描述
ATP工业级e.MMC是一种先进的存储解决方案。在一颗卡片中封装集成了NAND闪存、复杂的闪存控制器和快速多媒体卡(MMC)接口。 通过将这些组件集成到一个封装结构中,ATP e.MMC在内部管理所有后台操作,使主机免于处理低级的闪存操作,从而实现更快、更高效的处理。
ATP e.MMC比典型的邮票还要小,采用153球的FBGA封装方式。 微小的占位面积使其非常适合有空间限制,但又要在恶劣环境中使用,需要坚固的耐用性、可靠性和耐久性的嵌入式系统。
ATP e.MMC旨在满足工业应用的苛刻要求。 作为焊接解决方案,它可以防止系统持续振动的影响。其工业温度等级意味着产品能够承受从严寒的-40°C到酷热的85°C的宽广范围内的温度变化,在这个温度范围内,设备或存储其中的数据都不会受到不利影响。
ATP e.MMC符合最新的JEDEC e.MMC 5.1标准(JESD84-B51),支持命令队列(Command Queuing)和缓存屏障(Cache Barrier)功能以增强随机读/写性能。支持高速400(HS400)DDR模式,带宽高达400 MB / s。支持现场固件更新功能(FFU)。 缓存刷新报告(Cache Flushing Report)确保缓存块上的数据完整性。HS400模式下的增强选通(Enhanced Strobe)功能有助于加快主机和e.MMC设备之间的同步效率。 同时,安全写保护(Secure Write Protection)功能确保只有受信任的主机才能对e.MMC设备进行写保护或取消写保护。
ATP e.MMC兼容以前的旧版本(v4.41 / v4.5 / v5.0),支持断电通知(power-off notifications),Packed Commands,缓存(Cache),Boot以及RPMB分区、HPI和HW reset功能。
规格最近更新: 2025-03-31 11:07
e.MMC Industrial | |||||||||||||||||
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Product Name | Extended Industrial Grade | Extended Industrial Grade | Extended Industrial Grade | Extended Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade |
Product Line | Premium | Premium | Superior | Superior | Premium | Premium | Premium | Superior | Superior | Superior | Value | Premium | Premium | Superior | Superior | Value | Value |
Naming | E700Pa | E700Pa | E600Sa | E600Sa | E700Pi | E700Pi | E700Pi | E600Si | E600Si | E600Si | E600Vi | E700Pc | E700Pc | E600Sc | E600Sc | E600Vc | E600Vc |
Flash Type | 3D MLC (pSLC mode) | 2D MLC (pSLC mode) | 3D MLC | 2D MLC | 3D TLC (pSLC mode) | 3D MLC (pSLC mode) | 2D MLC (pSLC mode) | 3D TLC | 3D MLC | 2D MLC | 3D TLC | 3D TLC (pSLC mode) | 2D MLC (pSLC mode) | 3D TLC | 2D MLC | 3D TLC | 3D TLC |
IC Package | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA |
JEDEC Specification | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 |
Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
Operating Temperature | -40°C to 105°C | -40°C to 105°C | -40°C to 105°C | -40°C to 105°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C |
Capacity1 | 8 GB to 64 GB | 4 GB to 8 GB | 16 GB to 128 GB | 8 GB to 16 GB | 10 GB to 40 GB | 8 GB to 64 GB | 4 GB to 8 GB | 32 GB to 128 GB | 16 GB to 128 GB | 8 GB to 16 GB | 32 GB to 64 GB | 10 GB to 40 GB | 4 GB to 8 GB | 32 GB to 128 GB | 8 GB to 16 GB | 32 GB to 64 GB | 64 GB to 128 GB |
Sequential Read/ Write up to (MB/s) (Max.)2 | 300 / 240 | 230 / 100 | 300 / 170 | 230 / 100 | 290 / 225 | 300 / 240 | 230 / 100 | 290 / 225 | 300 / 170 | 230 / 100 | 290 / 225 | 290 / 225 | 230 / 100 | 290 / 225 | 230 / 100 | 290 / 225 | 290/220 |
Bus Speed Modes | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 |
ICC (Typical RMS in Read/Write) mA (Max.) | 145 / 175 | 85 / 65 | 125 / 175 | 85 / 50 | 100 / 110 | 145 / 175 | 85 / 65 | 100 / 110 | 125 / 175 | 85 / 50 | 100 / 110 | 100 / 110 | 85 / 65 | 100 / 110 | 85 / 50 | 100 / 110 | 105/80 3 |
ICCQ (Typical RMS in Read/Write) mA (Max.) | 120 / 100 | 60 / 45 | 115 / 95 | 60 / 30 | 105 / 100 | 120 / 100 | 60 / 45 | 105 / 100 | 110 / 100 | 60 / 30 | 105 / 100 | 105 / 100 | 60 / 45 | 105 / 100 | 60 / 30 | 105 / 100 | 115 / 95 3 |
Endurance TBW2 (Max.) | 1,213 TB | 200 TB | 824 TB | 40 TB | 1,364 TB | 1,213 TB | 200 TB | 52 TB | 824 TB | 40 TB | 20 TB | 1,364 TB | 200 TB | 52 TB | 40 TB | 20 TB | 24 TB |
Reliability MTBF @ 25°C | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours |
Dimensions (mm) | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 9.0 x 10.0 x 0.8 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 9.0 x 10.0 x 0.8 | 7.2 x 7.2 x 0.8 |
Certifications | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH |
Warranty | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year |
1. Low-density parity-check error correcting code. By product support.
2. All performance is collected or measured using ATP proprietary test environment, without file system overhead.
3. Product specifications may be subject to change.
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技术及附加服务 | 产品线 | ||
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![]() | customizable | customizable | available |
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![]() | customizable | customizable | customizable |
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