ATP Expands Automotive/Industrial Portfolio with 3D TLC-Based S600Sia SD/microSD Cards
ATP employs 64-layer 3D NAND technology, which is standing out to become the mainstream of the automotive and industrial market with steady supply for 5 years. By scaling vertically, 3D NAND mitigates reliability concerns that came with planar NAND’s shri
ATP Launches First Industrial-Only SLC-Based E800Pi e.MMC with Premium Endurance of 60K P/E Cycles for High-Reliability Applica
the leading manufacturer of industrial-only memory and storage solutions, is launching E800Pi, its first embedded multimedia card (e.MMC) based on native single-level cell (SLC) flash with a very high endurance rating of 60K program/erase (P/E) cycles.
ATP Joins the List of Top 100 Fastest Growing Enterprises in Taiwan
ATP joins Taiwan’s distinguished manufacturing, service and financial companies, debuting on the list at number 62 as the top industrial memory and storage company. The rankings are based on financial information provided by companies or obtained through
US Touring Car Championship Names ATP Electronics as “Official Memory Storage Solutions Partner”
As USTCC partner, ATP Electronics will provide high-performance industrial only NAND flash storage solutions for the data-intensive media coverage and TV production requirements of USTCC’s upcoming races.
ATP Shows Off Next-Generation Industrial Only Flash Solutions at FMS 2019
3D TLC-based flash solutions are among the next-generation products that ATP Electronics will showcase during the 2019 Flash Memory Summit at the Santa Clara Convention Center in California, USA from August 6 to 8 in meeting room #205
ATP’s “Industrial Only” Portfolio Takes Centerstage at Japan IT Week Spring’s Embedded Systems Expo
ATP Electronics, showcases its broad and own designed and manufactured product portfolio for the embedded Internet of Things (IoT) at the 22nd Embedded Systems Expo (ESEC) of Japan IT Week Spring 2019 from April 10 to 12.
ATP Prevents DDR3 Supply Shortage with New Own-Built DDR3 8 Gbit Components and Modules
As the DRAM market migrates to DDR4 memory, several key manufacturers have already announced end-of-life (EOL) production of DDR3 modules based on high-density DDR3 8 Gbit components, including EOL notice of the components.
ATP Rolls Out Smart Memory and Storage Solutions at Embedded World 2019
As data-driven technologies like machine learning and artificial intelligence (AI) continue to make headway into numerous applications, systems are increasingly becoming capable of sensing, perceiving and analyzing their environments and making judgments