e.MMC Smaller Footprint

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特点介绍

  • 小尺寸的封装体积*
  • 自动省电模式与电源优化技术*
  • 可靠的数据完整性*（自动刷新 AutoRefresh 与动态数据刷新 Dynamic Data Refresh）
  • 符合 JEDEC e.MMC v5.1 标准（JESD84-B51）
  • 153 球 / 125 球 FBGA（符合 RoHS 的“绿色封装”）
  • LDPC ECC 引擎
* 可能因产品和项目支持而异
描述规格技术相关资源下载中心
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描述

ATP Electronics E600 系列 e.MMC 在保留标准尺寸 e.MMC 兼容优势的同时，实现极致节能与省空间设计，并全面符合 JEDEC 标准，特别适用于对能效与板级空间要求严苛的应用。

E600 系列打破尺寸限制，将标准 e.MMC 大幅缩小至前所未有的微型化尺寸。采用全球最小等级的 7.2 × 7.2 mm 封装，专为高性能、强可靠性与超低功耗而设计，适用于智能穿戴、物联网等应用场景。

通过先进的电源管理与固件调校，大幅降低功耗，在 25°C 至 85°C 的商用工作温度范围内展现出色的耐热性能。应用导向的存储配置便于灵活集成，强大的数据保护机制确保数据完整性，配合抗震设计，在强烈振动与冲击条件下依然保持长期稳定运行。

规格最近更新: 2025-12-24 14:40

Smaller Footprint e.MMC
Product NameSmaller Footprint e.MMCSmaller Footprint e.MMCSmaller Footprint e.MMCSmaller Footprint e.MMC Smaller Footprint e.MMCSmaller Footprint e.MMC
Product LinePremiumValuePremiumValueValueValue
NamingE700PcE600VcE700PcE600VcE600ViE600Vc
Flash Type3D TLC (pSLC mode)3D TLC 3D TLC (pSLC mode)3D TLC 3D TLC3D TLC
IC Package125-ball FBGA125-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA
JEDEC Specificationv5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400
Power Loss Protection OptionsFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware Based
Operating Temperature-25°C to 85°C-25°C to 85°C-25°C to 85°C-25°C to 85°C-40°C to 85°C-25°C to 85°C
Capacity20 GB 64 GB20 GB to 40 GB64 GB to 128 GB32 GB to 64 GB32 GB to 64 GB
Sequential Read/Write up to (MB/s) (Max.)240 / 210240 / 210240 / 220240 / 220290 / 225290 / 225
Bus Speed Modesx1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8
ICC (Typical RMS in Read/Write) mA (Max.)30 / 4030 / 4035 / 4535 / 45100 / 110100 / 110
ICCQ (Typical RMS in Read/Write) mA (Max.)60 / 5060 / 5060 / 5560 / 55105 / 100105 / 100
Endurance TBW (Max.) 1680 TB12 TB1,360 TB24 TB55 TB55 TB
Reliability MTBF @ 25°C>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours>2,000,000 hours>2,000,000 hours
Dimensions (mm)6.7 x 7.2 x 0.656.7 x 7.2 x 0.657.2 x 7.2 x 0.87.2 x 7.2 x 0.89.0 x 10.0 x 0.89.0 x 10.0 x 0.8
CertificationsRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACH
WarrantyOne YearOne YearOne YearOne YearOne YearOne Year

1 All performance is collected or measured using ATP proprietary test environment, without file system overhead.

技术详阅所有技术

技术及附加服务产品线
PremiumValue
寿命监视器
寿命监视器
available
available
工业温度
工业温度
customizable
SiP (系统封装)
SiP (系统封装)
available
available
防震BGA封装
防震BGA封装
available
available
基于固件的静态数据功耗保护
基于固件的静态数据功耗保护
available
available
高级磨损平衡
高级磨损平衡
available
available
自动刷新
自动刷新
available
available
动态数据刷新
动态数据刷新
available
available
自动读取校准
自动读取校准
available
available
端到端数据保护
端到端数据保护
customizable
Content Preload
Content Preload
customizable
customizable
联合验证和测试
联合验证和测试
customizable
customizable
customizable:项目定制化选项

相关资源

No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations. 

Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.

 

Ensuring Product Traceability

Laser imprints important information to identify each piece for accurate tracking and efficient inventory management.

Rapid Diagnostic Test (RDT)

RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects.

ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.

 

Automated Final Screening

A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.

Protective Packaging

Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.

 

ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.

Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements. 

下载中心

  • ATP 7.2 eMMC product flyer
    English
    2025-05-271.60MB
    download
  • ATP 9x10 eMMC product flyer
    English
    2025-05-272.40MB
    download
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