M.2 NVMe

Key Features

  • Superior Read/Write performance
  • LDPC & RAID Data Recovery for error correction
  • Thermal Management Solutions* Customization available on a project basis.
  • Global wear leveling
  • TRIM function support
  • End-to End Data Protection
  • MCU-based Power Loss Protection Design (May vary by product and project support.)

Description

M.2 solid state modules based on the NVMe™protocol leverage the blazing-fast PCI Express® (PCIe®) interface to deliver dramatic improvements in speed and performance to fulfill the increasing demand for responsiveness in enterprise storage systems and to support the growing data-hungry needs of today’s enterprise. Delivering 32 Gb/s bandwidth on a PCIe 3.1 x4 slot (8 Gb/s per lane), ATP NVMe SSDs outperform Serial ATA 6 Gb/s SSDs with 4-6X faster access, over 3X lower latency, and higher Input/Output per Second (IOPS). ATP NVMe SSDs with industrial operating temperature rating deliver stable performance even in extreme temperatures ranging from -40°C to 85°C, while Dynamic Thermal Throttling automatically adjusts the speed to maintain cooler operation under intense and heavy workloads. 

Adopting NVMe 1.3 specifications and integrating 3D NAND TLC technology, ATP’s M.2 2280 NVMe modules offer up to 1.92TB of memory capacity and deliver boosted performance with sequential read up to 3,280 MB/s, sequential write up to 3,050 MB/s, and random IOPS up to 211,200.

Designed to move past the limitations of mechanical drives, NVMe was specifically built from the ground up for faster, more efficient access to storage devices with non-volatile memory such as current NAND flash solutions and future non-volatile memory technologies. These SSDs can deliver fast, reliable and durable performance for any demanding application.

Specifications

M.2 NVMe
Product Name2280-D2-M2280-D2-M
Product LineSuperiorSuperior
NamingN600SiN600Sc
Flash Type3D TLC3D TLC
Density120 GB to 1920 GB120 GB to 1920 GB
Performance Sequential Read up to (MB/s)3,4203,420
Performance Sequential Write up to (MB/s)3,0503,050
Performance Random Read IOPS up to (4K, QD32)225,200225,200
InterfacePCIe G3 x4PCIe G3 x4
Operating Temperature (Tcase)*-40°C to 85°C0°C to 70°C
Endurance TBW** (max.)5,585 TB5,585 TB
Reliability MTBF @ 25°C>2,000,000 hours>2,000,000 hours
Dimensions: L x W x H (mm)80.0 x 22.0 x 3.580.0 x 22.0 x 3.5
* Case Temperature, the composite temperature as indicated by SMART temperature attributes.
** Under highest Sequential write value. May vary by density, configuration and applications.

Product Line

Technologies & Add-On ServicesProduct Line
Superior
S.M.A.R.T.
S.M.A.R.T.
available
Hardware-based Power Loss Protection
Hardware-based Power Loss Protection
available
Advanced Wear Leveling
Advanced Wear Leveling
available
AutoRefresh
AutoRefresh
available
Dynamic Data Refresh
Dynamic Data Refresh
available
Secure Erase
Secure Erase
customizable
Industrial Temperature
Industrial Temperature
available
Anti-Sulfur Resistors
Anti-Sulfur Resistors
customizable
Conformal Coating
Conformal Coating
customizable
End-to End Data Protection
End-to End Data Protection
available
TCG Opal 2.0
TCG Opal 2.0
customizable
customizable:Customization option available on a project basis.

Downloads

  • ATP_NVMe_flyer
    English
    2021-02-191.35MB
Contact Us