独自の課題に対するソリューション
Autonomous vehicles are powerful computing platforms that demand exacting flash storage specifications, such as uncompromising reliability, high-performance, and efficient power consumption which ensures a great user experience with utmost safety.
Vehicles that support Level 2 and 3, or even Level 4 autonomous function collect and process massive amounts of data in real time. Higher capacity solid-state storage devices are required to accommodate the ever-growing data volumes of radar, sensor, vehicle-to-everything (V2X), and lidar systems.
ATP has been providing high-quality solutions for over three decades, including specialized solutions to the world’s major automobile manufacturers and Advanced Driver Assistance Systems (ADAS) makers.
ユニークな挑戦
ソリューション
In-vehicle infotainment systems often require customization support from experienced flash storage solution providers. Challenges in operating temperatures, life cycle and write endurance cause IVI makers to demand joint validation throughout the flash product manufacturing cycle, power cycling tests, or unique content preload service.
ATP is one of the few NAND flash storage manufacturers experienced in providing all solutions to globally renowned car makers, meeting their unique reliability and longevity challenges.
ユニークな挑戦
ソリューション
In the race to develop future-generation automobiles, car makers have been acquiring extensive data from field-deployed vehicles. Mega data is the key to winning the race. In-vehicle data logging in any terrain under any weather condition is a constant challenge.
Data loggers therefore require high-density flash storage with wide temperature support, supporting steady and constant write performance rather than peak performance even at extreme temperatures, and encryption security. ATP can meet all the above requirements and even caters unique form factors that come from different data logger chassis designs.
ユニークな挑戦
ソリューション
Electric vehicle (EV) charging stations have been increasing at an amazing pace to keep up with surging EV adoption rates. While the industry is still shaping up in terms of architectural or service standards, one certain challenge is the need for remote EV infrastructure management that requires industrial grade gateways in different hierarchies. ATP offers industrial grade flash storage in modules, 16x20mm 291 ball-grid array (BGA) or e.MMC form factors, which ensure such edge nodes may be stationed unattended with ease.
ユニークな挑戦
ソリューション
The drive recorder industry has been evolving to multi-cameras structure, AI features, and increasing high-definition standards. ATP has been offering tailored flash cards for world-renowned drive recorder vendors for many years, so we know their challenges and demands. As the storage capacity doubles up, what remains unchanged is the demand for high endurance, low latency response time, steady write performance, wide operating temperature support, and reliability under irregular power on/off conditions, shock, and card insertion-related damage. ATP answers all the above and beyond, offering extra services, such as customized testing and joint validation.
ユニークな挑戦
ソリューション
注目技術
インダストリアル温度対応
-40℃から+85℃までの高低温度環境での安定動作
ハードウェアベース電断保護回路
ハードウェアでの電源不良防止機能は、最後の読み・書き・消去コマンドを完了させ、不揮発性フラッシュメモリに格納 し、電源遮断によるデータ喪失を防ぎます。一部のNVMe モジュールとSATA SSDには新しいマイクロコントローラユニットが搭載されています。 MCUベースの設計によりPLPアレイが様々な温度、電力グリッチ、充電状態でインテリジェントに動作し、デバ イスとデータの両方を保護します。
ファームウェアベースの電断保護
ファームウェアベースの電断保護は、電源が失われる前にデバイスに書き込まれたデータを効果的に保護します。ライト操作が正常に完了したという信号をデバイスからホストが受信した後、突然の電源喪失が発生した場合でも、新しく書き込まれたデータと以前に書き込まれたデータは保護されます。
耐振動BGAパッケージ
はんだ付けされたソリューションは、振動に強く、過酷な環境での動作中でも信頼の高いパフォーマンスを出すことができます。
SED (AES 256-bit Encryption, TCG Opal 2.0)
TCG Opal Security Subsystem Class (SSC) 2.0は、データを盗難や改竄から保護するためのセキュリティ管理標準を規定する自己暗号化ドライブの仕様です。セキュリティ機能は、ハードウェアベースのデータ暗号化、起動前認証(PBA) 及びデータ機密性を保護するためのAES-128/256データ暗号化が含まれます。
SecurEncrypt
AES-256 encryption for the User Data area.
