介紹
ATP Electronics shifts into high gear with automotive grade e.MMC solutions.These soldered-down solutions are constructed for maximum reliability on the road. They deliver consistent, stable performance amidst the challenging and unpredictable conditions that vehicles are commonly subjected to, such as intense shocks and vibrations, temperature variability, and constricted spaces.Infotainment systems, advanced driver assistance system (ADAS), telematics, and other automotive applications will benefit greatly from the extra-high endurance, which is 2-3X higher than standard e.MMC.
The automotive grade e.MMC solutions are compliant with AEC-Q100 and are available in two temperature grades for peace-of-mind journeys, whether in sub-zero winters or in scorching summers. Automotive Grade 3 (AG3) typically covers an operating range of -40°C to 85°C), while Automotive Grade 2 (AG2) offers an extended range for even more extreme conditions with elevated temperatures, from -40°C to 105°C.
ATP’s automotive grade e.MMC solutions incorporate low-density parity-check error correction codes (LDPC ECC) to maintain data accuracy over their rated lifespan and beyond. AutoRefresh and Dynamic Data Refresh technologies prevent read disturb errors in often-accessed (hot zone) areas as well as seldom-accessed areas (cold zone).
規格最新更新: 2025-12-03 15:32
| e.MMC Automotive | ||||
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| Product Name | Automotive Grade 2 | Automotive Grade 2 | Automotive Grade 3 | Automotive Grade 3 |
| Product Line | Premium | Superior | Premium | Superior |
| Naming | E700Paa 1 | E600Saa 1 | E700Pia 1 | E600Sia 1 |
| Flash Type | 3D TLC (pSLC mode) | 3D TLC | 3D TLC (pSLC mode) | 3D TLC |
| IC Package | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA |
| JEDEC Specification | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 |
| Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
| Operating Temperature | -40°C to 105°C | -40°C to 105°C | -40°C to 85°C | -40°C to 85°C |
| Capacity | 20 GB to 80 GB | 64 GB to 256 GB | 20 GB to 80 GB | 64 GB to 256 GB |
| Sequential Read/Write up to (MB/s) (Max.) | 310 / 240 | 310 / 240 | 310 / 240 | 310 / 240 |
| Bus Speed Modes | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 |
| ICC (Typical RMS in Read/Write) mA (Max.) | 90 / 145 | 90 / 145 | 90 / 145 | 90 / 145 |
| ICCQ (Typical RMS in Read/Write) mA (Max.) | 105 / 150 | 100 / 150 | 105 / 150 | 100 / 150 |
| Endurance TBW (Max.) 2 | 2,000 TB | 280 TB | 2,000 TB | 280 TB |
| Reliability MTBF @ 25°C | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours |
| Dimensions (mm) | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.3 |
| Certifications | AEC-Q100, RoHS, REACH | AEC-Q100, RoHS, REACH | AEC-Q100, RoHS, REACH | AEC-Q100, RoHS, REACH |
| Warranty | One Year | One Year | One Year | One Year |
1 Product specifications may be subject to change.
2 All performance is collected or measured using ATP proprietary test environment, without file system overhead.
技術詳閱所有技術
| 技術及附加服務 | 產品線 | |
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| Premium | Superior | |
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 | customizable | customizable |
 | available | available |
 | customizable | customizable |
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相關資源
No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations.
Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.
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Ensuring Product Traceability Laser imprints important information to identify each piece for accurate tracking and efficient inventory management. |
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Rapid Diagnostic Test (RDT) RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects. ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.
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Automated Final Screening A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.
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Protective Packaging Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.
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ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.
Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements.
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- ATP e.MMC 3D MLC and SLC Mode Reliability Report V2.0 Summary
- ATP eMMC Automotive product flyer
- ATP_Automotive_Solutions_Customer specific only_v1.0_2023