TAIPEI, May 26, 2026 —

ATP Electronics will exhibit at Computex 2026, June 2–5, Booth R0914, Taipei Nangang Exhibition Center, Hall 2, 4F — presenting four products across the embedded-to-enterprise spectrum: the E600Vc, the world’s smallest eMMC at 6.7 × 7.2mm and recipient of a Computex Best Choice Award; an Industrial Enterprise Gen4 SSD built for sustained edge workloads; a Gen5 OCP-Compliant Enterprise Boot SSD designed for open-rack data center infrastructure; and a DDR5-7200 RDIMM for high-performance server memory applications.

The E600Vc targets the constraint that becomes hardest to solve as AI inference moves into wearables, continuous health monitors, and embedded controllers: board space. A standard JEDEC eMMC package measures 11.5 × 13mm. The E600Vc brings that down to 6.7 × 7.2mm — 67% smaller — opening up designs where eMMC has not previously been viable, while sustaining the thermal stability and endurance that always-on, unattended deployments require. The product’s recognition with the Computex Best Choice Award reflects both the engineering significance of the footprint reduction and its relevance to the direction of embedded AI design.

ATP’s Industrial Enterprise Gen4 SSD addresses the growing class of edge infrastructure that demands data center-grade NVMe throughput within industrial operating envelopes: sustained performance across wide-temperature conditions, without the maintenance windows that enterprise-grade assumptions typically require.

The Gen5 OCP-Compliant Enterprise Boot SSD rounds out ATP’s storage lineup at the show. As data center operators standardize on Open Compute Project platform architectures, boot device interoperability and reliability become primary selection criteria. ATP’s Gen5 boot SSD is designed to meet both.

Also on display is ATP’s DDR5-7200 RDIMM, targeting server platforms where memory bandwidth and density are primary performance constraints. DDR5-7200 operates at speeds that prior DDR generations could not reach at server scale, and ATP’s RDIMM implementation is designed for the reliability and validation requirements of sustained production deployment.

All four products will be on display throughout Computex 2026 at Booth R0914.

For more information on ATP Electronics:

https://www.atpinc.com/products/smaller-footprint-managed-nand

https://www.atpinc.com/products/Industrial-Enterprise-edge-data-center-server-ssd

Media Contact on the Press Release: Tienlin Cheng (tienlin[at]tw.atpinc.com)

Follow ATP Electronics on LinkedIn: https://www.linkedin.com/company/atp-electronics

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About ATP

ATP Electronics (“ATP”) has dedicated over 30 years of manufacturing excellence as the premier provider of memory and NAND flash storage products for rigorous embedded/industrial/automotive applications. As the “Global Leader in Specialized Storage and Memory Solutions,” ATP is known for its expertise in thermal and high-endurance solutions. ATP is committed to delivering add-on value, differentiation and the best TCO for customers. A true manufacturer, ATP manages every stage of the manufacturing process to ensure quality and product longevity. ATP upholds the highest standards of corporate social responsibility by ensuring sustainable value for workers, the environment, and business throughout the global supply chain. For more information on ATP Electronics, please visit www.atpinc.com or contact us at info[at]atpinc.com.