Industrial Product Line
Flash Products Naming Rule
Flash Product Line & DRAM Introduction
The ATP Premium Line consists of mass storage solutions built for uncompromising performance, maximum dependability, and exceptional endurance. Outfitted with best-in-class technologies ensuring the highest levels of reliability, these solutions are hardwired for the most demanding mission-critical applications where system failures or interruptions can significantly impact operations. With industrial temperature ratings of -40°C to 85°C, these rugged solutions can withstand harsh operating environments and extreme temperatures. Unparalleled usage life and brisk write speeds set the Premium Line a cut above the rest. High input/output operations per second (IOPS) ensure consistently high performance, and PowerProtector Technology guarantees that data in transit are safely stored to the flash chip in the event of a power loss, thus safeguarding data integrity, averting data loss or corruption, and preventing device damage.
The ATP Superior Line brings together powerful and proven features and technologies for rigorous operations in diverse industries, capably handling mixed workloads with high IOPS requirements. Generous storage densities make these products ideal for data-hungry and write-intensive applications; mid-density drive options offer a wider range of choices for cost efficiency; and, configurable over-provisioning gives users flexibility to make adjustments based on actual workloads for the optimal balance between drive performance and endurance. ATP Superior Line products are available in both industrial temperature (-40°C to 85°C) and commercial temperature ratings (embedded SSD: 0°C to 70°C; SD/microSD card: -25°C to 85°C), giving users the flexibility to choose the temperature range most appropriate for their needs. to customer request.
The ATP Value Line integrates advanced essential solutions to the growing needs of enterprises and industries, offering sustained, reliable performance and consistent reliability. Superb choices as embedded boot or boot image devices, they are ideally suited for Internet of Things (IoT) applications, spurring greater connectivity for homes, cars, medical equipment, and other smart devices. Ample storage capacity is available for installing an operating system with space to spare for other applications.
The ATP Automotive Edition consists of tailor-made solutions to meet automotive customers’ requirements for maximum data reliability. These solutions undergo the strictest levels of testing and are certified according to automotive-industry standards, including but not limited to IATF-16949 Certification, APQP, PPAP, IMDS, AEC-Q100, product selection/features and joint validation tests depending on project support and according to customer request.
Flash Product Technology
* Customization option available on a project basis.
Provides a user-friendly interface for monitoring the health status and life expectancy of a flash product.
Sudden Power-Off Recovery (SPOR)
The Sudden Power-Off Recovery (SPOR) firmware-based power failure protection effectively protects data written to the device prior to power loss. After the host receives a signal from the device that the WRITE operation has been successfully completed, newly written as well as previously written data are protected even if a sudden power loss occurs.
Advanced Wear Leveling
Manages the reads and writes across blocks evenly to optimize the overall life expectancy of a flash product.
Monitors the error bit level in every operation. Before the error bit in a block reaches or exceeds the preset threshold value, AutoRefresh moves the data to a healthy block, thus preventing the controller from reading blocks with too many error bits and averting read disturbance and data corruption.
Dynamic Data Refresh
Runs automatically in the background to reduce the risk of read disturbance and sustain data integrity in seldom-accessed area by sequentially scanning the user area flag record without affecting the read/write operation. The data that has been completely moved to another block will be read and compared with the source data to ensure data integrity.
A sanitization solution made especially for SSDs and memory cards making sure that sensitive data is not recovered or retrieved if the SSD or memory cards needs to be disposed or repurposed. By making sure that no remnant of sensitive data remains, Secure Erase is the ideal solution for government defense, and business applications with intense security requirements.
Operational stability in extreme temperatures from -40°C to 85°C.
SiP (System in Package)
Manufacturing process that encapsulates all exposed components to provide protection and shielding.
Complete Drive Test
|For NAND flash storage products, the entire drive, including firmware, user and spare areas, is thoroughly tested to ensure that there are no bad blocks. DRAM products also undergo complete testing, covering PHY and controller, including meta/mapping and data caching areas.|
|ATP conducts compatibility/function tests with client-supplied host devices and systems, to proactively detect and minimize failures that may not be caught in production tests, thus improving overall quality.|
DRAM – Add on value
* Customization option available on a project basis.
ATP DRAM module can endure extreme temperatures ranging from -40°C to 85°C, ensuring long-term stability for systems installed in telecom, industrial and military/aerospace operations where consistant availability and steadfast performance are of critical importance.
ATP's modules undergo two levels of testing to ensure maximum reliability:
A protective layer of parylene is applied to electronic circuits and modules, accessing spaces as narrow as 0.01 mm to shield against dust, chemical, extreme temperatures, moisture and corrosion. The coating film is formed by the chemical vapor deposition (CVD) process, and unlike dipping and spraying techniques, is completely pinhole free as the film conforms to any irregular shape, forming a vacuum-like environment to coat all components and points of failure.
Increased Thickness, Strength
In order to ensure the quality of the signal transmission between the connector and ATP DRAM module, ATP utilizes gold finger plating with 30µ” thickness, compared to competitors’ DRAM modules thickness typically at less than 10µ”.
Ordinary silver resistors corrode and become non-conductive when exposed to sulfur. ATP DRAM modules use anti-sulfur resistors that repel the damaing effects of sulfur contamination, quaranteeing continued dependable performance for a long time and lowering the total cost of ownership by preventing unnecessary downtime and expensive component replacements.
Test During Burn-In (TDBI)
Components are subjected to low and elevated temperatures within an enclosed chamber to detect failure as a result of high-failure rates in the early life failure (ELF) period.