共同検証
ATPは、量産テストでは検出困難なエラーを未然に防ぐために、お客様から提供頂いたホストデバイス及びシステムを使った互換性・機能テストを評価段階で実施し、品質向上に役立てています。
推奨製品
仕様
製品を見るPCIe® Gen3 NVMe M.2 SSD | |||||||||||
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Product Line | Premium | Premium | Superior | Superior | Value | Value | Momentum | Value | Value | Premium | Value |
Naming | N750Pi | N700Pi | N650Si / N650Sc | N600Si / N600Sc | N650Vi | N600Vc | N400Mc | N650Vi | N600Vc | N700Pi / N700Pc | N600Vi / N600Vc |
Interface | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 |
Flash Type | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC (pSLC mode) | 3D TLC |
Form Factor | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280 S2-M | M.2 2280 S2-M | M.2 2280 S2-M | M.2 2242 D5-M | M.2 2242 D5-M | M.2 2230-S4-M | M.2 2230-S4-M |
Operating Temperature | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C | 0°C to 70°C | -20°C to 75°C | -40°C to 85°C | 0°C to 70°C | -40°C to 85°C | -40°C to 85°C |
Power Loss Protection Options | Hardware + Firmware Based | Hardware + Firmware Based | Hardware + Firmware Based or Firmware Based | Hardware + Firmware Based or Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | - | - | - | - | - | AES 256-bit Encryption, TCG Opal 2.0 | - |
Capacity | 40 GB to 320 GB | 40 GB to 640 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120 GB to 960 GB | 128 GB to 1TB | 120 GB to 960 GB | 120 GB to 960 GB | 40 GB to 160 GB | 120 GB to 480 GB |
Sequential Read (MB/s) up to | 3,150 | 3,150 | 3,420 | 3,420 | 2,600 | 2,600 | 2,600 | 2,600 | 2,600 | 2,000 | 2,050 |
Sequential Write (MB/s) up to | 2,670 | 2,820 | 3,050 | 3,050 | 1,880 | 1,870 | 1,800 | 1,880 | 1,870 | 1,600 | 1,550 |
Random Reads IOPS up to | 147,789 | 147,789 | 222,700 | 225,200 | 250,800 | 184,300 | 138,000 | 250,800 | 184,300 | 135,600 | 138,000 |
Random Writes IOPS up to | 114,227 | 114,227 | 176,600 | 179,200 | 276,400 | 145,900 | 109,000 | 276,400 | 145,900 | 112,000 | 112,600 |
Endurance (TBW)1 up to | 16,000 TB | 21,300 TB | 4,640 TB | 2,793 TB | 4,880 TB | 1,390 TB | 750 TB | 4,880 TB | 1,390 TB | 4,280 TB | 768 TB |
Reliability MTBF @ 25°C | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours |
Dimensions (mm) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) | 80.0 x 22.0 x 2.2 | 80.0 x 22.0 x 2.2 | 80.0 x 22.0 x 2.2 | 42.0 x 22.0 x 3.6 | 42.0 x 22.0 x 3.6 | 30.0 x 22.0 x 2.5 | 30.0 x 22.0 x 2.5 |
Certifications | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC. BSMI, UKCA, RoHS , REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH |
Warranty | 5 years | 5 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years |
1 Under highest Sequential write value. May vary by density, configuration and applications.
ダウンロード
- ATP High-Capacity M.2 NVMe product flyer
- ATP U.2 product flyer
- ATP NVMe HSBGA product flyer
- ATP_Automotive_Solutions_Customer specific only_v1.0_2023
- ATP SD card product flyer
- ATP microSD card product flyer