e.MMC Industrial

特点介绍

  • 符合JEDEC e.MMC v5.1标准(JESD84-B51)
  • 153球FBGA(符合RoHS标准,“绿色包装”)
  • 工业级工作温度范围 -40°C至85°C
  • 支持LDPC ECC校验*根据具体产品支持
  • 采用3D NAND闪存
  • 容量:8 GB到128 GB
  • 支持SRAM软错误检测
  • 采用自动刷新数据和动态数据刷新的机制以防止闪存的读取干扰
  • 超高数据耐久性:比标准e.MMC高2-3倍

描述

ATP工业级e.MMC是一种先进的存储解决方案。在一颗卡片中封装集成了NAND闪存、复杂的闪存控制器和快速多媒体卡(MMC)接口。 通过将这些组件集成到一个封装结构中,ATP e.MMC在内部管理所有后台操作,使主机免于处理低级的闪存操作,从而实现更快、更高效的处理。

ATP e.MMC比典型的邮票还要小,采用153球的FBGA封装方式。 微小的占位面积使其非常适合有空间限制,但又要在恶劣环境中使用,需要坚固的耐用性、可靠性和耐久性的嵌入式系统。

ATP e.MMC旨在满足工业应用的苛刻要求。 作为焊接解决方案,它可以防止系统持续振动的影响。其工业温度等级意味着产品能够承受从严寒的-40°C到酷热的85°C的宽广范围内的温度变化,在这个温度范围内,设备或存储其中的数据都不会受到不利影响。

ATP e.MMC符合最新的JEDEC e.MMC 5.1标准(JESD84-B51),支持命令队列(Command Queuing)和缓存屏障(Cache Barrier)功能以增强随机读/写性能。支持高速400(HS400)DDR模式,带宽高达400 MB / s。支持现场固件更新功能(FFU)。 缓存刷新报告(Cache Flushing Report)确保缓存块上的数据完整性。HS400模式下的增强选通(Enhanced Strobe)功能有助于加快主机和e.MMC设备之间的同步效率。 同时,安全写保护(Secure Write Protection)功能确保只有受信任的主机才能对e.MMC设备进行写保护或取消写保护。

ATP e.MMC兼容以前的旧版本(v4.41 / v4.5 / v5.0),支持断电通知(power-off notifications),Packed Commands,缓存(Cache),Boot以及RPMB分区、HPI和HW reset功能。

