- CF/CFast卡、低密度micro/SD卡
- eUSB, UFD
- mSATA
- e.MMC
- DDR3 DRAM
- 5年以上的使用寿命和BOM/FW控制
- 特殊扩展支持
- 工业/汽车级温度(AG2和AG3)
- 量身定制的热解决方案
- 高耐久性SLC/pSLC/MLC/TLC系列
- 定制备用块(OP)设置
- 定制电源循环测试
- 通过固件(FW)增强实现突然断电恢复(SPOR)
- 基于MCU的功耗保护(PLP)
- 定制50μ "金手指"
- 成套防水系统(SIP)
- 防腐蚀、盐雾试验
- CMD和缓存行为的固件调整
Systems on public vehicle transportation are advancing to an era of connectivity. From safety, monitoring, and telematics to passenger infotainment, higher computing and vaster data all now aim to be connected or even remotely managed, while all-terrain, all-weather, and unstable power supply challenges still remain musts to answer for both system designers and storage solutions.
ATP, with core competitiveness in endurance, longevity, wide-temp, fix BOM control, presents ideal industrial flash and memory solutions for public transport systems.
Railway systems are known to be ruggedized to overcome challenging operational environments and are required to pass strict railway certifications. Meanwhile, memory and flash storage onboard systems must also meet features including extra endurance, wide/extreme temperature, anti-shock/humidity/dust, and power loss protection.
Besides the above common challenges, railway systems are often quite diverse in designs and must go through a lengthy validation or deployment cycle, making validated key components less popular types to acquire. They especially need support on legacy types with extra longevity from a specialized supplier like ATP.
Transportation infrastructure, whether roadway, railway, or waterway traffic, has been progressing to keep up with the rising 5G and autonomous trend aiming for smarter public traffic safety or service, while legacy deployment still shoulders significant roles due to budgetary concerns.
ATP, as a specialized memory and flash storage provider, offers legacy industrial solutions, extra longevity, and rigorous quality control on top of the industrial specification. We ride a long way with manufacturers of traffic systems.
DRAM触点的30μ“厚金镀层优化了连接器和DRAM模块之间的信号传输质量。
PCIe® Gen4 NVMe M.2 SSD | ||||||
---|---|---|---|---|---|---|
Product Line | Premium | Superior | Superior | Value | Superior | Superior |
Naming | N751Pi 1 | N651Si / N651Sc | N601Sc 2 | N601Vi / N601Vc | N601Sc 2 | N601Si 2 |
Interface | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 |
Flash Type | 3D TLC (pSLC mode) | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC |
Form Factor | M.2 2280-D6-M / M.2 2280-D2-M | M.2 2280-D6-M / M.2 2280-D2-M | M.2 2280 M-Key | M.2 2280-S3-M | M.2 2242 M-Key | M.2 2230 M-Key |
Operating Temperature | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | 0°C to 70°C | -40°C to 85°C |
Power Loss Protection Options | Hardware + Firmware Based / Firmware Based | Hardware + Firmware Based / Firmware Based | Hardware + Firmware Based / Firmware Based | Firmware Based | Hardware + Firmware Based / Firmware Based | Firmware Based |
Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 |
Capacity | 80 GB to 1.28 TB | 240 GB to 3.84 TB | 480 GB to 3.84 TB | 240 GB to 1.92 TB | 480 GB to 1.92 TB | 240 GB to 960 GB |
Sequential Read (MB/s) up to | 6,450 | 6,450 | 7,000 | 5,000 | 7,000 | 3,500 |
Sequential Write (MB/s) up to | 6,050 | 6,050 | 6,000 | 4,300 | 6,000 | 3,400 |
Random Reads IOPS up to | 1,090,000 | 1,091,000 | 900,000 | 800,000 | 900,000 | 600,000 |
Random Writes IOPS up to | 1,107,000 | 1,245,000 | 950,000 | 1,100,000 | 950,000 | 750,000 |
Endurance (TBW)3 up to | 120,000 TB | 40,000 TB | 5,760 TB | 4,170 TB | 2,880 TB | 1,440 TB |
Reliability MTBF @ 25°C | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours |
Dimensions (mm)4 | 80.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) / 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) / 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.6 | 80.0 x 22.0 x 2.4 | 42.0 x 22.0 x 3.6 | 30.0 x 22.0 x 3.6 |
Certifications | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL |
Warranty | 5 years | 2 years | 2 years | 2 years | 2 years | 2 years |
1. 150K P/E cycle configuration drive available on a project basis.
2. Product specifications may be subject to change.
3. Under highest Sequential write value. May vary by density, configuration and applications.
4. M.2 2280-D6-M form factor (max height: 3.85mm), offers Hardware Based Power Loss Protection. M.2 2280-D2-M form factor (max height: 3.6mm), provides Firmware Based Power Loss Protection.