NVMe HSBGA

Key Features

  • PCIe Gen3 x4, NVMe 1.3, M.2 Type 1620
  • pSLC mode with 2X-3X of Sustainable Performance* Under highest Sequential write value. May vary by density, configuration and applications.
  • High/Stable performance with Optimized Thermal Throttling Firmware/Heatsink (HSBGA)
  • Optimized Power Consumption: 5 mW during Power State 4
  • DRAM-less configuration supporting HMB (Host Memory Buffer)* Under highest Sequential write value. May vary by density, configuration and applications.
  • Optional Security features available** Optional, by project support.

Description

Despite their ultra-small form factor, ATP’s N700 Series NVMe Heat Sink Ball Grid Array (HSBGA) solid state drives (SSDs) surprisingly pack a mean punch. These SSDs with high-speed PCIe 3.0 interface x4 lanes and NVMe protocol deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane, while dimensions of just 16 (L) x 20 (W) x 1.6 (H) mm, the M.2 Type 1620 form factor, and 291-ball packaging take up minimal space within tightly confined systems.

N700 Series SSDs are configured with pseudo single-level cell (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and lifetime of the NAND flash memory, while benefiting from the lower cost compared with native SLC,due to the higher cell density.

These diminutive powerhouses store hefty capacities of 40/80/160 GB and are packed with advanced features to meet the ultra-portability and reliability requirements of ultra-compact Internet of Things (IoT) devices and embedded systems. They provide high-speed reliable storage in harsh environments such as in transportation, aerospace, smart factories, mining operations, steel fabrication and more.

N700 Series Key Features:

 

pSLC Mode 
Configured to store only one bit per cell to increase endurance and reliability, offering 2X-3X sustainable performance.

Stable Performance
The ATP Optimized Thermal Throttling firmware (FW) will maintain the “Steady State” condition to avoid huge performance drops that will adversely impact the system, thus optimizing best performance for application requests and enhancing overall sustained performance.

Optimized Power Consumption 
Consuming low power at only 5 mW during Power State 4 (Sleep Mode), the ATP NVMe HSBGA SSDs deliver huge power savings.

DRAM-Less Configuration 
Host Memory Buffer (HMB) support helps these DRAM-less SSDs to improve performance by obtaining DRAM resources as cache, thus overcoming the limited memory capacity within the storage and optimizing I/O performance without requiring the SSD to bring up its own DRAM

Vibration-Resistant Storage 
ATP N700 Series SSDs are soldered down, making them vibration-resistant and able to withstand rigorous shaking.

Better Thermal Dissipation
The heatsink effectively transfers heat to cool the device and keep the performance at optimal levels.

Optional Security Features
• HW Write Protect 
• HW Quick Erase
• HW Secure Erase (Data Sanitization) (AFSSI-5020)
• AES-256 Encryption
• TCG Opal 2.0

Specifications

HSBGA M.2, Type 1620
Product LinePremiumPremium
NamingN700PiN700Pc
IC Package291-Ball, HSBGA291-Ball, HSBGA
Flash Typepseudo SLCpseudo SLC
Density*40 GB / 80 GB / 160 GB40 GB / 80 GB / 160 GB
Performance** Sequential Read up to (MB/s)2,0002,000
Performance** Sequential Write up to (MB/s)1,7001,700
Performance** Random Read IOPS up to (4K, QD32)95,00095,000
InterfacePCIe G3 x4, NVMe 1.3PCIe G3 x4, NVMe 1.3
Operating Temperature (Tcase)***-40°C to 85°C0°C to 70°C
Endurance TBW**** (max.)4,280 TB4,280 TB
Reliability MTBF @ 25°C>2,000,000 hours>2,000,000 hours
Dimensions: L x W x H (mm)16.0 x 20.0 x 1.616.0 x 20.0 x 1.6
* Full user capacity SLC Mode
** All performance is collected or measured using ATP proprietary test environment, without file system overhead.
*** Case Temperature, the composite temperature as indicated by SMART temperature attributes.
**** Under highest Sequential write value. May vary by density, configuration and applications.

Product Line

Technologies & Add-On ServicesProduct Line
Premium
S.M.A.R.T.
S.M.A.R.T.
available
Hardware-based Power Loss Protection
Hardware-based Power Loss Protection
available
AutoRefresh
AutoRefresh
available
Vibration-Proof BGA Package
Vibration-Proof BGA Package
available
Dynamic Data Refresh
Dynamic Data Refresh
available
Industrial Temperature
Industrial Temperature
customizable
SiP (System in Package)
SiP (System in Package)
available
Complete Drive Test
Complete Drive Test
available
End-to End Data Protection
End-to End Data Protection
available
TCG Opal 2.0
TCG Opal 2.0
customizable
TCG Opal
TCG Opal
customizable
customizable:Customization option available on a project basis.

Downloads

  • ATP_HSBGA SSD_flyer
    English
    2021-04-223.38MB
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