automotive storage memory
Automotive
All-Terrain Automotive Storage Solutions for the Road Ahead
Solutions to Unique Challenges
Autonomous vehicles are powerful computing platforms that demand exacting flash storage specifications, such as uncompromising reliability, high-performance, and efficient power consumption which ensures a great user experience with utmost safety.
Vehicles that support Level 2 and 3, or even Level 4 autonomous function collect and process massive amounts of data in real time. Higher capacity solid-state storage devices are required to accommodate the ever-growing data volumes of radar, sensor, vehicle-to-everything (V2X), and lidar systems.
ATP has been providing high-quality solutions for over three decades, including specialized solutions to the world’s major automobile manufacturers and Advanced Driver Assistance Systems (ADAS) makers.
Unique Challenges
Solutions
In-vehicle infotainment systems often require customization support from experienced flash storage solution providers. Challenges in operating temperatures, life cycle and write endurance cause IVI makers to demand joint validation throughout the flash product manufacturing cycle, power cycling tests, or unique content preload service.
ATP is one of the few NAND flash storage manufacturers experienced in providing all solutions to globally renowned car makers, meeting their unique reliability and longevity challenges.
Unique Challenges
Solutions
In the race to develop future-generation automobiles, car makers have been acquiring extensive data from field-deployed vehicles. Mega data is the key to winning the race. In-vehicle data logging in any terrain under any weather condition is a constant challenge.
Data loggers therefore require high-density flash storage with wide temperature support, supporting steady and constant write performance rather than peak performance even at extreme temperatures, and encryption security. ATP can meet all the above requirements and even caters unique form factors that come from different data logger chassis designs.
Unique Challenges
Solutions
Electric vehicle (EV) charging stations have been increasing at an amazing pace to keep up with surging EV adoption rates. While the industry is still shaping up in terms of architectural or service standards, one certain challenge is the need for remote EV infrastructure management that requires industrial grade gateways in different hierarchies. ATP offers industrial grade flash storage in modules, 16x20mm 291 ball-grid array (BGA) or e.MMC form factors, which ensure such edge nodes may be stationed unattended with ease.
Unique Challenges
Solutions
The drive recorder industry has been evolving to multi-cameras structure, AI features, and increasing high-definition standards. ATP has been offering tailored flash cards for world-renowned drive recorder vendors for many years, so we know their challenges and demands. As the storage capacity doubles up, what remains unchanged is the demand for high endurance, low latency response time, steady write performance, wide operating temperature support, and reliability under irregular power on/off conditions, shock, and card insertion-related damage. ATP answers all the above and beyond, offering extra services, such as customized testing and joint validation.
Unique Challenges
Solutions
Featured Technologies
Industrial Temperature
Operational stability in extreme temperatures from -40°C to 85°C.
Hardware-based Power Loss Protection
This hardware-based power failure protection prevents data loss during a power loss event by ensuring that the last read/write/erase command is completed and data is stored safely in non-volatile flash memory. Select NVMe modules and SATA SSDs feature a new microcontroller unit (MCU)-based design that allows the PLP array to perform intelligently in various temperatures, power glitches and charge states to protect both device and data.
Firmware-based Power Loss Protection
The firmware-based power failure protection effectively protects data written to the device prior to power loss. After the host receives a signal from the device that the WRITE operation has been successfully completed, newly written as well as previously written data are protected even if a sudden power loss occurs.
Vibration-Proof BGA Package
Soldered-down solutions can withstand vigorous shaking and are resistant against vibrations for reliable performance even during grueling operations.
TCG Opal 2.0
TCG Opal Secirity Subsystem Class (SSC) 2.0 is a set of specifications for self-encrypting drives that present a hierarchy of security management standards to secure data from theft and tampering. Security features include hardware-based data encryption, pre-boot authentication (PBA) and AES-128/256 data encryption to protect the confidentiality of data at rest.
Complete Drive Test
For NAND flash storage products, the entire drive, including firmware, user and spare areas, is thoroughly tested to ensure that there are no bad blocks. DRAM products also undergo complete testing, covering PHY and controller, including meta/mapping and data caching areas.
