ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage
The customizable ATP Thermal Management Solution includes copper foil and fin-type heatsink options for N600Si / N600Sc M.2 2280 modules with up to 3.84 TB and controller thermal pad for N600Si U.2 SSDs with up to 8 TB capacities. They are recommended for
ATP Electronics Partners with Excelpoint for the Distribution of “Industrial Only” Memory and Storage Solutions in APAC
Excelpoint will distribute ATP “Industrial Only” memory modules and flash storage solutions in Mainland China, India, and other parts of the Asia-Pacific region, excluding Korea, Japan and Taiwan.
ATP’s Fast, Low-Power “Industrial Only” DDR4-3200 DRAM Solutions Deliver Memory Boost to AMD EPYC™ and 2nd Gen Intel® Xeon® Scal
ATP’s DDR4-3200 modules ensure a big boost in performance, compute density and productivity with their fast 3200 MT/s data rate to optimize the power of AMD’s eight-memory channel and Intel’s six-memory channel architectures.
“All Systems Go” for ATP at Embedded World 2020
“Every year, we are excited to participate in this big event. We eagerly look forward to showcasing our latest products and meeting with current as well as prospective customers. This year, it’s the same. Despite concerns related to the coronavirus outbre
ATP I-Temp NVMe SSDs Combine High Performance 8-Channel PCIe Gen 3 x4, End-to-End Data Protection, MCU-Based Power Management
The ATP N600Si/N600Sc M.2 NVMe 2280 SSDs feature 8 Gb/s PCIe Gen3 x4 lanes of simultaneous data flow with eight NAND channels. This design optimizes both hardware and software to take full advantage of PCIe 3.1 and NVMe 1.3 SSD specifications, addressing