Transportation

Faster, Smarter, Safer

Memory solutions for transportationMemory solutions for transportation
Spezifische LösungenTechnologienEmpfohlene ProdukteStoriesDownloads

Spezifische Lösungen

Systems on public vehicle transportation are advancing to an era of connectivity. From safety, monitoring, and telematics to passenger infotainment, higher computing and vaster data all now aim to be connected or even remotely managed, while all-terrain, all-weather, and unstable power supply challenges still remain musts to answer for both system designers and storage solutions.

ATP, with core competitiveness in endurance, longevity, wide-temp, fix BOM control, presents ideal industrial flash and memory solutions for public transport systems.

Herausforderungen & ATP Lösungen

Legacy form factors required
  • CF/CFast cards, low-density micro/SD cards
  • eUSB, UFD
  • mSATA
  • e.MMC
  • DDR3 DRAM
Lengthy development cycle
  • 5 years+ longevity and BOM/FW control
  • Special extension support
Wide ambient temperature
  • Industrial/Automotive Grade temp (AG2 & 3)
  • Tailored thermal solutions
Zero-failure safety standard
  • High-endurance SLC/pSLC/MLC/TLC series
  • Customized spare block (OP) setting
Unstable power supply from the platform
  • Customized power cycling test
  • Sudden Power-Off Recovery (SPOR) by firmware (FW) enhancement
  • MCU-based power loss protection (PLP)
Environmental erosion prevention
  • 50μ" gold fingers by customization
  • Waterproof system-in-package (SIP)
  • Anti-erosion, salt fog testing
Host device power-on/off patterns
  • Firmware adjustment on CMD and cache behaviors
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Railway systems are known to be ruggedized to overcome challenging operational environments and are required to pass strict railway certifications. Meanwhile, memory and flash storage onboard systems must also meet features including extra endurance, wide/extreme temperature, anti-shock/humidity/dust, and power loss protection.

Besides the above common challenges, railway systems are often quite diverse in designs and must go through a lengthy validation or deployment cycle, making validated key components less popular types to acquire. They especially need support on legacy types with extra longevity from a specialized supplier like ATP.

Herausforderungen & ATP Lösungen

Legacy form factors required
  • CF/CFast cards, low-density micro/SD cards
  • eUSB, UFD
  • mSATA
  • e.MMC
  • DDR3 DRAM
Lengthy development cycle
  • 5 years+ longevity and BOM/FW control
  • Special extension support
Wide ambient temperature
  • Industrial/Automotive Grade temp (AG2 & 3)
  • Tailored thermal solutions
Zero-failure safety standard
  • High-endurance SLC/pSLC/MLC/TLC series
  • Customized spare block (OP) setting
Unstable power supply from the platform
  • Customized power cycling test
  • Sudden Power-Off Recovery (SPOR) by firmware (FW) enhancement
  • MCU-based power loss protection (PLP)
Environmental erosion prevention
  • 50μ" gold fingers by customization
  • Waterproof system-in-package (SIP)
  • Anti-erosion, salt fog testing
Host device power-on/off patterns
  • Firmware adjustment on CMD and cache behaviors
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Transportation infrastructure, whether roadway, railway, or waterway traffic, has been progressing to keep up with the rising 5G and autonomous trend aiming for smarter public traffic safety or service, while legacy deployment still shoulders significant roles due to budgetary concerns.

ATP, as a specialized memory and flash storage provider, offers legacy industrial solutions, extra longevity, and rigorous quality control on top of the industrial specification. We ride a long way with manufacturers of traffic systems.

Herausforderungen & ATP Lösungen

Legacy form factors required
  • CF/CFast cards, low-density micro/SD cards
  • eUSB, UFD
  • mSATA
  • e.MMC
  • DDR3 DRAM
Lengthy development cycle
  • 5 years+ longevity and BOM/FW control
  • Special extension support
Wide ambient temperature
  • Industrial/Automotive Grade temp (AG2 & 3)
  • Tailored thermal solutions
Zero-failure safety standard
  • High-endurance SLC/pSLC/MLC/TLC series
  • Customized spare block (OP) setting
Unstable power supply from the platform
  • Customized power cycling test
  • Sudden Power-Off Recovery (SPOR) by firmware (FW) enhancement
  • MCU-based power loss protection (PLP)
Environmental erosion prevention
  • 50μ" gold fingers by customization
  • Waterproof system-in-package (SIP)
  • Anti-erosion, salt fog testing
Host device power-on/off patterns
  • Firmware adjustment on CMD and cache behaviors
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Vorgestellte Technologien

Anti-Sulfur Resistors
ATP NAND flash storage products offer an anti-sulfur resistor option to prevent the corrosive effects of sulfur contamination, guaranteeing continued dependable performance for a long time.
Conformal Coating

Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.

Read more

Thicker Gold Finger

30µ”-thick gold plating of the DRAM contact optimizes signal transmission quality between the connector and DRAM modules.

