e.MMC Automotive

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特点介绍

  • 符合 AEC-Q100 Grade 2（-40°C 至 105°C）和 Grade 3（-40°C 至 85°C）标准*
  • 强大的数据完整性*（自动刷新和动态数据刷新）
  • 超高耐用性：比标准 e.MMC 高 2-3 倍*
  • 更小的封装尺寸*
  • 符合 JEDEC e.MMC v5.1 标准 （JESD84-B51）
  • 153 焊球 FBGA（符合 RoHS 标准，“绿色封装”）
  • LDPC ECC 引擎*
* 可能因产品和项目支持而异
描述规格技术相关资源下载中心
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描述

ATP Electronics 以汽车级 e.MMC 解决方案全面加速前进。采用板上焊接设计，这些方案专为道路环境中的高可靠性而打造。在车辆常见的严苛且不可预期工况下，例如强烈冲击与震动、温度变化以及受限空间，它们依然能够稳定、持续地提供一致的性能。车载信息娱乐系统、先进驾驶辅助系统（ADAS）、车载远程信息处理以及其他汽车应用，将从其超高耐久性中获益良多，其耐久度较标准 e.MMC 提升约 2–3 倍。

ATP e.MMC符合最新的JEDEC e.MMC 5.1标准（JESD84-B51），支持命令队列(Command Queuing)和缓存屏障(Cache Barrier)功能以增强随机读/写性能。支持高速400（HS400）DDR模式，带宽高达400 MB / s。支持现场固件更新功能（FFU）。 缓存刷新报告(Cache Flushing Report)确保缓存块上的数据完整性。HS400模式下的增强选通(Enhanced Strobe)功能有助于加快主机和e.MMC设备之间的同步效率。 同时，安全写保护(Secure Write Protection)功能确保只有受信任的主机才能对e.MMC设备进行写保护或取消写保护。

ATP e.MMC兼容以前的旧版本（v4.41 / v4.5 / v5.0），支持断电通知(power-off notifications)，Packed Commands，缓存(Cache)，Boot以及RPMB分区、HPI和HW reset功能。

规格最近更新: 2025-05-12 17:03

e.MMC
产品型号汽车 2 级Automotive Grade 2汽车 2 级Automotive Grade 2汽车 3 级Automotive Grade 3汽车 3 级Automotive Grade 3
产品线卓越Premium优良Superior卓越Premium优良Superior
产品名称E700PaaE700PaaE600SaaE600SaaE700PiaE700PiaE600SiaE600Sia
闪存类型3D MLC (pSLC mode)2D MLC (pSLC mode)3D MLC2D MLC3D MLC (pSLC mode)2D MLC (pSLC mode)3D MLC2D MLC
IC 封装形式153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA
JEDEC 规格v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400
功耗保护 選項Firmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware Based
工作温度 (Tcase)1-40°C to 105°C-40°C to 105°C-40°C to 105°C-40°C to 105°C-40°C to 85°C-40°C to 85°C-40°C to 85°C-40°C to 85°C
容量*8 GB to 64 GB4 GB to 8 GB16 GB to 128 GB8 GB to 16 GB8 GB to 64 GB4 GB to 8 GB16 GB to 128 GB8 GB to 16 GB
顺序读写速度 (MB/s)** 高达300 / 240230 / 100300 / 170230 / 100300 / 240230 / 100300 / 170230 / 100
总线速度模式x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8
ICC (典型 RMS 进行读取和写入) mA 高达145 / 17585 / 65125 / 17585 / 50145 / 17585 / 65125 / 17585 / 50
ICCQ (典型 RMS 进行读取和写入) mA 高达120 / 10060 / 45115 / 9560 / 30110 / 9560 / 45115 / 9560 / 30
耐久力 (TBW)** 高达1,213 TB200 TB309 TB40 TB1,320 TB200 TB824 TB40 TB
可靠性 MTBF @ 25°C>2,000,000 运行小时>3,000,000 hours>2,000,000 运行小时>3,000,000 hours>2,000,000 运行小时>3,000,000 hours>2,000,000 运行小时>3,000,000 hours
尺寸 (mm)11.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.0
认证AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH
保固1 yearOne Year1 yearOne Year1 yearOne Year1 yearOne Year

* 低密度奇偶校验纠错码。由产品支持。
** 所有性能都是使用ATP专用测试环境收集或测量的，无需文件系统开销。

技术详阅所有技术

技术及附加服务产品线
PremiumSuperior
寿命监视器
寿命监视器
available
available
工业温度
工业温度
available
available
SiP (系统封装)
SiP (系统封装)
available
available
防震BGA封装
防震BGA封装
available
available
基于固件的静态数据功耗保护
基于固件的静态数据功耗保护
available
available
高级磨损平衡
高级磨损平衡
available
available
自动刷新
自动刷新
available
available
动态数据刷新
动态数据刷新
available
available
自动读取校准
自动读取校准
customizable
customizable
端到端数据保护
端到端数据保护
available
available
Content Preload
Content Preload
customizable
customizable
联合验证和测试
联合验证和测试
customizable
customizable
customizable:项目定制化选项

相关资源

No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations. 

Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.

 

Ensuring Product Traceability

Laser imprints important information to identify each piece for accurate tracking and efficient inventory management.

Rapid Diagnostic Test (RDT)

RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects.

ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.

 

Automated Final Screening

A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.

Protective Packaging

Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.

 

ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.

Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements. 

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  • ATP eMMC Automotive product flyer
    English
    2025-03-28223.68KB
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