ATP’s New 3D TLC SSDs Match MLC Endurance with 66% Higher Endurance than Other 3D TLC Drives
Manufactured using a new die package, the Serial ATA solid state drives (SATA SSDs) deliver 66% higher endurance in native TLC mode and 50% higher in pseudo single level cell (pSLC) mode, making them on par with drives built on multi-level cell (MLC) and
ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage
The customizable ATP Thermal Management Solution includes copper foil and fin-type heatsink options for N600Si / N600Sc M.2 2280 modules with up to 3.84 TB and controller thermal pad for N600Si U.2 SSDs with up to 8 TB capacities. They are recommended for
ATP Electronics Partners with Excelpoint for the Distribution of “Industrial Only” Memory and Storage Solutions in APAC
Excelpoint will distribute ATP “Industrial Only” memory modules and flash storage solutions in Mainland China, India, and other parts of the Asia-Pacific region, excluding Korea, Japan and Taiwan.
ATP’s Fast, Low-Power “Industrial Only” DDR4-3200 DRAM Solutions Deliver Memory Boost to AMD EPYC™ and 2nd Gen Intel® Xeon® Scal
ATP’s DDR4-3200 modules ensure a big boost in performance, compute density and productivity with their fast 3200 MT/s data rate to optimize the power of AMD’s eight-memory channel and Intel’s six-memory channel architectures.