Industrial SSDs, SD NAND Flash products and DRAM Modules
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Embedded World 2026
ATP Electronics,showcases its Specialized Storage & Memory Solutions at Embedded World 2026
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ATP推出配备多达 18 级自适应 Ace 热节流技术的 NVMe PCIe Gen4 无 DRAM 固态硬盘，功耗最高降低 40%，并提供毫不妥协的安全性
这些新型 SSD 采用 M.2 1620 散热球栅阵列 (HSBGA) 和 2230 外形规格，以其小巧的尺寸最大限度地节省空间。它们提供原生三层单元 (TLC) 类型，容量从 240 GB 到 960 GB，或伪单层单元 (pSLC) 模式，容量从 80 GB 到 320 GB，并可在 C-Temp (0°C 至 70°C) 和 I-Temp (-40°C 至 85°C) 选项下运行。这些无 DRAM SSD 支持主机内存缓冲 (HMB) 技术，在提供成本效益的同时，还能提供更稳定的性能表现、节能以及强
ATP Anzcham Charity Bike Ride
After 5 incredible days and 538 km 🚴♂️🚴♂️🚴♂️, ATP Representatives and fellow participants crossed the finish line in Tainan today!
Simulating SSDs Payload Diversity and Realistic Usage
Morning rush at a bakery is organized chaos—orders of every size and priority stream in, queues swell, and the team juggles brewing, baking, and online tickets until the surge eases at 10. That’s how an SSD lives in the real world: mixed, bursty payloads
Memory Wars: Why HBM Is the Hottest Commodity in AI
CONNECTED presenter Susan Chow engages in an insightful conversation with ATP Electronics President and CEO Jeffray Hsieh at COMPUTEX/InnoVEX 2025.
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