PCIe® Gen3 NVMe M.2 SSD

Hauptmerkmale

höchste Lese- und Schreibgeschwindigkeit
LDPC & RAID Datenwiederherstellung für Fehlerbehebung
Dynamisches Thermal Throttling
Globales Wear Leveling
TRIM

Beschreibung

M.2 NAND Speichermodule basierend auf dem NVMe™ Protokoll und PCIe Schnittstelle erreichen eine deutlich höhere Geschwindigkeit und erfüllen damit die Anforderungen nach hohen Kapazitäten und Leistung in Enterprise Storage Systemen. Die Bandbreite von 32Gb/s (8Gb/s x 4 lanes) in ATP's NVMe SSDs ist hierbei deutlich höher als die 6Gb/s einer SATA III SSD bei gleichzeitig mehr als 3-fach niedriger Latenz und deutlich höheren IOPS (Input/Output per second). Unsere NVMe SSDs mit industriellem Temperaturbereich bieten diese Leistung sogar in einem breiten Temperaturspektrum von -40°C bis +85°C wobei das dynamische thermische throttling die Geschwindigkeit nach Bedarf selbständig anpasst um die SSD in hohen Temperaturbereichen oder bei hohem Lese-/cChreibzugriff vor Überhitzung zu schützen

Der NVMe 1.2 Standard in Verbindung mit 3D TLC NAND Technologie in ATP's M.2 2280 NVMe SSDs ermöglichen höchste Leistung und Langlebitkeit in Speicherkapazitäten bis zu 1TB. Die Geschwindigkeiten erreichen hierbei bis zu 3.420MB (lesen) und 3.050MB/s (schreiben) und bis zu 250,800 IOPS.

NVMe wurde speziell für non-volatile Speichermedien entwickelt und ermöglicht höhere Geschwindigkeiten bei niedrigerer Latenz verglichen mit dem AHCI Standard, welcher auf konventionelle Festplatten ausgelegt war.

SpezifikationenNeuigkeiten: 2025-01-23 11:48

PCIe® Gen3 NVMe M.2 SSD
Product Line	Premium	Premium	Superior	Superior	Value	Value	Value	Value	Premium	Value
Naming	N750Pi	N700Pi	N650Si / N650Sc	N600Si / N600Sc	N650Vi	N600Vc	N650Vi	N600Vc	N700Pi / N700Pc	N600Vi / N600Vc
Interface	PCIe G3 x4	PCIe G3 x4	PCIe G3 x4	PCIe G3 x4	PCIe G3 x4	PCIe G3 x4	PCIe G3 x4	PCIe G3 x4	PCIe G3 x4	PCIe G3 x4
Flash Type	3D TLC (pSLC mode)	3D TLC (pSLC mode)	3D TLC	3D TLC	3D TLC	3D TLC	3D TLC	3D TLC	3D TLC (pSLC mode)	3D TLC
Form Factor	M.2 2280-D2-M	M.2 2280-D2-M	M.2 2280-D2-M	M.2 2280-D2-M	M.2 2280 S2-M	M.2 2280 S2-M	M.2 2242 D5-M	M.2 2242 D5-M	M.2 2230-S4-M	M.2 2230-S4-M
Operating Temperature	-40°C to 85°C	-40°C to 85°C	-40°C to 85°C / 0°C to 70°C	-40°C to 85°C / 0°C to 70°C	-40°C to 85°C	0°C to 70°C	-40°C to 85°C	0°C to 70°C	-40°C to 85°C / 0°C to 70°C	-40°C to 85°C / 0°C to 70°C
Power Loss Protection Options	Hardware + Firmware Based	Hardware + Firmware Based	Hardware + Firmware Based or Firmware Based	Hardware + Firmware Based or Firmware Based	Firmware Based	Firmware Based	Firmware Based	Firmware Based	Firmware Based	Firmware Based
Optional SED Features	AES 256-bit Encryption, TCG Opal 2.0	AES 256-bit Encryption, TCG Opal 2.0	AES 256-bit Encryption, TCG Opal 2.0	AES 256-bit Encryption, TCG Opal 2.0	-	-	-	-	AES 256-bit Encryption, TCG Opal 2.0	-
Capacity	40 GB to 320 GB	40 GB to 640 GB	120 GB to 960 GB	120 GB to 960 GB	120 GB to 960 GB	120 GB to 960 GB	120 GB to 960 GB	120 GB to 960 GB	40 GB to 160 GB	120 GB to 480 GB
Sequential Read (MB/s) up to	3,150	3,150	3,420	3,420	2,600	2,600	2,600	2,600	2,000	2,050
Sequential Write (MB/s) up to	2,670	2,820	3,050	3,050	1,880	1,870	1,880	1,870	1,600	1,550
Random Reads IOPS up to	147,789	147,789	222,700	225,200	250,800	184,300	250,800	184,300	135,600	138,000
Random Writes IOPS up to	114,227	114,227	176,600	179,200	276,400	145,900	276,400	145,900	112,000	112,600
Endurance (TBW)1 up to	16,000 TB	21,300 TB	4,640 TB	2,793 TB	4,880 TB	1,390 TB	4,880 TB	1,390 TB	4,280 TB	768 TB
Reliability MTBF @ 25°C	>2,000,000 hours	>2,000,000 hours	>2,000,000 hours	>2,000,000 hours	>3,000,000 hours	>3,000,000 hours	>3,000,000 hours	>2,000,000 hours	>2,000,000 hours	>2,000,000 hours
Dimensions (mm)	80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)	80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with with 8 mm heatsink)	80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)	80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)	80.0 x 22.0 x 2.2	80.0 x 22.0 x 2.2	42.0 x 22.0 x 3.6	42.0 x 22.0 x 3.6	30.0 x 22.0 x 2.5	30.0 x 22.0 x 2.5
Certifications	CE, FCC, BSMI, UKCA, RoHS, REACH	CE, FCC, BSMI, UKCA, RoHS, REACH	CE, FCC, BSMI, UKCA, RoHS, REACH	CE, FCC. BSMI, UKCA, RoHS , REACH	CE, FCC, BSMI, UKCA, RoHS, REACH	CE, FCC, BSMI, UKCA, RoHS, REACH	CE, FCC, BSMI, UKCA, RoHS, REACH	CE, FCC, BSMI, UKCA, RoHS, REACH	CE, FCC, BSMI, UKCA, RoHS, REACH	CE, FCC, BSMI, UKCA, RoHS, REACH
Warranty	5 years	5 years	2 years	2 years	2 years	2 years	2 years	2 years	2 years	2 years

