Networking / Telekom

Accelerating enterprise performance

Networking / TelecomNetworking / Telecom
Spezifische LösungenTechnologienEmpfohlene ProdukteStoriesDownloads

Spezifische Lösungen

Growing demand for higher computing network appliances at the edge, such as RU and DU for scaling virtualization deployment, is driven on by the Open Radio Network structure in the 5G era. Telco/ISPs are struggling to provide higher SPEC DRAM/NAND storage at the edge due to a lack of chassis space, fluctuating temperatures, and environmental erosions.

With its expertise in co-design and validation, ATP meets the demand for hardware and software design that must adhere to stringent service level commitments.

Herausforderungen & ATP Lösungen

Embedded form factors for boot/cache drives
  • SSDs with power loss protection
  • SATA: M.2 2280/2242, mSATA, 2.5", CFast
  • NVMe: M.2 2280/2230, HSBGA
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Data integrity/reliability
  • End-to-end data path protection - CRC, SRAM/DRAM/NAND ECC, NAND RAID
Wide ambient temperature support
  • Industrial temperature operation
  • High/Low temperature reliability validation
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
High Read and Write endurance (TBW/DWPD)
  • High-endurance 3D TLC/pSLC/SLC series
  • Capacity overprovisioning settings
Sustained write throughput
  • Configuration optimization - NAND mode selection, cache tuning, overprovisioning settings, firmware tuning
Surprise power loss or glitch protection
  • MCU-based power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Data Security
  • AES, TCG-Opal 2.0, Self-Encrypting Drive
  • Secure Erase
  • Customized encryption security
Environmental and safety homologation
  • Global Certifications
  • FCC, CE, UKCA, VCCI, BSMI, KCC, RCM, IC, UL, CB, CSA, Morocco, etc. (optional)
  • ROHS, REACH
Customized validation
  • Collaboration on customer specific test, qualification, and validation that are beyond JEDEC standards
  • Performance/Latency, Power consumption, Endurance, Data Retention, 4 Corner power cycling and thermal testing, Signal Integrity, system interoperability, reliability testing, etc.
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Nowadays, the heart of virtually all industries is networking and cybersecurity, encompassing a variety of network-related appliances. Together, ATP builds solutions that drive toward greater computing that upscales software defined solutions for providers across the board, including gateway, UTM, NGFW, managed switch, and all sorts of servers.

Today, over 70% of companies listed on Gartner’s Magic Quadrant report for Primary Storage, Data Center and Cloud Computing, and WAN-Edge Infrastructure consider ATP as a strategic supplier.

Herausforderungen & ATP Lösungen

Embedded form factors for boot/cache drives
  • SSDs with power loss protection
  • SATA: M.2 2280/2242, mSATA, 2.5", CFast
  • NVMe: M.2 2280/2230, HSBGA
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Data integrity/reliability
  • End-to-end data path protection - CRC, SRAM/DRAM/NAND ECC, NAND RAID
Wide ambient temperature support
  • Industrial temperature operation
  • High/Low temperature reliability validation
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
High Read and Write endurance (TBW/DWPD)
  • High-endurance 3D TLC/pSLC/SLC series
  • Capacity overprovisioning settings
Sustained write throughput
  • Configuration optimization - NAND mode selection, cache tuning, overprovisioning settings, firmware tuning
Surprise power loss or glitch protection
  • MCU-based power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Data Security
  • AES, TCG-Opal 2.0, Self-Encrypting Drive
  • Secure Erase
  • Customized encryption security
Environmental and safety homologation
  • Global Certifications
  • FCC, CE, UKCA, VCCI, BSMI, KCC, RCM, IC, UL, CB, CSA, Morocco, etc. (optional)
  • ROHS, REACH
Customized validation
  • Collaboration on customer specific test, qualification, and validation that are beyond JEDEC standards
  • Performance/Latency, Power consumption, Endurance, Data Retention, 4 Corner power cycling and thermal testing, Signal Integrity, system interoperability, reliability testing, etc.
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

While experiencing exponential expansion, storage server and cloud service providers also confront difficulties with data integrity, reliability, and other factors that are crucial to perpetual up-time. Boot drives, server DRAM, and other uncommon embedded form factors are areas of expertise for ATP.

