Operation Technology (OT) systems have been the backbones of all types of applications, and even more so when OT and IT converge.
At the edge, a wide range of appliances is deployed, including rackmount servers, compact fanless box PCs, and embedded motherboards or COMs. They require equally complex but essential storage and DRAM modules.
As a reputable supplier of specialized memory and flash storage solutions, ATP offers a full spectrum of generation and form factors solutions. ATP ensures the longest uptime and least maintenance for your systems by focusing on wide-temp and industrial-grade quality.
Automation systems in factories and warehouses begin with analog equipment or machinery and progress to digital control systems. Legacy systems continue to play significant roles. The challenge is that system design and refreshes just cannot keep up with the fast-paced memory/flash revolution.
ATP specializes in legacy form factors and support for longevity. ATP has the solution if you're having trouble finding memory or flash that is no longer widely available, while also providing newer formfactors with high storage capacity for future design, such as CFexpress or eMMC.
The greatest obstacle in the energy sector frequently results from exposure to the environment, particularly extreme wide-temperature, erosion from salt, sulfur, or acid. The least amount of human maintenance is required for equipment or systems that are frequently deployed outside. At the heart of this industry regulations are safety and durability.
ATP products are made from wide-temperature specifications. ATP upholds strict standards by using sophisticated burn-in/screening tests on top of industrial-grade chips and wafers.
Our never-ending desire for amusement is provided by digitally enabled gaming machines, such as slot machines, which are frequently constructed using I/O rich embedded hardware (general-purpose Box-PC, Mini-ITX, and Micro-ATX) on top of proprietary software solution.
The foundational hardware platform, however, necessitates a 7–15-year lifetime support, which presents an unique challenge for component support. The answer is ATP, which specializes in legacy and longevity assistance.
Test & Measurement is a specialized application used in a variety of vertical sectors. It has its proprietary hardware design and typically lasts for several generations. These platforms often only support low density logger storage, while also demand more intensive data writing endurance.
As a result, equipment manufacturers in this sector seek essential storage that the mass market no longer offers, including 512MB/1~8G SLC flash cards for OS boot-drive or micro data logging, or DDR2/3 DRAM. ATP is pleased to have been a dedicated partner to these specialized professionals.
DRAM触点的30μ“厚金镀层优化了连接器和DRAM模块之间的信号传输质量。
| PCIe® Gen4 NVMe M.2 SSD | ||||||
|---|---|---|---|---|---|---|
| Product Line | Premium | Superior | Superior | Value | Superior | Superior |
| Naming | N751Pi 1 | N651Si / N651Sc | N601Sc 2 | N601Vi / N601Vc | N601Sc 2 | N601Si 2 |
| Interface | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 |
| Flash Type | 3D TLC (pSLC mode) | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC |
| Form Factor | M.2 2280-D6-M / M.2 2280-D2-M | M.2 2280-D6-M / M.2 2280-D2-M | M.2 2280 M-Key | M.2 2280-S3-M | M.2 2242 M-Key | M.2 2230 M-Key |
| Operating Temperature | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | 0°C to 70°C | -40°C to 85°C |
| Power Loss Protection Options | Hardware + Firmware Based / Firmware Based | Hardware + Firmware Based / Firmware Based | Hardware + Firmware Based / Firmware Based | Firmware Based | Hardware + Firmware Based / Firmware Based | Firmware Based |
| Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 |
| Capacity | 80 GB to 1.28 TB | 240 GB to 3.84 TB | 480 GB to 3.84 TB | 240 GB to 1.92 TB | 480 GB to 1.92 TB | 240 GB to 960 GB |
| Sequential Read (MB/s) up to | 6,450 | 6,450 | 7,000 | 5,000 | 7,000 | 3,500 |
| Sequential Write (MB/s) up to | 6,050 | 6,050 | 6,000 | 4,300 | 6,000 | 3,400 |
| Random Reads IOPS up to | 1,090,000 | 1,091,000 | 900,000 | 800,000 | 900,000 | 600,000 |
| Random Writes IOPS up to | 1,107,000 | 1,245,000 | 950,000 | 1,100,000 | 950,000 | 750,000 |
| Endurance (TBW)3 up to | 120,000 TB | 40,000 TB | 5,760 TB | 4,170 TB | 2,880 TB | 1,440 TB |
| Reliability MTBF @ 25°C | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours |
| Dimensions (mm)4 | 80.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) / 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) / 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.6 | 80.0 x 22.0 x 2.4 | 42.0 x 22.0 x 3.6 | 30.0 x 22.0 x 3.6 |
| Certifications | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL |
| Warranty | 5 years | 2 years | 2 years | 2 years | 2 years | 2 years |
1. 150K P/E cycle configuration drive available on a project basis.
2. Product specifications may be subject to change.
3. Under highest Sequential write value. May vary by density, configuration and applications.
4. M.2 2280-D6-M form factor (max height: 3.85mm), offers Hardware Based Power Loss Protection. M.2 2280-D2-M form factor (max height: 3.6mm), provides Firmware Based Power Loss Protection.
