e.MMC

Key Features

  • AEC-Q100 Grade 2 (-40°C~105°C) Compliant
  • AEC-Q100 Grade 3 (-40°C~85°C) Compliant
  • Extra-high endurance: 2-3X higher than standard e.MMC
  • Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
  • 153-ball FBGA (RoHS compliant, "green package")
  • LDPC ECC engine* Low-density parity-check error correcting code. By product support.
  • Designed with 3D NAND

Description

The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing. 

Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments. 

ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40°C to blistering hot 105°C will not cause adverse impact on the device or the data in it. 

Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device. 

It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.

 

SpecificationsLatest Update: 2022-07-05 13:26

e.MMC
Product NameExtended Industrial GradeExtended Industrial GradeAutomotive Grade 2Automotive Grade 2Automotive Grade 3Automotive Grade 3Industrial GradeIndustrial GradeIndustrial GradeIndustrial GradeIndustrial GradeIndustrial GradeCommercial GradeCommercial GradeCommercial GradeCommercial GradeCommercial Grade
Product LinePremiumSuperiorPremiumSuperiorPremiumSuperiorPremiumPremiumPremiumSuperiorSuperiorSuperiorPremiumPremiumSuperiorValueValue
NamingE700PaE600SaE700PaaE600SaaE700PiaE600Sia E750PiE700PiE700PiE650SiE600SiE600SiE750PcE700PcE650ScE600VcE600Vc
Flash Type3D Pseudo SLC3D MLC3D Pseudo SLC3D MLC3D Pseudo SLC3D MLC3D Pseudo SLC3D Pseudo SLC3D Pseudo SLC3D TLC3D MLC3D TLC3D Pseudo SLC3D Pseudo SLC3D TLC3D TLC3D TLC
IC Package153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA
JEDEC Specificationv5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400
Power Loss Protection OptionsFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware BasedFirmware Based
Operating Temperature-40°C to 105°C-40°C to 105°C-40°C to 105°C-40°C to 105°C-40°C to 85°C-40°C to 85°C-40°C to 85°C-40°C to 85°C-40°C to 85°C-40°C to 85°C-40°C to 85°C-40°C to 85°C -25°C to 85°C-25°C to 85°C -25°C to 85°C-25°C to 85°C-25°C to 85°C
Capacity*8 GB to 64 GB16 GB to 128 GB8 GB to 64 GB16 GB to 128 GB8 GB to 64 GB16 GB to 128 GB10 GB to 21 GB8 GB to 64 GB10 GB to 21 GB32 GB to 64 GB16 GB to 128 GB32 GB to 64 GB10 GB to 21 GB10 GB to 21 GB32 GB to 64 GB32 GB to 64 GB32 GB
Sequential Read/Write up to (MB/s) **300 / 240300 / 170300 / 240300 / 170300 / 240300 / 170295/ 215300 / 240290 / 220290 / 205300 / 170290 / 220295/ 215290 / 220290 / 205290 / 220250 / 135
Bus Speed Modesx1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8
ICC (Typical RMS in Read/Write) mA135 / 155135 / 180135 / 155135 / 180135 / 155135 / 18095.5 / 92135 / 15580 / 9969.5 / 68.5135 / 180100 / 7395.5 / 9280 / 9969.5 / 68.5100 / 7381.5 / 49.5
ICCQ (Typical RMS in Read/Write) mA110 / 95110 / 100110 / 95110 / 100110 / 95110 / 100104 / 87.5110 / 95109 / 9488 / 85.5110 / 100108 / 90104 / 87.5109 / 9488 / 85.5108 / 9080.5 / 61.5
Endurance TBW** (Max.)1,213 TB309 TB1,213 TB309 TB1,320 TB824 TB1,034 TB1,320 TB682 TB70 TB824 TB20 TB1,034 TB682 TB70 TB20 TB8.3 TB
Reliability MTBF @ 25°C>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours>2,000,000 hours
Dimensions: L x W x H (mm)11.5 x 13.0 x 1.311.5 x 13.0 x 1.311.5 x 13.0 x 1.311.5 x 13.0 x 1.311.5 x 13.0 x 1.311.5 x 13.0 x 1.311.5 x 13.0 x 1.311.5 x 13.0 x 1.311.5 x 13.0 x 1.011.5 x 13.0 x 1.011.5 x 13.0 x 1.011.5 x 13.0 x 1.011.5 x 13.0 x 1.011.5 x 13.0 x 1.011.5 x 13.0 x 1.011.5 x 13.0 x 1.09.0 x 10.0 x 0.8
CertificationsAEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACHAEC-Q100, RoHS, REACHRoHS, REACH RoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACHRoHS, REACH
Warranty1 year1 year1 year1 year1 year1 year1 year1 year1 year1 year1 year1 year1 year1 year1 year1 yearOne Year

* Low-density parity-check error correcting code. By product support.
** All performance is collected or measured using ATP proprietary test environment, without file system overhead.

TechnologyView All Technologies

Technologies & Add-On ServicesProduct Line
PremiumSuperiorValue
Life Monitor
Life Monitor
available
available
available
Sudden Power-Off Recovery (SPOR)
Sudden Power-Off Recovery (SPOR)
available
available
available
AutoRefresh
AutoRefresh
available
available
available
Advanced Wear Leveling
Advanced Wear Leveling
available
available
available
Dynamic Data Refresh
Dynamic Data Refresh
available
available
available
End-to End Data Protection
End-to End Data Protection
available
available
available
Auto-Read Calibration
Auto-Read Calibration
available
available
available
Secure Erase
Secure Erase
available
available
available
Industrial Temperature
Industrial Temperature
available
available
customizable
SiP (System in Package)
SiP (System in Package)
available
available
available
Vibration-Proof BGA Package
Vibration-Proof BGA Package
available
available
available
Complete Drive Test
Complete Drive Test
available
available
available
Joint Validation
Joint Validation
customizable
customizable
customizable
customizable:Customization option available on a project basis.

Downloads

  • ATP 9x10 eMMC product flyer
    English
    2022-07-051.93MB
  • ATP e.MMC 3D MLC and SLC Mode Reliability Report V2.0 Summary
    English
    2019-09-17338.62KB
  • ATP_All-Terrain Automotive Storage Solutions for the Road Ahead
    English
    2020-09-1418.36MB
  • ATP eMMC product flyer
    English
    2022-02-15367.20KB
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