ATP Shows Off Next-Generation Industrial Only Flash Solutions at FMS 2019
3D TLC-based flash solutions are among the next-generation products that ATP Electronics will showcase during the 2019 Flash Memory Summit at the Santa Clara Convention Center in California, USA from August 6 to 8 in meeting room #205
ATP’s “Industrial Only” Portfolio Takes Centerstage at Japan IT Week Spring’s Embedded Systems Expo
ATP Electronics, showcases its broad and own designed and manufactured product portfolio for the embedded Internet of Things (IoT) at the 22nd Embedded Systems Expo (ESEC) of Japan IT Week Spring 2019 from April 10 to 12.
ATP Prevents DDR3 Supply Shortage with New Own-Built DDR3 8 Gbit Components and Modules
As the DRAM market migrates to DDR4 memory, several key manufacturers have already announced end-of-life (EOL) production of DDR3 modules based on high-density DDR3 8 Gbit components, including EOL notice of the components.
ATP Rolls Out Smart Memory and Storage Solutions at Embedded World 2019
As data-driven technologies like machine learning and artificial intelligence (AI) continue to make headway into numerous applications, systems are increasingly becoming capable of sensing, perceiving and analyzing their environments and making judgments