e.MMC Smaller Footprint

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產品特色

  • 小尺寸的封裝體積*
  • 自動省電模式與電源最佳化技術*
  • 穩健的資料完整性*（自動重整 AutoRefresh 與動態資料重整 Dynamic Data Refresh）
  • 符合 JEDEC e.MMC v5.1 標準（JESD84-B51）
  • 153 球 / 125 球 FBGA（符合 RoHS 之「綠色封裝」）
  • LDPC ECC 引擎
* 根據產品或專案內容而有所差異
介紹規格技術相關資源下載中心
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介紹

ATP Electronics E600 系列 e.MMC 在保留標準尺寸 e.MMC 相容優勢的同時，實現極致省電與省空間設計，並完全符合 JEDEC 規範，特別適合對能源效率與板級空間高度敏感的應用。

E600 系列突破尺寸極限，將標準 e.MMC 大幅縮小至前所未有的微型化尺寸。採用全球最小等級的 7.2 × 7.2 mm 封裝，專為高效能、強固可靠與超低功耗而設計，適用於智慧穿戴、IoT 裝置等應用。

透過進階電源管理與韌體調校，大幅降低能耗，並在 25°C 至 85°C 的商用操作溫度範圍內展現優異的耐熱表現。多樣化的應用導向儲存選項便於整合，強化資料保護機制確保資料完整性，搭配抗震設計，在劇烈振動與衝擊下依然可靠耐用。

規格最新更新: 2025-12-24 14:40

Smaller Footprint e.MMC
Product NameSmaller Footprint e.MMCSmaller Footprint e.MMCSmaller Footprint e.MMCSmaller Footprint e.MMC Smaller Footprint e.MMCSmaller Footprint e.MMC
Product LinePremiumValuePremiumValueValueValue
NamingE700PcE600VcE700PcE600VcE600ViE600Vc
Flash Type3D TLC (pSLC mode)3D TLC 3D TLC (pSLC mode)3D TLC 3D TLC3D TLC
IC Package125-ball FBGA125-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA
JEDEC Specificationv5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400
Power Loss Protection OptionsFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware Based
Operating Temperature-25°C to 85°C-25°C to 85°C-25°C to 85°C-25°C to 85°C-40°C to 85°C-25°C to 85°C
Capacity20 GB 64 GB20 GB to 40 GB64 GB to 128 GB32 GB to 64 GB32 GB to 64 GB
Sequential Read/Write up to (MB/s) (Max.)240 / 210240 / 210240 / 220240 / 220290 / 225290 / 225
Bus Speed Modesx1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8
ICC (Typical RMS in Read/Write) mA (Max.)30 / 4030 / 4035 / 4535 / 45100 / 110100 / 110
ICCQ (Typical RMS in Read/Write) mA (Max.)60 / 5060 / 5060 / 5560 / 55105 / 100105 / 100
Endurance TBW (Max.) 1680 TB12 TB1,360 TB24 TB55 TB55 TB
Reliability MTBF @ 25°C>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours>2,000,000 hours>2,000,000 hours
Dimensions (mm)6.7 x 7.2 x 0.656.7 x 7.2 x 0.657.2 x 7.2 x 0.87.2 x 7.2 x 0.89.0 x 10.0 x 0.89.0 x 10.0 x 0.8
CertificationsRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACH
WarrantyOne YearOne YearOne YearOne YearOne YearOne Year

1 All performance is collected or measured using ATP proprietary test environment, without file system overhead.

技術詳閱所有技術

技術及附加服務產品線
PremiumValue
使用壽命監控
使用壽命監控
available
available
工控溫度
工控溫度
customizable
系統級封裝
系統級封裝
available
available
防震型球柵陣列封裝
防震型球柵陣列封裝
available
available
韌體型靜態數據斷電保護
韌體型靜態數據斷電保護
available
available
平均抹寫
平均抹寫
available
available
自動刷新
自動刷新
available
available
動態數據刷新
動態數據刷新
available
available
自動讀取校準
自動讀取校準
available
available
端對端資料路徑保護
端對端資料路徑保護
customizable
Content Preload
Content Preload
customizable
customizable
聯合驗證和測試
聯合驗證和測試
customizable
customizable
customizable:客製化方案選項

相關資源

No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations. 

Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.

 

Ensuring Product Traceability

Laser imprints important information to identify each piece for accurate tracking and efficient inventory management.

Rapid Diagnostic Test (RDT)

RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects.

ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.

 

Automated Final Screening

A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.

Protective Packaging

Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.

 

ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.

Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements. 

下載中心

  • ATP 7.2 eMMC product flyer
    English
    2025-05-271.60MB
    download
  • ATP 9x10 eMMC product flyer
    English
    2025-05-272.40MB
    download
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