6.7mm e.MMC

ATP Electronics Unveils World’s Smallest and First 6.7 mm e.MMC to Power Next-Gen Smart Wearables

2026-01-14

Taipei, Taiwan (January 2026) – ATP Electronics, the global leader in specialized storage and memory solutions, becomes the first e.MMC manufacturer to further shrink the e.MMC size to 6.7 mm. Built on 125-ball Fine Ball Grid Array (FBGA), the new E700Pc / E600Vc solutions shatter dimension constraints, making them the world’s smallest and the first of its kind. As a further miniaturization of the previous “smallest” package of 7.2 x 7.2 mm introduced in early 2025, the new e.MMC offerings are 67% smaller compared to standard-sized e.MMC while retaining superior advantages such as massive power savings and thermal resilience, making them ideal for applications where energy and space are premium considerations.

This achievement was made possible by ATP’s expertise and commitment to customer-driven innovation, especially with the heightened demand for smart wearables such as smart glasses, which have rigid space limitations on top of low power requirements for extended use.

 

Miniaturized Without the Performance Compromise

 

The unique 125-ball FBGA configuration keeps the 6.7 mm E700Pc / E600Vc e.MMC pin-to-pin compatible with JEDEC specifications, making it compliant with the JEDEC e.MMC 5.1 Standard (JESD84-B51), supporting x1/x4/x8 bus speed modes and featuring High Speed 400 (HS400) DDR Mode for faster programming and improved bandwidths of up to 400 MB/s.

ATP has initiated collaborations with leading global smart wearable companies to develop and validate proof of concept (POC) models.

Despite its smaller package, the 6.7 e.MMC is thermally efficient, with ATP tests confirming that heat generation and dissipation are managed well to ensure optimal performance and reliability.

The new form factor also sports a thinner z-height (0.65mm) profile in consideration of smart glasses with slim, rectangular frames so it perfectly blends into the glasses’ technical, ergonomic, and aesthetic features. Additionally, the 6.7 mm e.MMC can be paired with discrete Low-Power Double Data Rate (LPDDR) memory and major system-on-chip (SoC) platforms, providing an ultra-compact and efficient memory solution that supports the smart glasses’ slim design and advanced performance requirements.

 

Long-term Savings and Sustainability: Up to 70% Power Conservation with Enhanced FW Tuning

 

ATP’s 6.7 mm e.MMC features power management firmware that is tuned to enable a faster switch from Active to Idle operation. This Auto Power-Saving Mode, together with advanced Power Optimization technology, allows the device to conserve up to 70% power, thereby extending use, which is a crucial advantage for smart wearables running on batteries.

 

Application-Aligned Capacity and Data Integrity

 

The 6.7 mm e.MMC is available in native triple level cell (TLC) with 64 GB capacity and 12 TB endurance. For customers who can trade off lower capacities for higher endurance, the E700Pc is configured with pseudo single level cell (pSLC) at 20 GB storage and 680 TB endurance for prolonged usability for write behavior intense workloads.  The capacity range is optimal for mainstream low- and mid-end wearables, with SoCs supporting e.MMC interfaces for flexible integration in various wearable designs.

Advanced error correction ensures the accuracy and reliability of stored information, thus reducing the risk of data corruption. Wear leveling extends the overall lifespan of the e.MMC by distributing writes and erase cycles evenly. Auto Refresh provides superior data protection against read disturb and other retention issues on areas with read-intensive operations (hot zones), while Dynamic Data Refresh targets rarely accessed areas (cold zones).

 

Broad Temperature Tolerance, Vibration-Proof Design

 

The 6.7 mm eMMC is especially suited for uninterrupted use in mobile, outdoor, and demanding scenarios where smart wearables operate. Support for commercial operating temperature range from ‑25°C up to 85°C offers exceptional temperature tolerance while the soldered-down design ensures vibration-proof reliability and durability amidst constant movement and vigorous shaking.

 

WE BUILD WITH YOU: Customer-Driven Innovation

 

ATP Electronics continues to demonstrate customer-driven innovation by being the first and so far, the only, e.MMC manufacturer to deliver the world’s smallest e.MMC. Driven by the aspiration to meet the critical market need for ultra-compact, power-efficient, and reliable storage without compromising performance and endurance, ATP collaborates closely with customers to break space, power, and performance limitations through its breakthrough smart wearable-focused innovations.

ATP’s flexible sample ordering system speeds up prototyping and research and development (R&D), which results in quick integration and validation of designs as well as product development cycles with tailored configurations and expert technical assistance.

Contact an ATP representative for more information on the 6.7 mm e.MMC or for other memory/storage needs.

 

Product Specifications

 

Product Line
Premium Value
E700Pc E600Vc
Flash Type 3D TLC (pSLC mode) 3D TLC
IC Package 125-ball FBGA 125-ball FBGA
JEDEC Specification v5.1, HS400 v5.1, HS400
Power Loss Protection Options Firmware Based Firmware Based
Operating Temperature -25°C to 85°C -25°C to 85°C
Capacity 20 GB 64 GB
Performance
Sequential Read/Write up to (MB/s) (Max.) 240 / 210 240 / 210
Bus Speed Modes x1 / x4 / x8 x1 / x4 / x8
ICC (Typical RMS in Read/Write) mA (Max.) 30 / 40 30 / 40
ICCQ (Typical RMS in Read/Write) mA (Max.) 60 / 50 60 / 50
Endurance and Reliability
Endurance
TBW (Max.) 1
680 TB 12 TB
Reliability
MTBF @ 25°C
>3,000,000 hours >3,000,000 hours
Others
Dimensions(mm) 6.7 x 7.2 x 0.65 6.7 x 7.2 x 0.65
Certifications RoHS, REACH RoHS, REACH
Warranty One Year One Year

1 All performance is collected or measured using ATP proprietary test environment, without file system overhead.

 

For more information on ATP Electronics:

https://www.atpinc.com/products/smaller-footprint-managed-nand

Media Contact on the Press Release: Kelly Lin (Kellylin[at]tw.atpinc.com)

Follow ATP Electronics on LinkedIn: https://www.linkedin.com/company/atp-electronics

 

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About ATP

ATP Electronics (“ATP”) has dedicated over 30 years of manufacturing excellence as the premier provider of memory and NAND flash storage products for rigorous embedded/industrial/automotive applications. As the “Global Leader in Specialized Storage and Memory Solutions,” ATP is known for its expertise in thermal and high-endurance solutions. ATP is committed to delivering add-on value, differentiation and the best TCO for customers. A true manufacturer, ATP manages every stage of the manufacturing process to ensure quality and product longevity. ATP upholds the highest standards of corporate social responsibility by ensuring sustainable value for workers, the environment, and business throughout the global supply chain. For more information on ATP Electronics, please visit www.atpinc.com or contact us at info[at]atpinc.com.

 

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