M.2 NVMe

主な特長

  • 卓越したリード/ライト性能
  • エラー訂正のためのLDPC&RAIDデータリカバリー
  • ダイナミック温度スロットル
  • グローバル・ウエア・レベリング
  • トリム機能サポート

説明

NVMeプロトコル対応のM.2 SSDモジュールは、エンタープライズ・ストレージ・システムの応答性能改善に要求される劇的なスピード・性能を実現する超高速なPCIeインターフェースを活用しています。ATPのNVMe SSDは、SATA 6Gb/sの4~6倍の速度、3倍のLatency性能、より高いIOPS性能を有し、PCIe 3.0x4 スロット(1レーン当たり8Gb/s)で32Gb/sの性能をを実現します。-40℃から+85℃までのインダストリアル動作温度で、ATPのNVMe SSDは極限の温度環境下でさえ信頼性の高い性能を発揮します。ダイナミック温度スロットル機能は、速度を自動的に調節することにより、重い負荷の掛かる作業をより低温な状態で、性能を劣化させることなく実行します。 

ATP M.2 2280 NVMeモジュール製品は、3D MLC NANDを採用し、NVMe 1.2スペックに対応しています。1TBまでのメモリー容量の製品を有し、Sequencial Read 2,540 MB/s、Sequencial Write 1,100 MB/s、100,000 IOPSまでの性能を発揮します。 

メカニカル・ドライブの限界を乗り越えて設計されたNVMeは、より高速で、現行のNANDフラッシュのような不揮発性メモリーや将来の不揮発性メモリー技術を使用したストレージ・デバイスへの効果的なアクセスを可能にします。これらのSSDは、高速性、信頼性、耐久性が求められる用途に対して貢献します。

Hot Items Ordering Information
Product Line Capacity1 Operating Temperature2 Power Loss Protection3 SED4 P/N
N650Si 120GB -40°C to 85°C Hardware + Firmware Based - AF120GSTJA-8BCIP
N650Si 240GB -40°C to 85°C Hardware + Firmware Based - AF240GSTJA-8BCIP
N650Si 480GB -40°C to 85°C Hardware + Firmware Based - AF480GSTJA-8BCIP
N650Si 960GB -40°C to 85°C Hardware + Firmware Based - AF960GSTJA-8BCIP
N650Sc 120GB 0°C to 70°C Hardware + Firmware Based - AF120GSTJA-8BCXP
N650Sc 240GB 0°C to 70°C Hardware + Firmware Based - AF240GSTJA-8BCXP
N650Sc 480GB 0°C to 70°C Hardware + Firmware Based - AF480GSTJA-8BCXP
N650Sc 960GB 0°C to 70°C Hardware + Firmware Based - AF960GSTJA-8BCXP
N600Sc 120GB 0°C to 70°C Hardware + Firmware Based - AF120GSTJA-8BAXP
N600Sc 240GB 0°C to 70°C Hardware + Firmware Based - AF240GSTJA-8BAXP
N600Sc 480GB 0°C to 70°C Hardware + Firmware Based - AF480GSTJA-8BAXP
N600Sc 960GB 0°C to 70°C Hardware + Firmware Based - AF960GSTJA-8BAXP
N600Sc 1920GB 0°C to 70°C Hardware + Firmware Based - AF1T92STJA-8BAXP
N600Sc 120GB 0°C to 70°C Firmware Based - AF120GSTJA-8BAXX
N600Sc 240GB 0°C to 70°C Firmware Based - AF240GSTJA-8BAXX
N600Sc 480GB 0°C to 70°C Firmware Based - AF480GSTJA-8BAXX
N600Sc 960GB 0°C to 70°C Firmware Based - AF960GSTJA-8BAXX
N600Sc 1920GB 0°C to 70°C Firmware Based - AF1T92STJA-8BAXX
N600Vc (M.2 2280) 120GB 0°C to 70°C Firmware Based - AF120GSTJA-DBCXX
N600Vc (M.2 2280) 240GB 0°C to 70°C Firmware Based - AF240GSTJA-DBCXX
N600Vc (M.2 2280) 480GB 0°C to 70°C Firmware Based - AF480GSTJA-DBCXX
N600Vc (M.2 2242) 120GB 0°C to 70°C Firmware Based - AF120GSTJC-DBBXX
N600Vc (M.2 2242) 240GB 0°C to 70°C Firmware Based - AF240GSTJC-DBBXX
N600Vc (M.2 2242) 480GB 0°C to 70°C Firmware Based - AF480GSTJC-DBBXX
N600Vc (M.2 2242) 960GB 0°C to 70°C Firmware Based - AF960GSTJC-DBBXX
1 Amount of actual usable storage that can be utilized.
2 Refers to Case Temperature range during device operation, as indicated by SMART temperature attributes.
3 Hardware + Firmware-based power loss protection design with Level 4 (data-in-flight) protection; Firmware-based power loss protection design with Level 1 (data-at-rest) protection.
4 Allows data written to and read from the SSD to be constantly and automatically encrypted and decrypted. Conforms to TCG Opal 2.0 and uses AES 256-bit HW encryption.

