatically encrypted and decrypted. Conforms to TCG Opal 2.0 and uses AES 256-bit HW encryption.

Latest update as of 2025/09/12 ; the part number list is subject to change without notice.
N601Si
240 GB
-40°C to 85°C
Firmware Based
-
FT240GBG4PDUBFI
480 GB FT480GBG4PDUBFI
960 GB FT960GBG4PDUBFI
240 GB
-40°C to 85°C
v
FT240GBG4PDUBYI
480 GB FT480GBG4PDUBYI
960 GB FT960GBG4PDUBYI
N601Sc
240 GB
0°C to 70°C
Firmware Based
-
FT240GBG4PDUBFC
480 GB FT480GBG4PDUBFC
960 GB FT960GBG4PDUBFC
240 GB
v
FT240GBG4PDUBYC
480 GB FT480GBG4PDUBYC
960 GB FT960GBG4PDUBYC

技术详阅所有技术

技术及附加服务产品线
PremiumSuperior
S.M.A.R.T.
S.M.A.R.T.
available
available
Ace Thermal Throttling
Ace Thermal Throttling
customizable
工业温度
工业温度
available
available
SiP (系统封装)
SiP (系统封装)
available
available
防震BGA封装
防震BGA封装
available
available
基于固件的静态数据功耗保护
基于固件的静态数据功耗保护
available
available
高级磨损平衡
高级磨损平衡
available
available
自动刷新
自动刷新
available
available
动态数据刷新
动态数据刷新
available
available
自动读取校准
自动读取校准
available
customizable
端到端数据保护
端到端数据保护
available
available
SED (AES 256-bit Encryption, TCG  Opal 2.0)
SED (AES 256-bit Encryption, TCG Opal 2.0)
available
customizable
软件安全擦除
软件安全擦除
available
available
Hardware Secure Erase
Hardware Secure Erase
customizable
Hardware Write Protect
Hardware Write Protect
customizable
Thermal Management Solutions
Thermal Management Solutions
customizable
customizable
抗硫电阻器
抗硫电阻器
customizable
保形涂层
保形涂层
customizable
Content Preload
Content Preload
customizable
customizable
联合验证和测试
联合验证和测试
customizable
customizable
customizable:项目定制化选项

下载中心

  • ATP Gen4 M.2 1620 HSBGA _ 2230 SSD product flyer
    English
    2025-09-112.69MB
  • ATP NVMe HSBGA product flyer
    English
    2025-03-28248.63KB
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