Today, ATP is regarded as a strategic supplier by more than 70% of the businesses included in Gartner's Magic Quadrant reports for Primary Storage, Data Center and Cloud Computing, and WAN-Edge Infrastructure.

Herausforderungen & ATP Lösungen

Embedded form factors for boot/cache drives
  • SSDs with power loss protection
  • SATA: M.2 2280/2242, mSATA, 2.5", CFast
  • NVMe: M.2 2280/2230, HSBGA
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Data integrity/reliability
  • End-to-end data path protection - CRC, SRAM/DRAM/NAND ECC, NAND RAID
Wide ambient temperature support
  • Industrial temperature operation
  • High/Low temperature reliability validation
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
High Read and Write endurance (TBW/DWPD)
  • High-endurance 3D TLC/pSLC/SLC series
  • Capacity overprovisioning settings
Sustained write throughput
  • Configuration optimization - NAND mode selection, cache tuning, overprovisioning settings, firmware tuning
Surprise power loss or glitch protection
  • MCU-based power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Data Security
  • AES, TCG-Opal 2.0, Self-Encrypting Drive
  • Secure Erase
  • Customized encryption security
Environmental and safety homologation
  • Global Certifications
  • FCC, CE, UKCA, VCCI, BSMI, KCC, RCM, IC, UL, CB, CSA, Morocco, etc. (optional)
  • ROHS, REACH
Customized validation
  • Collaboration on customer specific test, qualification, and validation that are beyond JEDEC standards
  • Performance/Latency, Power consumption, Endurance, Data Retention, 4 Corner power cycling and thermal testing, Signal Integrity, system interoperability, reliability testing, etc.
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

From Whitebox uCPE makers to turnkey solution providers, the SD-WAN industry has struggled to strike a balance between ideal OPEX and practical CAPEX. An achievable OPEX within the service level agreement is ensured by a better endurance DRAM/NAND at a reasonable cost.

Today, leading SD-WAN solution providers consider ATP as a strategic supplier, we’d like to show you why

Herausforderungen & ATP Lösungen

Embedded form factors for boot/cache drives
  • SSDs with power loss protection
  • SATA: M.2 2280/2242, mSATA, 2.5", CFast
  • NVMe: M.2 2280/2230, HSBGA
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Data integrity/reliability
  • End-to-end data path protection - CRC, SRAM/DRAM/NAND ECC, NAND RAID
Wide ambient temperature support
  • Industrial temperature operation
  • High/Low temperature reliability validation
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
High Read and Write endurance (TBW/DWPD)
  • High-endurance 3D TLC/pSLC/SLC series
  • Capacity overprovisioning settings
Sustained write throughput
  • Configuration optimization - NAND mode selection, cache tuning, overprovisioning settings, firmware tuning
Surprise power loss or glitch protection
  • MCU-based power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Data Security
  • AES, TCG-Opal 2.0, Self-Encrypting Drive
  • Secure Erase
  • Customized encryption security
Environmental and safety homologation
  • Global Certifications
  • FCC, CE, UKCA, VCCI, BSMI, KCC, RCM, IC, UL, CB, CSA, Morocco, etc. (optional)
  • ROHS, REACH
Customized validation
  • Collaboration on customer specific test, qualification, and validation that are beyond JEDEC standards
  • Performance/Latency, Power consumption, Endurance, Data Retention, 4 Corner power cycling and thermal testing, Signal Integrity, system interoperability, reliability testing, etc.
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Vorgestellte Technologien

