A technology driven company, ATP continues to focus on a targeted product portfolio and offers unique technologies.
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The Memory Insider, ATP's official blog, is a repository of general knowledge, news and opinions on current and emerging trends in Industrial-grade Memory and Embedded Storage technologies
We have been transforming the industrial and enterprise computing landscape with our high-performance and high-endurance NAND flash storage products and DRAM memory modules.
2019-10-15
ATP employs 64-layer 3D NAND technology, which is standing out to become the mainstream of the automotive and industrial market with steady supply for 5 years. By scaling vertically, 3D NAND mitigates reliability concerns that came with planar NAND’s shri
2019-09-11
the leading manufacturer of industrial-only memory and storage solutions, is launching E800Pi, its first embedded multimedia card (e.MMC) based on native single-level cell (SLC) flash with a very high endurance rating of 60K program/erase (P/E) cycles.
2019-08-23
ATP joins Taiwan’s distinguished manufacturing, service and financial companies, debuting on the list at number 62 as the top industrial memory and storage company. The rankings are based on financial information provided by companies or obtained through
2019-09-04
As USTCC partner, ATP Electronics will provide high-performance industrial only NAND flash storage solutions for the data-intensive media coverage and TV production requirements of USTCC’s upcoming races.
2019-07-11
3D TLC-based flash solutions are among the next-generation products that ATP Electronics will showcase during the 2019 Flash Memory Summit at the Santa Clara Convention Center in California, USA from August 6 to 8 in meeting room #205
2019-04-22
Mike joins ATP with 20 years of experience in the memory and semiconductor industries, including key positions at Intel, Micron, SMART Modular Technologies, and most recently Samsung.
2019-03-26
ATP Electronics, showcases its broad and own designed and manufactured product portfolio for the embedded Internet of Things (IoT) at the 22nd Embedded Systems Expo (ESEC) of Japan IT Week Spring 2019 from April 10 to 12.
2019-03-12
As the DRAM market migrates to DDR4 memory, several key manufacturers have already announced end-of-life (EOL) production of DDR3 modules based on high-density DDR3 8 Gbit components, including EOL notice of the components.
2019-02-13
As data-driven technologies like machine learning and artificial intelligence (AI) continue to make headway into numerous applications, systems are increasingly becoming capable of sensing, perceiving and analyzing their environments and making judgments
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