M.2 NVMe
主な特長
- 卓越したリード/ライト性能
- エラー訂正のためのLDPC&RAIDデータリカバリー
- ダイナミック温度スロットル
- グローバル・ウエア・レベリング
- トリム機能サポート
説明
NVMeプロトコル対応のM.2 SSDモジュールは、エンタープライズ・ストレージ・システムの応答性能改善に要求される劇的なスピード・性能を実現する超高速なPCIeインターフェースを活用しています。ATPのNVMe SSDは、SATA 6Gb/sの4~6倍の速度、3倍のLatency性能、より高いIOPS性能を有し、PCIe 3.0x4 スロット(1レーン当たり8Gb/s)で32Gb/sの性能をを実現します。-40℃から+85℃までのインダストリアル動作温度で、ATPのNVMe SSDは極限の温度環境下でさえ信頼性の高い性能を発揮します。ダイナミック温度スロットル機能は、速度を自動的に調節することにより、重い負荷の掛かる作業をより低温な状態で、性能を劣化させることなく実行します。
ATP M.2 2280 NVMeモジュール製品は、3D MLC NANDを採用し、NVMe 1.2スペックに対応しています。1TBまでのメモリー容量の製品を有し、Sequencial Read 2,540 MB/s、Sequencial Write 1,100 MB/s、100,000 IOPSまでの性能を発揮します。
メカニカル・ドライブの限界を乗り越えて設計されたNVMeは、より高速で、現行のNANDフラッシュのような不揮発性メモリーや将来の不揮発性メモリー技術を使用したストレージ・デバイスへの効果的なアクセスを可能にします。これらのSSDは、高速性、信頼性、耐久性が求められる用途に対して貢献します。
仕様最新のアップデート: 2022-08-17 11:02
M.2 NVMe | ||||||||||||
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Product Line | Premium | Premium | Superior | Superior | Superior | Superior | Superior | Superior | Value | Value | Value | Value |
Naming | N750Pi (High Endurance) | N700Pi | N700Si | N700Sc | N650Si (High Endurance) | N650Sc (High Endurance) | N600Si | N600Sc | N600Vc | N600Vc | N600Vi | N600Vc |
Interface | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 |
Flash Type | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC (TLC Mode) | 3D TLC (TLC Mode) |
Form Factor | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2230-S4-M | M.2 2230-S4-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280 S2-M | M.2 2242 D5-M | M.2 2230-S4-M | M.2 2230-S4-M |
Operating Temperature (Tcase)1 | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | 0°C to 70°C | -40°C to 85°C | 0°C to 70°C | -40°C to 85°C | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C | -40°C to 85°C | 0°C to 70°C |
Power Loss Protection Options | Hardware + Firmware Based | Hardware + Firmware Based | Firmware Based | Firmware Based | Hardware + Firmware Based or Firmware Based | Hardware + Firmware Based or Firmware Based | Hardware + Firmware Based or Firmware Based | Hardware + Firmware Based or Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | - | - | - | - |
Capacity | 40 GB to 320 GB | 40 GB to 640 GB | 40 GB / 80 GB / 160 GB | 40 GB / 80 GB / 160 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120 GB to 1,920 GB | 120 GB to 1,920 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120GB / 240GB / 480GB | 120GB / 240GB / 480GB |
Sequential Read (MB/s) up to | 3,150 | 3,150 | 2,000 | 2,000 | 3,420 | 3,420 | 3,420 | 3,420 | 2,600 | 2,600 | 2,000 | 2,000 |
Sequential Write (MB/s) up to | 2,670 | 2,820 | 1,600 | 1,600 | 3,050 | 3,050 | 3,050 | 3,050 | 1,870 | 1,870 | 1,570 | 1,570 |
Random Reads IOPS (4K, QD32) up to | 147,789 | 147,789 | 135,600 | 135,600 | 222,700 | 222,700 | 225,200 | 225,200 | 184,300 | 184,300 | 135,600 | 135,600 |
Random Writes IOPS (4K, QD32) up to | 114,227 | 114,227 | 112,000 | 112,000 | 176,600 | 176,600 | 179,200 | 179,200 | 145,900 | 145,900 | 112,000 | 112,000 |
Endurance (TBW)2 up to | 16,000 TB | 21,300 TB | 4,280 TB | 4,280 TB | 4,640 TB | 4,640 TB | 5,585 TB | 5,585 TB | 1,536 TB | 1,536 TB | 768 TB | 768 TB |
Reliability MTBF @ 25°C | >2,000,000 hours | >2,000,000 hours | >1,500,000 hours | >1,500,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | 2,000,000 hours | 2,000,000 hours | >1,500,000 hours | >1,500,000 hours |
Dimensions: L x W x H (mm) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 30.0 x 22.0 x 2.5 | 30.0 x 22.0 x 2.5 | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 2.2 | 42.0 x 22.0 x 3.6 | 30.0 x 22.0 x 2.5 | 30.0 x 22.0 x 2.5 |
Certifications | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH |
Warranty | 5 years | 5 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years |
1 Case Temperature, the composite temperature as indicated by SMART temperature attributes.
2 Under highest Sequential write value. May vary by density, configuration and applications.
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テクノロジー & 追加サービス | 製品ラインナップ | ||
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ダウンロード
- ATP_SATA_NVMe_Value line product family flyer _v1.0_2022
- ATP M.2 NVMe product flyer