1 Under highest Sequential write value. May vary by density, configuration and applications.

Bestelldetails

Hot Items Ordering Information
Product Line	Capacity1	Operating Temperature2	Power Loss Protection3	SED4	P/N
N650Si	120GB	-40°C to 85°C	Hardware + Firmware Based	-	FT120GP38AG8BPI
N650Si	240GB	-40°C to 85°C	Hardware + Firmware Based	-	FT240GP38AG8BPI
N650Si	480GB	-40°C to 85°C	Hardware + Firmware Based	-	FT480GP38AG8BPI
N650Si	960GB	-40°C to 85°C	Hardware + Firmware Based	-	FT960GP38AG8BPI
N650Sc	120GB	0°C to 70°C	Hardware + Firmware Based	-	FT120GP38AG8BPC
N650Sc	240GB	0°C to 70°C	Hardware + Firmware Based	-	FT240GP38AG8BPC
N650Sc	480GB	0°C to 70°C	Hardware + Firmware Based	-	FT480GP38AG8BPC
N650Sc	960GB	0°C to 70°C	Hardware + Firmware Based	-	FT960GP38AG8BPC
N600Vc (M.2 2280)	120GB	0°C to 70°C	Firmware Based	-	FT120GP38ANDBFC
N600Vc (M.2 2280)	240GB	0°C to 70°C	Firmware Based	-	FT240GP38ANDBFC
N600Vc (M.2 2280)	480GB	0°C to 70°C	Firmware Based	-	FT480GP38ANDBFC
N600Vc (M.2 2242)	120GB	0°C to 70°C	Firmware Based	-	FT120GP34ANDBFC
N600Vc (M.2 2242)	240GB	0°C to 70°C	Firmware Based	-	FT240GP34ANDBFC
N600Vc (M.2 2242)	480GB	0°C to 70°C	Firmware Based	-	FT480GP34ANDBFC
N600Vc (M.2 2242)	960GB	0°C to 70°C	Firmware Based	-	FT960GP34ANDBFC
1 Amount of actual usable storage that can be utilized. 2 Refers to Case Temperature range during device operation, as indicated by SMART temperature attributes. 3 Hardware + Firmware-based power loss protection design with Level 4 (data-in-flight) protection; Firmware-based power loss protection design with Level 1 (data-at-rest) protection. 4 Allows data written to and read from the SSD to be constantly and automatically encrypted and decrypted. Conforms to TCG Opal 2.0 and uses AES 256-bit HW encryption.

TechnologieView All Technologies

Technologien und zusätzliche Services	Produktlinie
Technologien und zusätzliche Services	Premium	Superior	Value
S.M.A.R.T.	available	available	available
Industrial Temperature	available	customizable	available
Firmware-Based Data-At-Rest Power Loss Protection	available	available	available
Hardware-Based In-Flight-Data Power Loss Protection		available
Advanced Wear Leveling	available	available	available
AutoRefresh	available	available	available
Dynamic Data Refresh	available	available	available
Auto-Read Calibration	available	available	available
End-to End Data Path Protection	available	available	available
SED (AES 256-bit Encryption, TCG Opal 2.0)	available	available	customizable
Software Secure Erase	available	customizable	available
Anti-Sulfur Resistors	customizable	customizable
Conformal Coating	customizable	customizable
Content Preload	customizable
Joint Validation and Test	customizable	customizable