e.MMC

Key Features

  • AEC-Q100 Grade 2 (-40°C~105°C) Compliant
  • AEC-Q100 Grade 3 (-40°C~85°C) Compliant
  • Offers Native SLC NAND with 60K P/E cycle
  • Extra-high endurance: 2-3X higher than standard e.MMC
  • Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
  • 153-ball FBGA (RoHS compliant, "green package")
  • LDPC ECC engine*
  • Designed with 3D NAND

Description

The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing. 

Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments. 

ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40°C to blistering hot 105°C will not cause adverse impact on the device or the data in it. 

Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache Flushing Report ensures the data integrity on cache blocks; Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device. 

It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset.

Specifications

e.MMC
Product NameIndustrial GradeIndustrial GradeIndustrial GradeAutomotive Grade 3Automotive Grade 3Automotive Grade 2Automotive Grade 2
Product LinePremiumPremiumSuperiorPremiumSuperiorPremiumSuperior
NamingE800PiE700PiE600SiE700PiaE600SiaE700PaaE600Saa
IC Package153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA153-ball FBGA
JEDEC SpecificationV4.41+ (SDR-8 bit)v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400v5.1, HS400
Flash TypeNative SLC3D SLC Mode3D NAND3D SLC Mode3D NAND3D SLC Mode3D NAND
Density*1 GB to 2 GB8 GB to 64 GB16 GB to 128 GB8 GB to 64 GB16 GB to 128 GB8 GB to 64 GB16 GB to 128 GB
Bus Speed Modesx1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8x1 / x4 / x8
Performance** Seq. Read/Write up to (MB/s)35 / 25300 / 240300 / 170300 / 240300 / 170300 / 240300 / 170
Performance** Random Read/Write up to (IOPS)900 / 110015K / 30K15K / 30K15K / 30K15K / 30K15K / 30K15K / 30K
Operating Temperature-40°C to 85°C (Industrial)-40°C to 85°C (Industrial)-40°C to 85°C (Industrial)-40°C to 85°C (AEC-Q100 Grade 3)-40°C to 85°C (AEC-Q100 Grade 3)-40°C to 105°C (AEC-Q100 Grade 2)-40°C to 105°C (AEC-Q100 Grade 2)
Reliability Max. TBW**90 TB1320 TB824 TB1320 TB824 TB1213 TB309 TB
Reliability MTBF @ 25°C> 2,000,000 Device hours> 2,000,000 Device hours> 2,000,000 Device hours> 2,000,000 Device hours> 2,000,000 Device hours> 2,000,000 Device hours> 2,000,000 Device hours
ICC (Typical RMS in Read/Write) mATBD135 / 155135 / 180135 / 155135 / 180135 / 155135 / 180
ICCQ (Typical RMS in Read/Write) mATBD110 / 95110 / 100110 / 95110 / 100110 / 95110 / 100
Dimensions: L x W x H (mm)11.5 x 13.0 x 1.3 (max.)11.5 x 13.0 x 1.3 (max.)11.5 x 13.0 x 1.3 (max.)11.5 x 13.0 x 1.3 (max.)11.5 x 13.0 x 1.3 (max.)11.5 x 13.0 x 1.3 (max.)11.5 x 13.0 x 1.3 (max.)

*Low-density parity-check error correcting code. By product support.
**All performance is collected or measured using ATP proprietary test environment, without file system overhead.

Product Line

Technologies & Add-On ServicesProduct Line
PremiumSuperior
S.M.A.R.T.
S.M.A.R.T.
customizable
customizable
Sudden Power-Off Recovery (SPOR)
Sudden Power-Off Recovery (SPOR)
available
available
Data Path Protection
Data Path Protection
available
available
AutoRefresh
AutoRefresh
available
available
Vibration-Proof BGA Package
Vibration-Proof BGA Package
available
available
Dynamic Data Refresh
Dynamic Data Refresh
available
available
Industrial Temperature
Industrial Temperature
available
available
SiP (System in Package)
SiP (System in Package)
available
available
Complete Drive Test
Complete Drive Test
available
available
customizable:Customization option available on a project basis.

Downloads

  • ATP e.MMC 3D MLC and SLC Mode Reliability Report V2.0 Summary
    English
    2019-09-17338.62KB
  • ATP_eMMC_flyer
    English
    2019-09-06786.88KB
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