End-to End Data Path Protection
Ensures error checking and correction as data moves from the host to the storage device controller and vice versa. By covering the entire data path, end-to-end protection guarantees integrity at any point during data transfer
Mehr Erfahren
Industrial Temperature
Operational stability in extreme temperatures from -40°C to 85°C.
Hardware-Based In-Flight-Data Power Loss Protection
#ATP EXCLUSIVE
This hardware-based power failure protection prevents data loss during a power loss event by ensuring that the last read/write/erase command is completed and data is stored safely in non-volatile flash memory. Select NVMe modules and SATA SSDs feature a new microcontroller unit (MCU)-based design that allows the PLP array to perform intelligently in various temperatures, power glitches and charge states to protect both device and data.
Mehr Erfahren
Firmware-Based Data-At-Rest Power Loss Protection
The firmware-based power failure protection effectively protects data written to the device prior to power loss. After the host receives a signal from the device that the WRITE operation has been successfully completed, newly written as well as previously written data are protected even if a sudden power loss occurs.
Wide Temp DRAM Modules

These modules use unique ATP testing and technologies to enable support for industrial temperature operating ranges from -40°C to 85°C but at lower price points than modules with native industrial grade ICs.

Test During Burn-In (TDBI)

TDBI involves subjecting ATP DRAM modules to various temperatures, power cycling, voltages and other stress conditions within a certain period. It aims to cause weak ICs to fail so they can be screened out, thus making sure that the modules contain only the most robust ICs.

Read more

Anti-Sulfur Resistors
ATP DRAM modules and NAND flash storage products offer an anti-sulfur resistor option to prevent the corrosive effects of sulfur contamination, guaranteeing continued dependable performance for a long time.
Conformal Coating

Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.

Read more

SecurEncrypt

AES-256 Verschlüsselung der Nutzerdaten

TCG Opal

Verschlüsselung und weiterer Schutzmechanismen für Speichermedien, definiert von der Trusted Computing Group

View All Technologies

Empfohlene Produkte

Spezifikationen

Produkt anzeigen
DDR5
DIMM TypeRDIMMECC UDIMMECC CUDIMMNon-ECC UDIMMNon-ECC CUDIMMECC SO-DIMMECC CSO-DIMMNon-ECC SO-DIMMNon-ECC CSO-DIMM
Density16 GB to 256 GB16 GB to 64 GB16 GB to 64 GB8 GB to 64 GB8 GB to 64 GB 16 GB to 64 GB16 GB to 64 GB 8 GB to 64 GB8 GB to 64 GB
Speed up to (MT/s)5600 / 640056006400560064005600640056006400
PCB Height*Low profile / VLP*Low profile / VLP*Low profileLow profileLow profile Low profileLow profile Low profileLow profile
Operating Temperature0°C to 85°C / -40°C to 85°C0°C to 85°C / -40°C to 85°C0°C to 85°C / -40°C to 85°C 0°C to 85°C / -40°C to 85°C0°C to 85°C / -40°C to 85°C 0°C to 85°C / -40°C to 85°C0°C to 85°C / -40°C to 85°C 0°C to 85°C / -40°C to 85°C0°C to 85°C / -40°C to 85°C

* VLP: 0.74"

Stories

Anhang herunterladen

  • ATP_ERS_product_flyer_v2
    English
    2025-01-087.36MB
    download
  • ATP M.2 SATA product flyer
    English
    2025-03-21346.21KB
    download
  • ATP mSATA product flyer
    English
    2025-03-28211.33KB
    download
  • ATP 2.5 SSD product flyer
    English
    2025-03-28300.95KB
    download
  • ATP CFast card product flyer
    English
    2025-03-28145.95KB
    download
  • ATP M.2 NVMe product flyer
    English
    2025-03-28374.36KB
    download
  • ATP NVMe HSBGA product flyer
    English
    2025-03-28248.63KB
    download
  • ATP DDR5 product flyer
    English
    2025-03-28283.87KB
    download
  • ATP DDR4 product flyer
    English
    2025-03-28428.71KB
    download
  • ATP DDR3 product flyer
    English
    2025-03-28378.56KB
    download

Produktentscheidungshilfe

Diskutieren Sie mit unseren Memory und Speicherexperten

Mehr Erfahren
Kontaktieren Sie uns