• DDR1
  • DDR1

DDR1

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介紹

DDR1（Double Data Rate）是第二代的SDRAM（同步動態隨機存取記憶體），顧名思義，DDR是指在系統時間的上升和下降過程中，均能讀取和寫入數據，因此其頻寬幾乎是SDRAM的兩倍。

JEDEC於2000年制定了DDR SDRAM規範（JESD79），與SDRAM技術相比，DDR SDRAM具有更高的頻寬與更快速的性能。ATP DDR1快閃記憶體的傳輸速度為400 MT/s，可在2.5V電壓下運作，與SDRAM採用的3.3V相比，顯著降低功率的消耗。

規格最新更新: 2023-04-07 16:24

DDR
DIMM TypeNon-ECC UDIMMNon-ECC SO-DIMM
Density256 MB128 MB to 512 MB / 1 GB
Speed up to (MT/s)400400
PCB HeightLow ProfileLow Profile
Operating Temperature0°C to 70°C0°C to 70°C / -40°C to 85°C

相關資源

Under a license agreement with Micron Technology, Inc. signed in August 2015, ATP will continue to manufacture legacy SDR/DDR
DRAM modules for Micron’s customers who are unable to migrate. The agreement was expanded in 2016 with the addition of selected
legacy DRAM modules specifically for customers using AMD Embedded/Geode platforms. ATP works closely and exclusively with Micron
to transfer module designs and extend long-term support to offer the legacy modules in selected form factors (SO-DIMM, UDIMM and
RDIMM) and densities, along with ATP’s unique services and features.


The license agreement stipulates the following conditions for ATP:
•100% follow Micron’s design. Offer extended support for these legacy products to minimize the customer’s
 (re)qualification efforts.
•100% follow Micron’s BOM selection. Implement the same key components (such as IC configuration and Register/PLL type), as
well as passive components (such as resistors, capacitors and EEPROM) to meet the specifications of Micron’s BOM.
•100% follow Micron’s firmware settings. Implement SPD in addition to the manufacturer’s information.
•100% follow Micron’s specifications. Each module will be manufactured to the equivalent specifications and test processes of
the corresponding Micron part number.


“Micron Technology, Inc. is committed to supporting legacy application requirements. By partnering with ATP, we’re able to provide stability for
our customers who are unable to transition their existing platforms.”
- Bruce Franklin, Product Marketing Director, Micron’s Embedded Business Unit

“Embedded applications require a long life cycle, which is why AMD is pleased to collaborate with ATP and Micron to support the extended life
of AMD’s Geode platform. ATP’s legacy SDR/DDR SO-DIMM module solutions utilizing Micron memory are a critical component to industrial
control and automation, industrial PCs, HMI panels, point of sales and communication applications.”
 - Colin Cureton, Product Marketing Manager, AMD Embedded Solutions

DDR
Module Type SO-DIMM SO-DIMM (Industrial Grade) UDIMM
Function Unbuffered Non-ECC Unbuffered Non-ECC Unbuffered Non ECC
Density 128 MB / 256 MB / 512 MB / 1 GB 256 MB / 512 MB 256 MB / 512 MB
Frequency 400 MHz 400 MHz 400 MHz
PCB Height 1.25" 1.25" 1.25"
Number of Pins 200 200 184
Solutions Standard Standard Build To Order (BTO)

下載中心

  • ATP DDR1 product flyer
    English
    2025-03-28453.03KB
    download
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