PCIe® Gen 3 NVMe M.2 Type 1620 HSBGA SSD

Key Features

  • PCIe Gen3 x4, NVMe 1.3, M.2 Type 1620
  • pSLC mode with 2X-3X of Sustainable Performance*
  • High/Stable performance with Optimized Thermal Throttling Firmware/Heatsink (HSBGA)
  • Optimized Power Consumption: 5 mW during Power State 4
  • DRAM-less configuration supporting Host Memory Buffer (HMB)*
  • Optional Security features available**
  • * Under highest Sequential write value. May vary by density, configuration and applications.
  • ** Customization available on a project basis

Description

Despite their ultra-small form factor, ATP’s N700 Series NVMe Heat Sink Ball Grid Array (HSBGA) solid state drives (SSDs) surprisingly pack a mean punch. These SSDs with high-speed PCIe 3.0 interface x4 lanes and NVMe protocol deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane, while dimensions of just 16 (L) x 20 (W) x 1.6 (H) mm, the M.2 Type 1620 form factor, and 291-ball packaging take up minimal space within tightly confined systems.

N700 Series SSDs are configured with pseudo single-level cell (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and lifetime of the NAND flash memory, while benefiting from the lower cost compared with native SLC,due to the higher cell density.

These diminutive powerhouses store hefty capacities of 40/80/160 GB and are packed with advanced features to meet the ultra-portability and reliability requirements of ultra-compact Internet of Things (IoT) devices and embedded systems. They provide high-speed reliable storage in harsh environments such as in transportation, aerospace, smart factories, mining operations, steel fabrication and more.

N700 Series Key Features:

 

pSLC Mode 
Configured to store only one bit per cell to increase endurance and reliability, offering 2X-3X sustainable performance.

Stable Performance
The ATP Optimized Thermal Throttling firmware (FW) will maintain the “Steady State” condition to avoid huge performance drops that will adversely impact the system, thus optimizing best performance for application requests and enhancing overall sustained performance.

Optimized Power Consumption 
Consuming low power at only 5 mW during Power State 4 (Sleep Mode), the ATP NVMe HSBGA SSDs deliver huge power savings.

DRAM-Less Configuration 
Host Memory Buffer (HMB) support helps these DRAM-less SSDs to improve performance by obtaining DRAM resources as cache, thus overcoming the limited memory capacity within the storage and optimizing I/O performance without requiring the SSD to bring up its own DRAM

Vibration-Resistant Storage 
ATP N700 Series SSDs are soldered down, making them vibration-resistant and able to withstand rigorous shaking.

Better Thermal Dissipation
The heatsink effectively transfers heat to cool the device and keep the performance at optimal levels.

Optional Security Features
• HW Write Protect 
• HW Quick Erase
• HW Secure Erase (Data Sanitization) (AFSSI-5020)
• AES-256 Encryption
• TCG Opal 2.0

SpecificationsLatest Update: 2023-04-07 15:58

PCIe® Gen3 NVMe M.2 Type 1620 HSBGA SSD
Product LinePremiumPremiumValue Value
NamingN700PiN700PcN600ViN600Vc
InterfacePCIe G3 x4PCIe G3 x4PCIe G3 x4PCIe G3 x4
Flash Type3D TLC (pSLC mode)3D TLC (pSLC mode)3D TLC 3D TLC
Form Factor291-Ball, HSBGA291-Ball, HSBGA291-Ball, HSBGA291-Ball, HSBGA
Operating Temperature-40°C to 85°C0°C to 70°C-40°C to 85°C0°C to 70°C
Power Loss Protection OptionsFirmware BasedFirmware BasedFirmware Based Firmware Based
Optional SED FeaturesAES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0--
Capacity40 GB to 160 GB40 GB to 160 GB120 GB to 480 GB120 GB to 480 GB
Sequential Read (MB/s) up to2,0002,0002,0502,050
Sequential Write (MB/s) up to1,6001,6001,5501,550
Random Reads IOPS up to135,600135,600138,000138,000
Random Writes IOPS up to112,000112,000112,600112,600
Endurance (TBW)1 up to4,280 TB4,280 TB768 TB768 TB
Reliability MTBF @ 25°C>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours
Dimensions (mm)16.0 x 20.0 x 1.616.0 x 20.0 x 1.616.0 x 20.0 x 1.616.0 x 20.0 x 1.6
CertificationsRoHS, REACHRoHS, REACHRoHS, REACH RoHS, REACH
Warranty1 year1 year1 year 1 year

1 Under highest Sequential write value. May vary by density, configuration and applications.

TechnologyView All Technologies

Technologies & Add-On ServicesProduct Line
PremiumValue
S.M.A.R.T.
S.M.A.R.T.
available
available
Firmware-based Power Loss  Protection
Firmware-based Power Loss Protection
available
available
AutoRefresh
AutoRefresh
available
available
Advanced Wear Leveling
Advanced Wear Leveling
available
available
Dynamic Data Refresh
Dynamic Data Refresh
available
available
End-to End Data Path Protection
End-to End Data Path Protection
available
available
Auto-Read Calibration
Auto-Read Calibration
available
Secure Erase
Secure Erase
customizable
TCG Opal 2.0
TCG Opal 2.0
customizable
Industrial Temperature
Industrial Temperature
customizable
available
SiP (System in Package)
SiP (System in Package)
available
available
Vibration-Proof BGA Package
Vibration-Proof BGA Package
available
available
Joint Validation
Joint Validation
customizable
customizable:Customization option available on a project basis.

Downloads

  • ATP NVMe HSBGA product flyer
    English
    2023-01-18337.22KB
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