Hardware-Based In-Flight-Data Power Loss Protection
#ATP EXCLUSIVE
This hardware-based power failure protection prevents data loss during a power loss event by ensuring that the last read/write/erase command is completed and data is stored safely in non-volatile flash memory. Select NVMe modules and SATA SSDs feature a new microcontroller unit (MCU)-based design that allows the PLP array to perform intelligently in various temperatures, power glitches and charge states to protect both device and data.
Mehr Erfahren
Firmware-Based Data-At-Rest Power Loss Protection
The firmware-based power failure protection effectively protects data written to the device prior to power loss. After the host receives a signal from the device that the WRITE operation has been successfully completed, newly written as well as previously written data are protected even if a sudden power loss occurs.
View All Technologies

Empfohlene Produkte

Spezifikationen

Produkt anzeigen
PCIe® Gen4 NVMe M.2 SSD
Product LinePremium SuperiorSuperiorValue SuperiorPremiumSuperior
NamingN751Pi 1N651Si / N651ScN601Sc 2N601Vi / N601VcN601Sc 2 N701Pi / N701PcN601Si / N601Sc 2
InterfacePCIe G4 x4 PCIe G4 x4PCIe G4 x4PCIe G4 x4PCIe G4 x4PCIe G4 x2 6PCIe G4 x2 6
Flash Type3D TLC (pSLC mode) 3D TLC3D TLC3D TLC3D TLC3D TLC (pSLC mode) 3D TLC
Form FactorM.2 2280-D6-M / M.2 2280-D2-MM.2 2280-D6-M / M.2 2280-D5-M / M.2 2280-D2-MM.2 2280 M-KeyM.2 2280-S3-MM.2 2242 M-KeyM.2 2230-S4-MM.2 2230-S4-M
Operating Temperature-40°C to 85°C -40°C to 85°C / 0°C to 70°C0°C to 70°C-40°C to 85°C / 0°C to 70°C 0°C to 70°C-40°C to 85°C / 0°C to 70°C-40°C to 85°C / 0°C to 70°C
Power Loss Protection OptionsHardware + Firmware Based / Firmware Based 3Hardware + Firmware Based / Firmware Based 3Hardware + Firmware Based / Firmware BasedFirmware BasedHardware + Firmware Based / Firmware BasedFirmware BasedFirmware Based
Optional SED FeaturesAES 256-bit Encryption, TCG Opal 2.0 AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0 AES 256-bit Encryption, TCG Opal 2.0
Capacity80 GB to 1.28 TB240 GB to 7.68 TB 4480 GB to 3.84 TB240 GB to 1.92 TB 480 GB to 1.92 TB 80 GB to 320 GB240 GB to 960 GB
Sequential Read (MB/s) up to6,4506,4507,0005,0007,0003,5653,565
Sequential Write (MB/s) up to6,0506,0506,0004,3006,0003,2803,280
Random Reads IOPS up to1,090,0001,091,000900,000800,000900,000630,000630,000
Random Writes IOPS up to1,107,0001,245,000950,0001,100,000950,000755,000755,000
Endurance (TBW)5 up to120,000 TB76,400 TB5,760 TB4,170 TB2,880 TB29,235 TB2,810 TB
Reliability MTBF @ 25°C>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours
Dimensions (mm)80.0 x 22.0 x 3.85; 80.0 x 22.0 x 3.6 (Optional 8 mm heatsink)80.0 x 22.0 x 3.85; 80.0 x 22.0 x 3.9; 80.0 x 22.0 x 3.6 (Optional 8 mm heatsink)80.0 x 22.0 x 3.680.0 x 22.0 x 2.442.0 x 22.0 x 3.630.0 x 22.0 x 2.7530.0 x 22.0 x 2.75
CertificationsCE, FCC, BSMI, UKCA, RoHS, REACH CE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, UL
Warranty5 years 3 years3 years3 years3 years5 years3 years

1. 150K P/E cycle configuration drive available on a project basis.
2. Product specifications may be subject to change.
3. M.2 2280-D6-M form factor (max height: 3.85mm) offers Hardware Based Power Loss Protection, while M.2 2280-D5-M (max height: 3.9mm) and M.2 2280-D2-M form factor (max height: 3.6mm) provides Firmware Based Power Loss Protection.
4. The 7,680 GB capacity is rated for commercial temperature operation only (0°C to 70°C).
5. Under highest Sequential write value. May vary by density, configuration and applications.
6. The N701/N601 is configured with x2 lanes by default, but x4 lanes may be available by project or customer request.

Stories

Anhang herunterladen

  • ATP Gen4 M.2 NVMe product flyer
    English
    2025-07-10238.38KB
    download
  • ATP M.2 SATA product flyer
    English
    2025-06-25346.31KB
    download
  • ATP 2.5 SSD product flyer
    English
    2025-06-25300.58KB
    download
  • ATP eMMC Industrial product flyer
    English
    2025-03-28239.82KB
    download
  • ATP microSD card product flyer
    English
    2025-06-25405.69KB
    download
  • ATP SD card product flyer
    English
    2025-06-25370.25KB
    download
  • ATP DDR4 product flyer
    English
    2025-03-28428.71KB
    download
  • ATP DDR3 product flyer
    English
    2025-03-28378.56KB
    download

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