PCIe® Gen 3 NVMe M.2 Type 1620 HSBGA SSD
- PCIe Gen3 x4, NVMe 1.3, M.2 Type 1620
- pSLC mode with 2X-3X of Sustainable Performance*
- High/Stable performance with Optimized Thermal Throttling Firmware/Heatsink (HSBGA)
- Optimized Power Consumption: 5 mW during Power State 4
- DRAM-less configuration supporting Host Memory Buffer (HMB)*
- Optional Security features available**
- * Under highest Sequential write value. May vary by density, configuration and applications.
- ** Customization available on a project basis
Despite their ultra-small form factor, ATP’s N700 Series NVMe Heat Sink Ball Grid Array (HSBGA) solid state drives (SSDs) surprisingly pack a mean punch. These SSDs with high-speed PCIe 3.0 interface x4 lanes and NVMe protocol deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane, while dimensions of just 16 (L) x 20 (W) x 1.6 (H) mm, the M.2 Type 1620 form factor, and 291-ball packaging take up minimal space within tightly confined systems.
N700 Series SSDs are configured with pseudo single-level cell (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and lifetime of the NAND flash memory, while benefiting from the lower cost compared with native SLC,due to the higher cell density.
These diminutive powerhouses store hefty capacities of 40/80/160 GB and are packed with advanced features to meet the ultra-portability and reliability requirements of ultra-compact Internet of Things (IoT) devices and embedded systems. They provide high-speed reliable storage in harsh environments such as in transportation, aerospace, smart factories, mining operations, steel fabrication and more.
N700 Series Key Features:
Configured to store only one bit per cell to increase endurance and reliability, offering 2X-3X sustainable performance.
The ATP Optimized Thermal Throttling firmware (FW) will maintain the “Steady State” condition to avoid huge performance drops that will adversely impact the system, thus optimizing best performance for application requests and enhancing overall sustained performance.
Optimized Power Consumption
Consuming low power at only 5 mW during Power State 4 (Sleep Mode), the ATP NVMe HSBGA SSDs deliver huge power savings.
Host Memory Buffer (HMB) support helps these DRAM-less SSDs to improve performance by obtaining DRAM resources as cache, thus overcoming the limited memory capacity within the storage and optimizing I/O performance without requiring the SSD to bring up its own DRAM
ATP N700 Series SSDs are soldered down, making them vibration-resistant and able to withstand rigorous shaking.
Better Thermal Dissipation
The heatsink effectively transfers heat to cool the device and keep the performance at optimal levels.
Optional Security Features
• HW Write Protect
• HW Quick Erase
• HW Secure Erase (Data Sanitization) (AFSSI-5020)
• AES-256 Encryption
• TCG Opal 2.0
SpezifikationenNeuigkeiten: 2023-04-07 15:58
|PCIe® Gen 3 NVMe M.2 Type 1620 HSBGA SSD|
|Interface||PCIe G3 x4||PCIe G3 x4||PCIe G3 x4||PCIe G3 x4|
|Flash Type||3D TLC (pSLC mode)||3D TLC (pSLC mode)||3D TLC||3D TLC|
|Form Factor||291-Ball, HSBGA||291-Ball, HSBGA||291-Ball, HSBGA||291-Ball, HSBGA|
|Operating Temperature (Tcase)1||-40°C to 85°C||0°C to 70°C||-40°C to 85°C||0°C to 70°C|
|Power Loss Protection Options||Firmware Based||Firmware Based||Firmware Based||Firmware Based|
|Optional SED Features||AES 256-bit Encryption, TCG Opal 2.0||AES 256-bit Encryption, TCG Opal 2.0||-||-|
|Capacity||40 GB to 160 GB||40 GB to 160 GB||120GB to 480GB||120GB to 480GB|
|Sequential Read (MB/s) up to||2,000||2,000||2,050||2,050|
|Sequential Write (MB/s) up to||1,600||1,600||1,550||1,550|
|Random Reads IOPS up to||135,600||135,600||138,000||138,000|
|Random Writes IOPS up to||112,000||112,000||112,600||112,600|
|Endurance (TBW)2 up to||4,280 TB||4,280 TB||768 TB||768 TB|
|Reliability MTBF @ 25°C||>2,000,000 hours||>2,000,000 hours||>2,000,000 hours||>2,000,000 hours|
|Dimensions (mm)||16.0 x 20.0 x 1.6||16.0 x 20.0 x 1.6||16.0 x 20.0 x 1.6||16.0 x 20.0 x 1.6|
|Certifications||RoHS, REACH||RoHS, REACH||RoHS, REACH||RoHS, REACH|
|Warranty||1 year||1 year||1 year||1 year|
2 Under highest Sequential write value. May vary by density, configuration and applications.
TechnologieView All Technologies
|Technologien und zusätzliche Services||Produktlinie|
Firmware-based Power Loss Protection
Advanced Wear Leveling
Dynamic Data Refresh
End-to End Data Path Protection
TCG Opal 2.0
SiP (System in Package)
Vibration-Proof BGA Package
- ATP NVMe HSBGA product flyer