PCIe® Gen 4 NVMe M.2 SSD
Hauptmerkmale
- Hervorragende Lese-/Schreibleistung
- MCU-basiertes Power-Loss-Protection-Design mit Level 4 Schutz für Data-in-Flight
- Selbstverschlüsselndes Laufwerk (SED) mit AES 256-Bit-Verschlüsselung, TCG Opal 2.0*
- Verschiedene Kühlkörperlösungen**
- End-to-End Datenschutz
- Schwefelfreie Widerstände*
Beschreibung
ATP NVMe™ M.2 2280 SSDs mit der PCI Express® (PCIe®) Gen 4 x4-Schnittstelle erfüllen den wachsenden Bedarf an Bandbreite bei der Datenübertragung in heutigen, anspruchsvollen Anwendungen.
Mit einer Kapazität von bis zu 3,84 TB, Unterstützung für I-Temp- (40°C bis 85°C: N651Si) oder C-Temp-Betrieb (0°C bis 70°C: N601Sc) sowie AES 256-Bit-Verschlüsselung und TCG Opal 2.0-Sicherheitsstandard eignen sich diese SSDs ideal für lese- und schreibintensive kritische Anwendungen wie Data Logging, Videoüberwachung und Systeme zur Bildgeneriereung und -Analyse.
Mit einer doppelt so hohen Bandbreite wie die vorherige Generation (8 GT/s) entspricht die PCIe Gen 4 Datenrate einer Bandbreite von 2 GB/s für jede PCIe-Lane, wodurch Daten schneller übertragen werden. Die PCIe Gen 4 SSDs von ATP verwenden x4 Lanes für eine maximale Bandbreite von 8 GB/s.
Optionale Kühlkörper zur optimalen Wärmeableitung sind eine nickelbeschichtete Kupferfolie, ein Kühlkörper mit 4 mm oder einer mit 8mm Bauhöhe.
SpezifikationenNeuigkeiten: 2024-02-29 09:38
| PCIe® Gen4 NVMe M.2 2280 SSD | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Product Line | Premium | Premium | Premium | Premium | Superior | Superior | Superior | Value | Momentum |
| Naming | N751Pi (150K P/E cycle configuration drive available) | N751Pi (150K P/E cycle configuration drive available) | N751Pi | N751Pi | N651Si / N651Sc | N651Si / N651Sc | N601Sc | N601Vi / N601Vc | N601Mc |
| Interface | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 | PCIe G4 x4 |
| Flash Type | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC |
| Form Factor 1 | M.2 2280-D6-M | M.2 2280-D2-M | M.2 2280-D6-M | M.2 2280-D2-M | M.2 2280-D6-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-S3-M | M.2 2280 S2-M |
| Operating Temperature | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | 0°C to 70°C | -40°C to 85°C / 0°C to 70°C | 0°C to 70°C |
| Power Loss Protection Options | Hardware + Firmware Based | Firmware Based | Hardware + Firmware Based | Firmware Based | Hardware + Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
| Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | - |
| Capacity | 80 GB to 640 GB | 1.28 TB | 80 GB to 640 GB | 1.28 TB | 240 GB to 1.92 TB | 240 GB to 3.84 TB | 240 GB to 1.92 TB | 240 GB to 1.92 TB | 1 TB to 4 TB |
| Sequential Read (MB/s) up to | 6,450 | 6,450 | 6,450 | 6,450 | 6,450 | 6,450 | 6,450 | 5,000 | 7,200 |
| Sequential Write (MB/s) up to | 6,050 | 6,100 | 6,050 | 6,100 | 6,050 | 6,050 | 6,050 | 4,300 | 6,700 |
| Random Reads IOPS up to | 1,090,000 | 1,050,000 | 1,090,000 | 1,050,000 | 1,091,000 | 1,091,000 | 1,095,000 | 800,000 | 222,000 |
| Random Writes IOPS up to | 1,107,000 | 1,200,000 | 1,107,000 | 1,200,000 | 1,245,000 | 1,245,000 | 1,244,000 | 1,100,000 | 170,000 |
| Endurance (TBW)2 up to | 90,000 TB | 180,000 TB | 60,000 TB | 120,000 TB | 9,230 TB | 17,930 TB | 5,700 TB | 4,175 TB | 6,000 TB |
| Reliability MTBF @ 25°C | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours |
| Dimensions (mm) | 80.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 2.4 | 80.0 x 22.0 x 2.2 |
| Certifications | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH, UL | CE, FCC, BSMI, UKCA, RoHS, REACH |
| Warranty | 5 years | 5 years | 5 years | 5 years | 2 years | 2 years | 2 years | 2 years | 2 years |
1. M.2 2280-D6-M form factor (max height: 3.85mm), offers Hardware Based Power Loss Protection. M.2 2280-D2-M form factor (max height: 3.6mm), provides Firmware Based Power Loss Protection.
2. Under highest Sequential write value. May vary by density, configuration and applications.
Bestelldetails
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Downloads
- ATP Gen4 M.2 NVMe product flyer