e.MMC Automotive

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特点介绍

  • AEC-Q100 Grade 2 (-40°C to 105°C), and Grade 3 (-40°C to 85°C) compliant*
  • Robust Data Integrity* (AutoRefresh and Dynamic Data Refresh)
  • Extra-high endurance: 2-3X higher than standard e.MMC*
  • Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
  • 153-ball FBGA (RoHS compliant, "green package")
  • LDPC ECC engine*
* May vary by product and project support
描述规格技术相关资源下载中心
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描述

ATP Electronics shifts into high gear with automotive grade e.MMC solutions.These soldered-down solutions are constructed for maximum reliability on the road. They deliver consistent, stable performance amidst the challenging and unpredictable conditions that vehicles are commonly subjected to, such as intense shocks and vibrations, temperature variability, and constricted spaces.Infotainment systems, advanced driver assistance system (ADAS), telematics, and other automotive applications will benefit greatly from the extra-high endurance, which is 2-3X higher than standard e.MMC.

The automotive grade e.MMC solutions are compliant with AEC-Q100 and are available in two temperature grades for peace-of-mind journeys, whether in sub-zero winters or in scorching summers. Automotive Grade 3 (AG3) typically covers an operating range of -40°C to 85°C), while Automotive Grade 2 (AG2) offers an extended range for even more extreme conditions with elevated temperatures, from -40°C to 105°C.

ATP’s automotive grade e.MMC solutions incorporate low-density parity-check error correction codes (LDPC ECC) to maintain data accuracy over their rated lifespan and beyond. AutoRefresh and Dynamic Data Refresh technologies prevent read disturb errors in often-accessed (hot zone) areas as well as seldom-accessed areas (cold zone).

规格最近更新: 2025-05-12 17:03

e.MMC
产品型号汽车 2 级Automotive Grade 2汽车 2 级Automotive Grade 2汽车 3 级Automotive Grade 3汽车 3 级Automotive Grade 3
产品线卓越Premium优良Superior卓越Premium优良Superior
产品名称E700PaaE700PaaE600SaaE600SaaE700PiaE700PiaE600SiaE600Sia
闪存类型3D MLC (pSLC mode)2D MLC (pSLC mode)3D MLC2D MLC3D MLC (pSLC mode)2D MLC (pSLC mode)3D MLC2D MLC
IC 封装形式153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA
JEDEC 规格v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400
功耗保护 選項Firmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware Based
工作温度 (Tcase)1-40°C to 105°C-40°C to 105°C-40°C to 105°C-40°C to 105°C-40°C to 85°C-40°C to 85°C-40°C to 85°C-40°C to 85°C
容量*8 GB to 64 GB4 GB to 8 GB16 GB to 128 GB8 GB to 16 GB8 GB to 64 GB4 GB to 8 GB16 GB to 128 GB8 GB to 16 GB
顺序读写速度 (MB/s)** 高达300 / 240230 / 100300 / 170230 / 100300 / 240230 / 100300 / 170230 / 100
总线速度模式x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8
ICC (典型 RMS 进行读取和写入) mA 高达145 / 17585 / 65125 / 17585 / 50145 / 17585 / 65125 / 17585 / 50
ICCQ (典型 RMS 进行读取和写入) mA 高达120 / 10060 / 45115 / 9560 / 30110 / 9560 / 45115 / 9560 / 30
耐久力 (TBW)** 高达1,213 TB200 TB309 TB40 TB1,320 TB200 TB824 TB40 TB
可靠性 MTBF @ 25°C>2,000,000 运行小时>3,000,000 hours>2,000,000 运行小时>3,000,000 hours>2,000,000 运行小时>3,000,000 hours>2,000,000 运行小时>3,000,000 hours
尺寸 (mm)11.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.311.5 x 13.0 x 1.0
认证AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH AEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACH
保固1 yearOne Year1 yearOne Year1 yearOne Year1 yearOne Year

* 低密度奇偶校验纠错码。由产品支持。
** 所有性能都是使用ATP专用测试环境收集或测量的，无需文件系统开销。

技术详阅所有技术

技术及附加服务产品线
PremiumSuperior
寿命监视器
寿命监视器
available
available
工业温度
工业温度
available
available
SiP (系统封装)
SiP (系统封装)
available
available
防震BGA封装
防震BGA封装
available
available
基于固件的静态数据功耗保护
基于固件的静态数据功耗保护
available
available
高级磨损平衡
高级磨损平衡
available
available
自动刷新
自动刷新
available
available
动态数据刷新
动态数据刷新
available
available
自动读取校准
自动读取校准
customizable
customizable
端到端数据保护
端到端数据保护
available
available
Content Preload
Content Preload
customizable
customizable
联合验证和测试
联合验证和测试
customizable
customizable
customizable:项目定制化选项

相关资源

No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations. 

Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.

 

Ensuring Product Traceability

Laser imprints important information to identify each piece for accurate tracking and efficient inventory management.

Rapid Diagnostic Test (RDT)

RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects.

ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.

 

Automated Final Screening

A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.

Protective Packaging

Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.

 

ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.

Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements. 

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  • ATP eMMC Automotive product flyer
    English
    2025-03-28223.68KB
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