Industrial SSD

ATP’s New 3D TLC SSDs Match MLC Endurance with 66% Higher Endurance than Other 3D TLC Drives

2021-10-13

  

 

Taipei, Taiwan (October 2021) – ATP Electronics, the global leader in specialized storage and memory solutions, introduces the A750Pi and A650Si/Sc Series embedded SSDs built on 3D triple level cell (TLC) NAND flash. Manufactured using a new die package, the Serial ATA solid state drives (SATA SSDs) deliver 66% higher endurance in native TLC mode and 50% higher in pseudo single level cell (pSLC) mode, making them on par with drives built on multi-level cell (MLC) and SLC flash, respectively.

 

The new SSDs come in M.2 2280 and 2242 as well as 2.5” and mSATA form factors. A750Pi/A650Si SSDs support industrial temperature (I-Temp) ranges from -40°C to 85°C to perform reliably even when operating under extreme and harsh conditions. A650Sc SSDs can support commercial operating temperatures (C-Temp) from 0°C to 70°C.

 

A650Si/Sc with native TLC NAND flash have capacities from 120 to 1920 GB, while A750Pi drives configured in pSLC offer 80 to 640 GB. Depending on project and specific part number request, ATP’s new SATA embedded SSDs are also available as self-encrypting drives (SEDs) featuring AES-256 encryption and Opal TCG 2.0-compliant security.

 

“Industries were initially hesitant to use TLC for applications that required reliable performance and long endurance. Conscious of TLC limitations, ATP worked hard to make it equivalent to, or even better than its pricier MLC and SLC counterparts, minus the hefty cost of ownership,” said Chris Lien, Head of ATP’s Embedded SSD Business Unit. “As an industry leader, we did not rest until we have exhausted all possible means and resources to deliver these premium offerings. We are proud to say that our 3D TLC products are exceptionally competitive, thanks to a new die package design, exhaustive testing and validation, superior power loss protection, and other features. ATP’s advanced pSLC technology extends the general endurance to more than 10 times that of TLC-based products. It also improves the sustained write performance and reliability of the drive, making the drives suitable for write-intensive applications.”

 

Available Form Factors, Capacities and Endurance Ratings

 

The following graphs provide information on available factors, along with endurance ratings in sequential write based on capacities.

                                     

Figure 1. Comparison between ATP A750Pi and other 3D TLC drives in pseudo SLC (pSLC) mode. Endurance is expressed in terabytes written (TBW) in Sequential Write.

                                             

 

Figure 2. Comparison between ATP A650Si/Sc and other 3D TLC drives. Endurance is expressed in terabytes written (TBW) in Sequential Write.

 

                                 

Reliability Testing and Validation: Setting ATP SSDs a Cut Above the Rest

Reliability testing is an important cornerstone in the ATP manufacturing process. The next-gen embedded SATA SSDs go through standard as well as customizable testing depending on customer requests and application-specific requirements.

  • Four-Corner, Temperature Cycling, and Power Cycling Tests demonstrate that the SSDs can still perform reliably and are able to handle stored data without data miscompare even under harsh conditions.
  • End-of-Life Validation Test makes sure that ATP SSDs perform reliably and maintain data integrity over their life span (and even beyond) as required.
  • PCBA Solderability Validation makes sure that components on the printed circuit board assembly (PCBA) are effectively bonded to form reliable mechanical and electrical connections.
  • Reliability Demonstration Test (RDT) validates the mean time between failures (MTBF) rating of the drive through actual drive-level testing instead of relying on reliability prediction systems.

 

Breakthrough MCU Design for Enhanced Power Management and PLP Capabilities

The latest A750Pi/A650Si Series SATA SSDs feature a new design of the power loss protection (PLP) array, which utilizes a new power management IC (PMIC) and new firmware-programmable MCU (microcontroller unit). The new MCU design allows the PLP array to perform intelligently in various temperatures, power glitches and charge states. The following table summarizes the features and benefits of the new MCU-based design:

Table 1. Features and benefits of the MCU-based PLP array.

ATP SSD Configuration Tool

 

The ATP SSD Configuration Tool is available to make sure that ATP storage solutions meet customers’ requirements. Customers simply need to input their desired specifications, such as form factor, capacity, operating temperature, and endurance (in terabytes written or TBW). They also have the option to configure based on a two-year or five-year workload. The tool can help assess if a standard product is available for purchase, or if customization is required. To access the ATP SSD Configuration Tool,click here.

For more information on these products, visit:https://www.atpinc.com/products/list/industrial-ssds

Media Contact on the Press Release: Kelly Lin (Kellylin[at]tw.atpinc.com)

Follow ATP Electronics on LinkedIn: https://www.linkedin.com/company/atp-electronics

 

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About ATP

ATP Electronics (“ATP”) has dedicated 30 years of manufacturing excellence as the premier provider of memory and NAND flash storage products for rigorous embedded/industrial/automotive applications. As the “Global Leader in Specialized Storage and Memory Solutions,” ATP is known for its expertise in thermal and high-endurance solutions. ATP is committed to delivering add-on value, differentiation and best TCO for customers. A true manufacturer, ATP manages every stage of the manufacturing process to ensure quality and product longevity. ATP upholds the highest standards of corporate social responsibility by ensuring sustainable value for workers, the environment, and business throughout the global supply chain.For more information on ATP Electronics, please visit www.atpinc.com or contact us at info[at]atpinc.com.

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