Joint Validation
ATP conducts compatibility/function tests with client-supplied host devices and systems, to proactively detect and minimize failures that may not be caught in production tests, thus improving overall quality.
Recommended Products
Specifications
View product| PCIe® Gen3 NVMe M.2 2280 / 2242 / 2230 SSD | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Product Line | Premium | Premium | Superior | Superior | Superior | Superior | Superior | Superior | Value | Value | Value | Value |
| Naming | N750Pi (High Endurance) | N700Pi | N700Si | N700Sc | N650Si (High Endurance) | N650Sc (High Endurance) | N600Si | N600Sc | N600Vc | N600Vc | N600Vi | N600Vc |
| Interface | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 | PCIe G3 x4 |
| Flash Type | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC (pSLC mode) | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC | 3D TLC |
| Form Factor | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2230-S4-M | M.2 2230-S4-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280-D2-M | M.2 2280 S2-M | M.2 2242 D5-M | M.2 2230-S4-M | M.2 2230-S4-M |
| Operating Temperature (Tcase)1 | -40°C to 85°C | -40°C to 85°C | -40°C to 85°C | 0°C to 70°C | -40°C to 85°C | 0°C to 70°C | -40°C to 85°C | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C | -40°C to 85°C | 0°C to 70°C |
| Power Loss Protection Options | Hardware + Firmware Based | Hardware + Firmware Based | Firmware Based | Firmware Based | Hardware + Firmware Based or Firmware Based | Hardware + Firmware Based or Firmware Based | Hardware + Firmware Based or Firmware Based | Hardware + Firmware Based or Firmware Based | Firmware Based | Firmware Based | Firmware Based | Firmware Based |
| Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | - | - | - | - |
| Capacity | 40 GB to 320 GB | 40 GB to 640 GB | 40 GB to 160 GB | 40 GB to 160 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120 GB to 1,920 GB | 120 GB to 1,920 GB | 120 GB to 960 GB | 120 GB to 960 GB | 120GB to 480GB | 120GB to 480GB |
| Sequential Read (MB/s) up to | 3,150 | 3,150 | 2,000 | 2,000 | 3,420 | 3,420 | 3,420 | 3,420 | 2,600 | 2,600 | 2,050 | 2,050 |
| Sequential Write (MB/s) up to | 2,670 | 2,820 | 1,600 | 1,600 | 3,050 | 3,050 | 3,050 | 3,050 | 1,870 | 1,870 | 1,550 | 1,550 |
| Random Reads IOPS up to | 147,789 | 147,789 | 135,600 | 135,600 | 222,700 | 222,700 | 225,200 | 225,200 | 184,300 | 184,300 | 138,000 | 138,000 |
| Random Writes IOPS up to | 114,227 | 114,227 | 112,000 | 112,000 | 176,600 | 176,600 | 179,200 | 179,200 | 145,900 | 145,900 | 112,600 | 112,600 |
| Endurance (TBW)2 up to | 16,000 TB | 21,300 TB | 4,280 TB | 4,280 TB | 4,640 TB | 4,640 TB | 5,585 TB | 5,585 TB | 1,520 TB | 1,520 TB | 768 TB | 768 TB |
| Reliability MTBF @ 25°C | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours | >2,000,000 hours |
| Dimensions (mm) | 80.0 x 22.0 x 3.5; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.5; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 30.0 x 22.0 x 2.5 | 30.0 x 22.0 x 2.5 | 80.0 x 22.0 x 3.5; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.5; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.5; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 3.5; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) | 80.0 x 22.0 x 2.2 | 42.0 x 22.0 x 3.6 | 30.0 x 22.0 x 2.5 | 30.0 x 22.0 x 2.5 |
| Certifications | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH | CE, FCC, BSMI, UKCA, RoHS, REACH |
| Warranty | 5 years | 5 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years | 2 years |
1 Case Temperature, the composite temperature as indicated by SMART temperature attributes.
2 Under highest Sequential write value. May vary by density, configuration and applications.
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