规格最近更新: 2025-03-31 11:07

e.MMC Industrial
Product NameExtended Industrial GradeExtended Industrial Grade Extended Industrial Grade Extended Industrial Grade Industrial Grade Industrial Grade Industrial Grade Industrial Grade Industrial Grade Industrial Grade Industrial Grade Commercial Grade Commercial Grade Commercial Grade Commercial Grade Commercial GradeCommercial Grade
Product LinePremiumPremiumSuperiorSuperiorPremiumPremiumPremium Superior Superior Superior Value PremiumPremiumSuperiorSuperiorValueValue
NamingE700PaE700PaE600Sa E600SaE700PiE700PiE700PiE600SiE600Si E600SiE600Vi E700Pc E700PcE600Sc E600ScE600VcE600Vc
Flash Type3D MLC (pSLC mode)2D MLC (pSLC mode) 3D MLC 2D MLC 3D TLC (pSLC mode) 3D MLC (pSLC mode) 2D MLC (pSLC mode) 3D TLC 3D MLC 2D MLC 3D TLC 3D TLC (pSLC mode) 2D MLC (pSLC mode) 3D TLC 2D MLC 3D TLC3D TLC
IC Package153-ball FBGA153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA 153-ball FBGA153-ball FBGA
JEDEC Specificationv5.1, HS400v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400 v5.1, HS400v5.1, HS400
Power Loss Protection OptionsFirmware BasedFirmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware Based Firmware BasedFirmware Based
Operating Temperature-40°C to 105°C-40°C to 105°C -40°C to 105°C -40°C to 105°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -25°C to 85°C -25°C to 85°C -25°C to 85°C -25°C to 85°C -25°C to 85°C-25°C to 85°C
Capacity18 GB to 64 GB4 GB to 8 GB 16 GB to 128 GB 8 GB to 16 GB 10 GB to 40 GB 8 GB to 64 GB 4 GB to 8 GB 32 GB to 128 GB 16 GB to 128 GB 8 GB to 16 GB 32 GB to 64 GB 10 GB to 40 GB 4 GB to 8 GB 32 GB to 128 GB 8 GB to 16 GB 32 GB to 64 GB64 GB to 128 GB
Sequential Read/ Write up to (MB/s) (Max.)2300 / 240230 / 100 300 / 170 230 / 100 290 / 225 300 / 240 230 / 100 290 / 225 300 / 170 230 / 100 290 / 225 290 / 225 230 / 100 290 / 225 230 / 100 290 / 225290/220
Bus Speed Modesx1 / x4 / x8x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8 x1 / x4 / x8x1 / x4 / x8
ICC (Typical RMS in Read/Write) mA (Max.)145 / 17585 / 65 125 / 175 85 / 50 100 / 110 145 / 175 85 / 65 100 / 110 125 / 175 85 / 50 100 / 110 100 / 110 85 / 65 100 / 110 85 / 50 100 / 110105/80 3
ICCQ (Typical RMS in Read/Write) mA (Max.)120 / 10060 / 45 115 / 95 60 / 30 105 / 100 120 / 100 60 / 45 105 / 100 110 / 100 60 / 30 105 / 100 105 / 100 60 / 45 105 / 100 60 / 30 105 / 100115 / 95 3
Endurance TBW2 (Max.)1,213 TB200 TB 824 TB 40 TB 1,364 TB 1,213 TB 200 TB 52 TB 824 TB 40 TB 20 TB 1,364 TB 200 TB 52 TB 40 TB 20 TB24 TB
Reliability MTBF @ 25°C>2,000,000 hours>3,000,000 hours >2,000,000 hours >3,000,000 hours >2,000,000 hours >2,000,000 hours >3,000,000 hours >2,000,000 hours >2,000,000 hours >3,000,000 hours >2,000,000 hours >2,000,000 hours >3,000,000 hours >2,000,000 hours >3,000,000 hours >2,000,000 hours>3,000,000 hours
Dimensions (mm)11.5 x 13.0 x 1.311.5 x 13.0 x 1.0 11.5 x 13.0 x 1.3 11.5 x 13.0 x 1.0 11.5 x 13.0 x 1.0 11.5 x 13.0 x 1.3 11.5 x 13.0 x 1.0 11.5 x 13.0 x 1.0 11.5 x 13.0 x 1.3 11.5 x 13.0 x 1.0 9.0 x 10.0 x 0.8 11.5 x 13.0 x 1.0 11.5 x 13.0 x 1.0 11.5 x 13.0 x 1.0 11.5 x 13.0 x 1.0 9.0 x 10.0 x 0.87.2 x 7.2 x 0.8
CertificationsRoHS, REACHRoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACH RoHS, REACHRoHS, REACH
WarrantyOne YearOne Year One Year One Year One Year One Year One Year One Year One Year One Year One Year One Year One Year One Year One Year One YearOne Year

1. Low-density parity-check error correcting code. By product support.
2. All performance is collected or measured using ATP proprietary test environment, without file system overhead.
3. Product specifications may be subject to change.

 

技术详阅所有技术

技术及附加服务产品线
PremiumSuperiorValue
寿命监视器
寿命监视器
available
available
available
工业温度
工业温度
available
customizable
available
SiP (系统封装)
SiP (系统封装)
available
available
available
防震BGA封装
防震BGA封装
available
available
available
基于固件的静态数据功耗保护
基于固件的静态数据功耗保护
available
available
available
高级磨损平衡
高级磨损平衡
available
available
available
自动刷新
自动刷新
available
available
available
动态数据刷新
动态数据刷新
available
available
available
自动读取校准
自动读取校准
customizable
customizable
available
端到端数据保护
端到端数据保护
available
available
Content Preload
Content Preload
customizable
customizable
customizable
联合验证和测试
联合验证和测试
customizable
customizable
customizable
customizable:项目定制化选项

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