介紹
ATP工業e.MMC是一種先進的儲存解決方案，同時封裝了NAND閃存、複雜的閃存控制器和多媒體記憶卡（MMC）接口。經過將這些組件集成一個封裝結構中，ATP e.MMC在內部管理所有後台操作，使主機發揮更高效率的處理。
ATP e.MMC採用153球的球柵陣列封裝（FBGA 封裝），其小巧的體積非常適合在空間受限的惡劣環境，如嵌入式系統，同時仍能確保其卓越的耐用性。
ATP e.MMC 旨在滿足工業應用的嚴苛需求。其焊接的特性可以避免振動產生的影響，且產品支援寬溫作業，即使身處在-40°C到105°C的嚴苛環境，也能展現優異的效能。
ATP e.MMC符合最新的JEDEC e.MMC 5.1標準（JESD84-B51），支持命令隊列（Command Queuing）和緩存屏障（Cache Barrier）功能，以增強隨機讀取／寫入性能。支援高速400（HS400）DDR模式，速度高達400 MB / s，同時現場固件更新功能（FFU）。產品保存刷新報告（Cache Flushing Report）確保保存區塊上的數據完整。HS400模式下的增加強選通（Enhanced Strobe）功能有助於加速主機和e.MMC設備之間的同步效率。安全寫入保護（Secure Write Protection）功能確保只有受信任的主機，才有權限選擇是否要保護e.MMC設備。
ATP e.MMC及過去的版本（v4.41／v4.5／v5.0），同樣支援斷電通知（power-off notifications），Packed Commands、快取（Cache）、Boot以及RPMB分區、HPI和HW重置功能。
規格最新更新: 2025-12-03 15:30
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| Product Name | Extended Industrial Grade | Extended Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Industrial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade | Commercial Grade |
| Product Line | Premium | Superior | Premium | Premium | Superior | Superior | Superior | Premium | Premium | Premium | Superior | Superior | Superior |
| Naming | E700Pa | E600Sa | E700Pi | E700Pi | E600Si 1 | E600Si | E600Si | E700Pc 1 | E700Pc | E700Pc | E600Sc 1 | E600Sc | E600Sc |
| Flash Type | 2D MLC (pSLC mode) | 2D MLC | 3D TLC (pSLC mode) | 2D MLC (pSLC mode) | 3D TLC | 3D TLC | 2D MLC | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 2D MLC (pSLC mode) | 3D TLC | 3D TLC | 2D MLC |
| IC Package | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA |
| JEDEC Specification | v5.0 / v5.1, HS400 | v5.0 / v5.1, HS400 | v5.1, HS400 | v5.0 / v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.0 / v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.0 / v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.0 / v5.1, HS400 |
| Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
| Operating Temperature | -40°C to 105°C | -40°C to 105°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C | -25°C to 85°C |
| Capacity | 4 GB to 8 GB | 8 GB to 16 GB | 10 GB to 40 GB | 4 GB to 8 GB | 64 GB to 256 GB | 32 GB to 128 GB | 8 GB to 16 GB | 20 GB to 80 GB | 10 GB to 40 GB | 4 GB to 8 GB | 64 GB to 256 GB | 32 GB to 128 GB | 8 GB to 16 GB |
| Sequential Read/ Write up to (MB/s) (Max.) | 230 / 100 | 230 / 100 | 290 / 225 | 230 / 100 | 310 / 240 | 290 / 225 | 230 / 100 | 310 / 240 | 290 / 225 | 230 / 100 | 310 / 240 | 290 / 225 | 230 / 100 |
| Bus Speed Modes | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 |
| ICC (Typical RMS in Read/Write) mA (Max.) | 85 / 65 | 85 / 50 | 100 / 110 | 85 / 65 | 90 / 145 | 100 / 110 | 85 / 50 | 90 / 145 | 100 / 110 | 85 / 65 | 90 / 145 | 100 / 110 | 85 / 50 |
| ICCQ (Typical RMS in Read/Write) mA (Max.) | 60 / 45 | 60 / 30 | 105 / 100 | 60 / 45 | 100 / 150 | 105 / 100 | 60 / 30 | 105 / 150 | 105 / 100 | 60 / 45 | 100 / 150 | 105 / 100 | 60 / 30 |
| Endurance TBW (Max.) 2 | 200 TB | 40 TB | 1,360 TB | 200 TB | 280 TB | 110 TB | 40 TB | 2,000 TB | 1,360 TB | 200 TB | 280 TB | 110 TB | 40 TB |
| Reliability MTBF @ 25°C | >3,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours | >3,000,000 hours | >2,000,000 hours | >3,000,000 hours |
| Dimensions (mm) | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.0 |
| Certifications | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH | RoHS, REACH |
| Warranty | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year | One Year |
1 Product specifications may be subject to change.
2 All performance is collected or measured using ATP proprietary test environment, without file system overhead.
技術詳閱所有技術
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相關資源
No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations.
Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.
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Ensuring Product Traceability Laser imprints important information to identify each piece for accurate tracking and efficient inventory management. |
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Rapid Diagnostic Test (RDT) RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects. ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.
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Automated Final Screening A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.
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Protective Packaging Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.
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ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.
Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements.
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