e.MMC Smaller Footprint
主な特長
- 小型フットプリントのパッケージサイズ*
- 自動省電力モードおよび電力最適化技術*
- 強固なデータ整合性*（AutoRefresh および Dynamic Data Refresh）
- JEDEC e.MMC v5.1標準（JESD84-B51）準拠
- 153ボール / 125ボール FBGA（RoHS準拠の「グリーンパッケージ」）
- LDPC ECCエンジン
説明
ATP ElectronicsのE600シリーズe.MMCは、JEDEC準拠の標準サイズe.MMCの利点を維持しながら、究極の省電力・省スペースを実現する次世代e.MMCソリューションです。エネルギー効率と実装面積が重視される用途に最適です。
E600シリーズは、標準e.MMCをこれまでにない最小サイズへと大胆に小型化し、サイズの限界を打ち破ります。世界最小クラスの 7.2 × 7.2 mm パッケージで提供され、高性能、強固な信頼性、超低消費電力を実現。スマートウェアラブルや IoT 機器などの用途に最適です。
高度な電力管理とファームウェアチューニングにより大幅な省電力化を実現し、25°C〜85°Cの商用動作温度範囲で優れた耐熱性を発揮します。用途に応じた柔軟なストレージ構成、強力なデータ保護、耐振設計により、激しい衝撃下でも高い信頼性と耐久性を提供します。
仕様最新のアップデート: 2025-12-24 14:40
| Smaller Footprint e.MMC | |||
|---|---|---|---|
| Product Name | Smaller Footprint e.MMC | Smaller Footprint e.MMC | Smaller Footprint e.MMC |
| Product Line | Value | Value | Value |
| Naming | E600Vc | E600Vi | E600Vc |
| Flash Type | 3D TLC | 3D TLC | 3D TLC |
| IC Package | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA |
| JEDEC Specification | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 |
| Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based |
| Operating Temperature | -25°C to 85°C | -40°C to 85°C | -25°C to 85°C |
| Capacity | 64 GB to 128 GB | 32 GB to 64 GB | 32 GB to 64 GB |
| Sequential Read/Write up to (MB/s) (Max.) | 240 / 220 | 290 / 225 | 290 / 225 |
| Bus Speed Modes | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 |
| ICC (Typical RMS in Read/Write) mA (Max.) | 35 / 45 | 100 / 110 | 100 / 110 |
| ICCQ (Typical RMS in Read/Write) mA (Max.) | 60 / 55 | 105 / 100 | 105 / 100 |
| Endurance TBW (Max.) 1 | 24 TB | 55 TB | 55 TB |
| Reliability MTBF @ 25°C | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours |
| Dimensions (mm) | 7.2 x 7.2 x 0.8 | 9.0 x 10.0 x 0.8 | 9.0 x 10.0 x 0.8 |
| Certifications | RoHS, REACH | RoHS, REACH | RoHS, REACH |
| Warranty | One Year | One Year | One Year |
1 All performance is collected or measured using ATP proprietary test environment, without file system overhead.
技術View All Technologies
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関連リソース
No doubt, each ATP e.MMC is manufactured to the highest and most stringent standards to make sure that it meets the rigid requirements of industrial applications. The ATP culture of excellence, however, extends after the product is finished. Further processes are taken to ensure that each product coming out of ATP's manufacturing facilities meet and even exceed expectations.
Below is a sneak peek into the meticulous processes that the ATP e.MMC goes through before it is shipped out.
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Ensuring Product Traceability Laser imprints important information to identify each piece for accurate tracking and efficient inventory management. |
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Rapid Diagnostic Test (RDT) RDT is performed to evaluate product reliability under extreme temperatures and to catch early and latent defects. ATP e.MMC devices are loaded into a specially designed RDT chamber for thermal cycling tests at both low (-40°C) and high (85°C) temperatures. ATP can perform high-volume testing according to customer request.
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Automated Final Screening A special machine performs high-speed automated initialization and screening to make sure that errors and failed parts not caught during the production stage are effectively screened out before the product is packaged.
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Protective Packaging Finally, the ATP e.MMC is vacuum-sealed, removing all the air from the packaging, including humidity and moisture that could cause corrosion. Vacuum packaging also safeguards the ATP e.MMC against environmental hazards that could cause damage while the devices are stored or in transit.
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ATP delivers total solutions by manufacturing not only best-in-class products, but also offering top-notch services. By project support and customer request, ATP offers value-added services such as Joint Validation, where ATP conducts compatibility and function tests with client-supplied host devices and systems to proactively detect and minimize failures that may not have been caught in production tests. ATP also guarantees long product cycles with a longevity commitment of over 5 years for MLC NAND-based e.MMC.
Find out how the industrial e.MMC and other ATP flash memory and storage products can meet your diverse data storage requirements.
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