ATP Introduces High-Endurance M.2 2230 SSDs Packed with Customizable Security Features
Available as M.2 2230 modules, they offer better power efficiency and are suitable for applications using small and light systems such as point-of-sale (POS) systems, mobile PCs, Internet of Things (IoT) devices, and server boot applications.
ATP Rolls Out NVMe/SATA Value Line SSDs with 100+ Layer 3D NAND for Industrial Applications
The new N600Vc/A600Vc Series SSDs offer lower cost per GB compared to ATP’s mainstream Superior Line, but use prime NAND die along with ATP’s superior integrated circuits (IC) sorting process to guarantee drive quality, performance, reliability, and endur
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
ATP has always worked with its key suppliers with long-term planning and commitment to ensure supply continuity to support the mass production ramp for the latest NVMe offerings and other recently launched TLC NAND-based product lines.
New Die Package Extends 3D TLC e.MMC Endurance to MLC/SLC Levels of ATP E750Pi/Pc, E650Si/Sc Series e.MMC
ATP’s new E750Pi/Pc Series e.MMC offerings are built with 3D TLC NAND flash but are configured as pseudo SLC (pSLC) to offer endurance on par with SLC NAND, while E650Si/Sc Series in native TLC has near-MLC endurance.