提供用户友好的界面，用于监视闪存产品的健康状态和预期寿命。

Building upon ATP's Hardware-based power loss protection in high-quality Polymer Tantalum capacitors, a microcontroller unit, and a power IC to safeguard data during power loss events, the ATP PLP Diag feature proactively checks the functionality and health status of the polymer tantalum capacitors, averting PLP failure resulting from defective capacitors. The innovative PLP Diag feature actively monitors capacitor health, If capacitors fail, the SSD reacts by switching to Direct TLC mode, bypassing DRAM caching for writes. Users can also verify PLP status through SMART commands, ensuring continuous data protection and system reliability

AcuCurrent combines ATP Electronics’ proprietary firmware and microcontroller technology to dynamically fine-tune the SSD in real time. This ensures optimal signal integrity across all current routes amidst diverse environments, operational usages and conditions, and NAND flash intricacies — ultimately delivering enhanced performance, fortified lifespan and reliability, and operational consistency. Acucurrent minimizes unnecessary read retries, resulting in low latency, minimized errors, and greater data precision. Additionally, temperature-responsive current adjustments strengthen resilience to extreme temperature deviations within operating ranges of up to 125°C.

ATP's EcoFlush feature enhances SSD performance and longevity by optimizing flush cache commands. While certain host systems are designed to often issue frequent flush commands to prevent data loss during power failures, this can lead to excessive writes and increased wear on NAND flash memory. EcoFlush, integrated into ATP's hardware-based power loss protection SSDs, can be activated during initialization from the SSD production process upon request, intelligently manages flush cache commands by executing them at the SSD’s optimal intervals rather than responding to every host request. This approach results in better SSD endurance with 10 times lower Write Amplification Index (WAI) and 10 times better 4K random write performance at certain conditions.

在-40°C至85°C的极端温度下的操作稳定性。

封装所有裸露组件以提供保护和屏蔽的制造过程。

ATP e.MMC采用153球细间距球栅阵列（FBGA）封装，并直接焊接到印刷电路板上，即使在艰苦的操作过程中，也能抗振动，从而获得可靠的性能。