仕様最新のアップデート: 2022-08-17 11:02

M.2 NVMe
Product LinePremiumPremiumSuperiorSuperiorSuperiorSuperiorSuperiorSuperiorValueValueValue Value
NamingN750Pi (High Endurance)N700PiN700SiN700ScN650Si (High Endurance)N650Sc (High Endurance)N600SiN600ScN600VcN600VcN600ViN600Vc
InterfacePCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4
Flash Type3D TLC (pSLC mode)3D TLC (pSLC mode)3D TLC (pSLC mode)3D TLC (pSLC mode)3D TLC3D TLC3D TLC3D TLC3D TLC3D TLC3D TLC (TLC Mode)3D TLC (TLC Mode)
Form FactorM.2 2280-D2-MM.2 2280-D2-MM.2 2230-S4-MM.2 2230-S4-MM.2 2280-D2-MM.2 2280-D2-MM.2 2280-D2-MM.2 2280-D2-MM.2 2280 S2-MM.2 2242 D5-MM.2 2230-S4-MM.2 2230-S4-M
Operating Temperature (Tcase)1-40°C to 85°C-40°C to 85°C-40°C to 85°C0°C to 70°C-40°C to 85°C0°C to 70°C-40°C to 85°C0°C to 70°C0°C to 70°C0°C to 70°C-40°C to 85°C0°C to 70°C
Power Loss Protection OptionsHardware + Firmware BasedHardware + Firmware BasedFirmware BasedFirmware BasedHardware + Firmware Based or Firmware BasedHardware + Firmware Based or Firmware BasedHardware + Firmware Based or Firmware BasedHardware + Firmware Based or Firmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware Based
Optional SED FeaturesAES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0----
Capacity40 GB to 320 GB 40 GB to 640 GB40 GB / 80 GB / 160 GB40 GB / 80 GB / 160 GB120 GB to 960 GB120 GB to 960 GB120 GB to 1,920 GB120 GB to 1,920 GB120 GB to 960 GB120 GB to 960 GB120GB / 240GB / 480GB120GB / 240GB / 480GB
Sequential Read (MB/s) up to3,1503,1502,0002,0003,4203,4203,4203,4202,6002,6002,0002,000
Sequential Write (MB/s) up to2,6702,8201,6001,6003,0503,0503,0503,0501,8701,8701,5701,570
Random Reads IOPS (4K, QD32) up to147,789147,789135,600135,600222,700222,700225,200225,200184,300184,300135,600135,600
Random Writes IOPS (4K, QD32) up to114,227114,227112,000112,000176,600176,600179,200179,200145,900145,900112,000112,000
Endurance (TBW)2 up to16,000 TB21,300 TB4,280 TB4,280 TB4,640 TB4,640 TB5,585 TB5,585 TB1,536 TB1,536 TB768 TB768 TB
Reliability MTBF @ 25°C>2,000,000 hours>2,000,000 hours>1,500,000 hours>1,500,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours2,000,000 hours2,000,000 hours>1,500,000 hours>1,500,000 hours
Dimensions: L x W x H (mm)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)30.0 x 22.0 x 2.530.0 x 22.0 x 2.580.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 2.242.0 x 22.0 x 3.630.0 x 22.0 x 2.530.0 x 22.0 x 2.5
CertificationsCE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACH CE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACH CE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACHCE, FCC, BSMI, UKCA, RoHS, REACH
Warranty5 years5 years2 years2 years2 years2 years2 years2 years2 years2 years2 years2 years

1 Case Temperature, the composite temperature as indicated by SMART temperature attributes.
2 Under highest Sequential write value. May vary by density, configuration and applications.

技術View All Technologies

テクノロジー & 追加サービス製品ラインナップ
PremiumSuperiorValue
S.M.A.R.T.
S.M.A.R.T.
available
available
available
Hardware-based Power Loss Protection
Hardware-based Power Loss Protection
available
available
available
AutoRefresh
AutoRefresh
available
available
available
Advanced Wear Leveling
Advanced Wear Leveling
available
available
available
Dynamic Data Refresh
Dynamic Data Refresh
available
available
available
End-to End Data Protection
End-to End Data Protection
available
available
available
Secure Erase
Secure Erase
customizable
customizable
TCG Opal 2.0
TCG Opal 2.0
available
available
Industrial Temperature
Industrial Temperature
available
customizable
Anti-Sulfur Resistors
Anti-Sulfur Resistors
customizable
customizable
customizable
Conformal Coating
Conformal Coating
customizable
customizable
customizable
customizable:プロジェクトごとにカスタマイズ対応が可能

ダウンロード

  • ATP_SATA_NVMe_Value line product family flyer _v1.0_2022
    English
    2022-07-212.27MB
  • ATP M.2 NVMe product flyer
    English
    2022-07-211.38MB
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