M.2 2230 Solid State Drive

ATP Introduces High-Endurance M.2 2230 SSDs Packed with Customizable Security Features

2022-08-02

                                

Taipei, Taiwan (August 2022) – ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest 3D triple-level cell (TLC) flash storage solid state drives (SSDs): the N700 and N600 Series, which support the high-speed PCIe 3.0 interface x4 lanes and NVMe protocol.

The new SSDs offer hardware-based security features, such as Write Protection and Quick Erase, by project and customer request. Enabled through the general input/output (GPIO) pins, HW Write Protect puts the SSD in “Read Only” mode, thus preventing the modification or tampering of stored data. HW Quick Erase, on the other hand, initiates a block-by-block data pattern write operation to systematically erase any trace of user data.

Available as M.2 2230 modules, they offer better power efficiency and are suitable for applications using small and light systems such as point-of-sale (POS) systems, mobile PCs, Internet of Things (IoT) devices, and server boot applications.

The N700 and N600 Series accommodate a heatsink ball-grid array (HSBGA) on the M.2 2230 form factor. For customers who prefer a soldered-down, vibration-proof solution, ATP also offers M.2 Type 1620 HSBGA SSDs with the same firmware and NAND configuration.

The N700 Series is configured as pseudo single-level cell (pSLC) NAND flash for increased reliability and endurance. It is available in capacities of 40/80/160 GB, supports I-Temp ranges from -40°C to 85°C (N700Si) as well as C-Temp from 0°C to 70°C (N700Sc), and offers maximum endurance of up to 4,280 TB.

The N600 Series in native TLC is available in capacities of 120/240/480 GB, supports C-Temp operating temperature ranges from 0°C to 70°C, and offers maximum endurance of up to 768 TB.

N700/N600 Series SSDs are built and thoroughly tested to withstand the demands of industrial applications even in harsh operating conditions.

 

N700 Series Key Features

 

  • pSLC Mode for higher reliability and endurance
  • Sustainable performance with ATP Optimized Thermal Throttling firmware (FW), which prevents drastic performance drops that adversely impact the system
  • Low power consumption at just 5 mW under Power State 4 (Sleep Mode) delivers huge power savings
  • Host Memory Buffer (HMB) support for DRAM-less SSDs improve random read performance
  • Support for additional power signals to protect data against forced shutdowns.
    • Power Loss Notification (PLP_INIT#) - allows the host to initialize the flushing of data to the SSD before powering off.
    • Power Loss Acknowledge (PLP_FBCK#) - the SSD provides a signal that indicates the status of preparation for a power loss and starts flushing data after PLP_INIT# is executed.
  • Customizable Options (by request and project support)
    • HW Write Protect
    • HW Erase
      • Quick Erase
      • Secure Erase (AFSSI-5020)
    • AES-256 Encryption
    • TCG Opal 2.0

 

N600 Series Key Features

 

  • Sustainable performance with ATP Optimized Thermal Throttling firmware (FW), which prevents drastic performance drops that adversely impact the system
  • Low power consumption at just 5 mW under Power State 4 (Sleep Mode) delivers huge power savings
  • Host Memory Buffer (HMB) support for DRAM-less SSDs improve random read performance

 

Product Specifications

 

M.2 2230
Product Line
Superior Value
N700Si N700Sc N600Vi N600Vc
Interface PCIe G3 x4 PCIe G3 x4 PCIe G3 x4 PCIe G3 x4
Flash Type 3D TLC
(pSLC mode)
3D TLC
(pSLC mode)
3D TLC
(TLC Mode)
3D TLC
(TLC Mode)
Form Factor M.2 2230-S4-M M.2 2230-S4-M M.2 2230-S4-M M.2 2230-S4-M
Operating Temperature (Tcase)1 -40°C to 85°C 0°C to 70°C -40°C to 85°C 0°C to 70°C
Power Loss Protection Options Firmware Based Firmware Based Firmware Based Firmware Based
Optional SED Features AES 256-bit Encryption, TCG Opal 2.0 AES 256-bit Encryption, TCG Opal 2.0 - -
Capacity 40 GB / 80 GB / 160 GB 40 GB / 80 GB / 160 GB 120GB / 240GB / 480GB 120GB / 240GB / 480GB
Performance
Sequential Read (MB/s) up to 2,000 2,000 2,000 2,000
Sequential Write (MB/s) up to 1,600 1,600 1,570 1,570
Random Reads IOPS (4K, QD32) up to 135,600 135,600 135,600 135,600
Random Writes IOPS (4K, QD32) up to 112,000 112,000 112,000 112,000
Endurance and Reliability
Endurance (TBW)2 up to 4,280 TB 4,280 TB 768 TB 768 TB
Reliability
MTBF @ 25°C
>1,500,000 hours >1,500,000 hours >1,500,000 hours >1,500,000 hours
Others
Dimensions: L x W x H (mm) 30.0 x 22.0 x 2.5 30.0 x 22.0 x 2.5 30.0 x 22.0 x 2.5 30.0 x 22.0 x 2.5
Certifications CE, FCC, BSMI, UKCA, RoHS, REACH
Warranty 2 years
1 Case Temperature, the composite temperature as indicated by SMART temperature attributes.
2 Under highest Sequential write value. May vary by density, configuration, and applications.

 

 

 

 

For more information on the product, visit:

https://www.atpinc.com/products/industrial-ssds-nvme-m.2-wide-temperature

https://www.atpinc.com/products/BGA-SSD-NVMe-industrial

Media Contact on the Press Release: Kelly Lin (Kellylin[at]tw.atpinc.com)

Follow ATP Electronics on LinkedIn: https://www.linkedin.com/company/atp-electronics

==========

About ATP

ATP Electronics (“ATP”) has dedicated 30 years of manufacturing excellence as the premier provider of memory and NAND flash storage products for rigorous embedded/industrial/automotive applications. As the “Global Leader in Specialized Storage and Memory Solutions,” ATP is known for its expertise in thermal and high-endurance solutions. ATP is committed to delivering add-on value, differentiation and best TCO for customers. A true manufacturer, ATP manages every stage of the manufacturing process to ensure quality and product longevity. ATP upholds the highest standards of corporate social responsibility by ensuring sustainable value for workers, the environment, and business throughout the global supply chain. For more information on ATP Electronics, please visit www.atpinc.com or contact us at info[at]atpinc.com.

ニュースリリースへ戻る
マーケティング&PRに関するお問い合わせ
お問い合わせ