描述
基于NVMe™协议的M.2固态模组利用超快的PCIExpress®(PCIe®)接口,在速度和性能方面有显着改善,以满足企业级存储系统中对响应时间日益增长的要求,并支持当今企业级应用对日益增长的数据存储量的需求。 ATP NVMe SSD采用PCIe 3.0 x4插槽(每通道8 Gb / s),可以提供32 Gb / s的带宽,性能明显优于SATAIII SSD的带宽6 Gb / s,访问速度可以提高4-6倍,延迟降低3倍以上,输入/输出的IOPS更高。支持工业级工作温度范围的ATP NVMe SSD即使在-40°C到85°C的极端温度范围内也能提供稳定的性能,而动态过热降频管理则可自动调节速度,以在严苛和繁重的工作负载下保持SSD运行时温度保持在一个安全的范围内,同时维持一定的性能。
ATP的M.2 2280 NVMe模组采用NVMe 1.2规范并集成了3D NAND TLC技术,可提供高达1TB的内存容量,并提供优异的性能,顺序读取高达3,420 MB / s,顺序写入高达3,050 MB / s,随机IOPS高达250,800。
NVMe规范是专为克服传统硬盘的限制而设计的,可以更快、更高效地访问具有非易失性存储器的存储设备,例如当前的NAND闪存和未来的其他非易失性存储器技术。这些SSD可以为任何苛刻的应用提供快速、可靠和耐用的性能
规格最近更新: 2025-01-23 11:48
M.2 NVMe | ||||||||||
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产品线 | Premium | Premium | Superior | Superior | Value | Value | Value | Value | Premium | Value |
产品名称 | N750Pi | N700Pi | N650Si / N650Sc | N600Si / N600Sc | N650Vi | N600Vc | N650Vi | N600Vc | N700Pi / N700Pc | N600Vi / N600Vc |
接口 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 |
闪存类型 | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC (pSLC mode) | 3D TLC |
板型 | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280 S2-M | M.2 2280 S2-M | M.2 2242 D5-M | M.2 2242 D5-M | M.2 2230-S4-M | M.2 2230-S4-M |
工作温度 (Tcase)1 | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C | 0°C to 70°C | -40°C to 85°C | 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C / 0°C to 70°C |
功耗保护 選項 | Hardware + Firmware Based | Hardware + Firmware Based | Hardware + Firmware Based or Firmware Based | Hardware + Firmware Based or Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
自加密驱动器 選項 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | - | - | - | - | AES 256-bit Encryption, TCG Opal 2.0 | - |
容量 | 40 GB to 320 GB | 40 GB to 640 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120 GB to 960 GB | 40 GB to 160 GB | 120 GB to 480 GB |
顺序读取速度 (MB/s) 高达 | 3,150 | 3,150 | 3,420 | 3,420 | 2,600 | 2,600 | 2,600 | 2,600 | 2,000 | 2,050 |
顺序写入速度 (MB/s) 高达 | 2,670 | 2,820 | 3,050 | 3,050 | 1,880 | 1,870 | 1,880 | 1,870 | 1,600 | 1,550 |
随机读取 IOPS 高达 | 147,789 | 147,789 | 222,700 | 225,200 | 250,800 | 184,300 | 250,800 | 184,300 | 135,600 | 138,000 |
随机写入 IOPS 高达 | 114,227 | 114,227 | 176,600 | 179,200 | 276,400 | 145,900 | 276,400 | 145,900 | 112,000 | 112,600 |
耐久力 (TBW)2 高达 | 16,000 TB | 21,300 TB | 4,640 TB | 2,793 TB | 4,880 TB | 1,390 TB | 4,880 TB | 1,390 TB | 4,280 TB | 768 TB |
可靠性 MTBF @ 25°C | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours |
尺寸 (mm) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 2.2 | 80.0 x 22.0 x 2.2 | 42.0 x 22.0 x 3.6 | 42.0 x 22.0 x 3.6 | 30.0 x 22.0 x 2.5 | 30.0 x 22.0 x 2.5 |
认证 | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC. BSMI, UKCA, RoHS , REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH |
保固 | 5 years | 5 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years |
1 外壳温度,SMART温度属性指示的复合温度。
2 在最高顺序写入值下。可能因密度、配置和应用而异。
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