産業機器 / オートメーション
Built Rugged
独自の課題に対するソリューション
Operation Technology (OT) systems have been the backbones of all types of applications, and even more so when OT and IT converge.
At the edge, a wide range of appliances is deployed, including rackmount servers, compact fanless box PCs, and embedded motherboards or COMs. They require equally complex but essential storage and DRAM modules.
As a reputable supplier of specialized memory and flash storage solutions, ATP offers a full spectrum of generation and form factors solutions. ATP ensures the longest uptime and least maintenance for your systems by focusing on wide-temp and industrial-grade quality.
ユニークな挑戦
ソリューション
Automation systems in factories and warehouses begin with analog equipment or machinery and progress to digital control systems. Legacy systems continue to play significant roles. The challenge is that system design and refreshes just cannot keep up with the fast-paced memory/flash revolution.
ATP specializes in legacy form factors and support for longevity. ATP has the solution if you're having trouble finding memory or flash that is no longer widely available, while also providing newer formfactors with high storage capacity for future design, such as CFexpress or eMMC.
ユニークな挑戦
ソリューション
The greatest obstacle in the energy sector frequently results from exposure to the environment, particularly extreme wide-temperature, erosion from salt, sulfur, or acid. The least amount of human maintenance is required for equipment or systems that are frequently deployed outside. At the heart of this industry regulations are safety and durability.
ATP products are made from wide-temperature specifications. ATP upholds strict standards by using sophisticated burn-in/screening tests on top of industrial-grade chips and wafers.
ユニークな挑戦
ソリューション
Our never-ending desire for amusement is provided by digitally enabled gaming machines, such as slot machines, which are frequently constructed using I/O rich embedded hardware (general-purpose Box-PC, Mini-ITX, and Micro-ATX) on top of proprietary software solution.
The foundational hardware platform, however, necessitates a 7–15-year lifetime support, which presents an unique challenge for component support. The answer is ATP, which specializes in legacy and longevity assistance.
ユニークな挑戦
ソリューション
Test & Measurement is a specialized application used in a variety of vertical sectors. It has its proprietary hardware design and typically lasts for several generations. These platforms often only support low density logger storage, while also demand more intensive data writing endurance.
As a result, equipment manufacturers in this sector seek essential storage that the mass market no longer offers, including 512MB/1~8G SLC flash cards for OS boot-drive or micro data logging, or DDR2/3 DRAM. ATP is pleased to have been a dedicated partner to these specialized professionals.
ユニークな挑戦
ソリューション
注目技術
インダストリアル温度対応
－40℃から＋85℃までの高低温度環境での安定動作
金メッキゴールドフィンガー
DRAMモジュールではコネクター間の信号伝送品質を最適化するために30µ厚の金メッキを使用しています。
絶縁保護コーティング
防塵、化学汚染物質からの影響、高低温、湿度、浸食を防ぐため、化学コンパウンドのパリレン（Parylene）を使ったコーティングで電子回路を保護しています。
耐硫化対策レジスタ
ATP NANDフラッシュ・ストレージ製品 は、硫黄等の腐食ガス環境下でも長期的に安定動作を実現するための耐硫化対策レジスタの実装オプションを準備しております。
耐振動BGAパッケージ
はんだ付けされたソリューションは、振動に強く、過酷な環境での動作中でも信頼の高いパフォーマンスを出すことができます。
ハードウェアベース電断保護回路
ハードウェアでの電源不良防止機能は、最後の読み・書き・消去コマンドを完了させ、不揮発性フラッシュメモリに格納 し、電源遮断によるデータ喪失を防ぎます。一部のNVMe モジュールとSATA SSDには新しいマイクロコントローラユニットが搭載されています。 MCUベースの設計によりPLPアレイが様々な温度、電力グリッチ、充電状態でインテリジェントに動作し、デバ イスとデータの両方を保護します。
ファームウェアベースの電断保護
ファームウェアベースの電断保護は、電源が失われる前にデバイスに書き込まれたデータを効果的に保護します。ライト操作が正常に完了したという信号をデバイスからホストが受信した後、突然の電源喪失が発生した場合でも、新しく書き込まれたデータと以前に書き込まれたデータは保護されます。
SiP (システム・イン・パッケージ)
全ての部品を露出させず、外部から保護・遮蔽するための製造プロセスです。
推奨製品
仕様
製品を見る| PCIe® NVMe M.2 Type 1620 HSBGA SSD | |||
|---|---|---|---|
| Product Line | Superior | Premium | Superior |
| Naming | N601Si 2 | N700Pi / N700Pc | N600Si / N600Sc |
| Interface | PCIe G4 x4 | PCIe G3 x4 | PCIe G3 x4 |
| Flash Type | 3D TLC | 3D TLC (pSLC mode) | 3D TLC |
| Form Factor | 291-Ball, HSBGA | 291-Ball, HSBGA | 291-Ball, HSBGA |
| Operating Temperature | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C / 0°C to 70°C |
| Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based |
| Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | - |
| Capacity | 240 GB to 960 GB | 40 GB to 160 GB | 120 GB to 480 GB |
| Sequential Read (MB/s) up to | 3,500 | 2,000 | 2,050 |
| Sequential Write (MB/s) up to | 3,400 | 1,600 | 1,550 |
| Random Reads IOPS up to | 600,000 | 135,600 | 138,000 |
| Random Writes IOPS up to | 750,000 | 112,000 | 112,600 |
| Endurance (TBW)1 up to | 1,440 TB | 4,280 TB | 768 TB |
| Reliability MTBF @ 25°C | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours |
| Dimensions (mm) | 16.0 x 20.0 x 1.6 | 16.0 x 20.0 x 1.6 | 16.0 x 20.0 x 1.6 |
| Certifications | RoHS, REACH | RoHS, REACH | RoHS, REACH |
| Warranty | 1 year | 1 year | 1 year |
1. Under highest Sequential write value. May vary by density, configuration and applications.
2. Product specifications may be subject to change.
特集記事
ダウンロード
- ATP USB Drive product flyer
- ATP microSD card product flyer
- ATP M.2 NVMe product flyer
- ATP M.2 SATA product flyer
- ATP CFast card product flyer
- ATP CF card product flyer
- ATP eUSB product flyer
- ATP SD card product flyer
- ATP eMMC product flyer
- ATP DDR3 product flyer
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- ATP NVMe HSBGA product flyer
- ATP 9x10 eMMC product flyer