e.MMC Smaller Footprint
產品特色
- Smaller footprint package size*
- Auto Power-Saving Mode and Power Optimization technologies*
- Robust Data Integrity* (AutoRefresh and Dynamic Data Refresh)
- Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
- 153-ball FBGA (RoHS compliant, "green package")
- LDPC ECC engine
介紹
ATP Electronics unlocks the next generation of e.MMC solutions with the ultimate power and space saver while retaining the advantages of standard-size e.MMC and remaining compliant with JEDEC standards, making them ideal for applications where energy and space are premium considerations.The E600 Series breaks dimension limits by radically shrinking the standard e.MMC to the smallest-ever miniaturized versions.
Currently available in the world’s smallest package (7.2 x 7.2 mm), these solutions are engineered for demanding high performance, rugged reliability, and ultra-low power consumption, such as smart wearables, IoT devices, and more.Advanced power management and firmware tuning deliver massive energy savings, commercial operating temperature range from 25°C up to 85°C offers exceptional thermal resilience, application-aligned storage options offer flexible integration, robust data protection ensures data integrity, and the vibration-proof design ensures reliability and durability against vigorous shocks.
規格最新更新: 2025-12-03 15:29
| Smaller Footprint e.MMC | |||
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| Product Name | Smaller Footprint e.MMC | Smaller Footprint e.MMC | Smaller Footprint e.MMC |
| Product Line | Value | Value | Value |
| Naming | E600Vc | E600Vi | E600Vc |
| Flash Type | 3D TLC | 3D TLC | 3D TLC |
| IC Package | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA |
| JEDEC Specification | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 |
| Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based |
| Operating Temperature | -25°C to 85°C | -40°C to 85°C | -25°C to 85°C |
| Capacity | 64 GB to 128 GB | 32 GB to 64 GB | 32 GB to 64 GB |
| Sequential Read/Write up to (MB/s) (Max.) | 240 / 220 | 290 / 225 | 290 / 225 |
| Bus Speed Modes | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 |
| ICC (Typical RMS in Read/Write) mA (Max.) | 35 / 45 | 100 / 110 | 100 / 110 |
| ICCQ (Typical RMS in Read/Write) mA (Max.) | 60 / 55 | 105 / 100 | 105 / 100 |
| Endurance TBW (Max.) 1 | 24 TB | 55 TB | 55 TB |
| Reliability MTBF @ 25°C | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours |
| Dimensions (mm) | 7.2 x 7.2 x 0.8 | 9.0 x 10.0 x 0.8 | 9.0 x 10.0 x 0.8 |
| Certifications | RoHS, REACH | RoHS, REACH | RoHS, REACH |
| Warranty | One Year | One Year | One Year |
1 All performance is collected or measured using ATP proprietary test environment, without file system overhead.
相關資源
No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations.
Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.
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Ensuring Product Traceability Laser imprints important information to identify each piece for accurate tracking and efficient inventory management. |
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Rapid Diagnostic Test (RDT) RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects. ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.
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Automated Final Screening A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.
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Protective Packaging Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.
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ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.
Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements.
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