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Solutions to Unique Challenges

Operation Technology (OT) systems have been the backbones of all types of applications, and even more so when OT and IT converge.

At the edge, a wide range of appliances is deployed, including rackmount servers, compact fanless box PCs, and embedded motherboards or COMs. They require equally complex but essential storage and DRAM modules.

As a reputable supplier of specialized memory and flash storage solutions, ATP offers a full spectrum of generation and form factors solutions. ATP ensures the longest uptime and least maintenance for your systems by focusing on wide-temp and industrial-grade quality.

Unique Challenges & Atp Solutions

Embedded form factors for legacy platforms
  • 512 MB to 8 GB SLC/pSLC/MLC microSD, SD
  • Industrial M.2 SATA3 or NVMe, mSATA, CF, CFast, eUSB, UFD, e.MMC, BGA SSD
  • DDR2/DDR3 VLP, 1.35V
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Wide ambient temperature Fanless platforms
  • Extreme temperature solution (-40°C to 105°C)
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
  • I-temp RCD
High Endurance for least maintenance (low cost of ownership)
  • High-endurance SLC/pSLC/3D TLC series
  • Capacity overprovisioning settings
Surprise power loss or glitch
  • MCU-based hardware power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Environmental erosion prevention
  • 30~50μ” gold fingers by customization
  • SIP package waterproof IP67
  • Anti-erosion, salt fog testing
  • Conformal Coating (Optional)
Customized FW setting
  • Card speed mode
  • Write capable, Read privilege control
  • Boot-up mechanism tuning
  • SMART ID attributes tuning
Customized validation/Label
  • Collaboration on customer specific test,
  • qualification, and validation that are beyond JEDEC standards
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Automation systems in factories and warehouses begin with analog equipment or machinery and progress to digital control systems. Legacy systems continue to play significant roles. The challenge is that system design and refreshes just cannot keep up with the fast-paced memory/flash revolution.

ATP specializes in legacy form factors and support for longevity. ATP has the solution if you're having trouble finding memory or flash that is no longer widely available, while also providing newer formfactors with high storage capacity for future design, such as CFexpress or eMMC.

Unique Challenges & Atp Solutions

Embedded form factors for legacy platforms
  • 512 MB to 8 GB SLC/pSLC/MLC microSD, SD
  • Industrial M.2 SATA3 or NVMe, mSATA, CF, CFast, eUSB, UFD, e.MMC, BGA SSD
  • DDR2/DDR3 VLP, 1.35V
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Wide ambient temperature Fanless platforms
  • Extreme temperature solution (-40°C to 105°C)
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
  • I-temp RCD
High Endurance for least maintenance (low cost of ownership)
  • High-endurance SLC/pSLC/3D TLC series
  • Capacity overprovisioning settings
Surprise power loss or glitch
  • MCU-based hardware power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Environmental erosion prevention
  • 30~50μ” gold fingers by customization
  • SIP package waterproof IP67
  • Anti-erosion, salt fog testing
  • Conformal Coating (Optional)
Customized FW setting
  • Card speed mode
  • Write capable, Read privilege control
  • Boot-up mechanism tuning
  • SMART ID attributes tuning
Customized validation/Label
  • Collaboration on customer specific test,
  • qualification, and validation that are beyond JEDEC standards
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

The greatest obstacle in the energy sector frequently results from exposure to the environment, particularly extreme wide-temperature, erosion from salt, sulfur, or acid. The least amount of human maintenance is required for equipment or systems that are frequently deployed outside. At the heart of this industry regulations are safety and durability.

ATP products are made from wide-temperature specifications. ATP upholds strict standards by using sophisticated burn-in/screening tests on top of industrial-grade chips and wafers.

Unique Challenges & Atp Solutions

レガシー プラットフォーム用の組み込みフォームファクター
  • 512 MB to 8 GB SLC/pSLC/MLC microSD, SD
  • Industrial M.2 SATA3 or NVMe, mSATA, CF, CFast, eUSB, UFD, e.MMC, BGA SSD
  • DDR2/DDR3 VLP, 1.35V
必要とされる長期にわたるBOMの一貫性の維持
  • 5年以上の供給性とBOM管理
広い周囲温度でのファンレス プラットフォーム
  • 究極な温度のソリューション (-40°C to 105°C)
  • 高温/低温信頼性検証
  • 温度サイクルの検証
  • 温度と性能の特性評価と対策
  • 放熱ソリューション
  • I-Temp RCD (Register Clock Driver)
最小限のメンテナンスで高い耐久性 (所有コストの低減)
  • 高耐久性3D TLC/pSLC/SLCシリーズ
  • オーバープロビジョニング (OP) 設定
電源瞬断または電圧グリッチ
  • MCU ベース電断対策 (PLP)
  • 電源サイクリング テストのカスタマイズ
  • ファームウェアによる瞬断リカバリー機能(SPOR)
環境における浸食防止
  • 30μ～50μ厚の金メッキゴールドフィンガーにカスタマイズ
  • 防水 IP67対応SiP パッケージ
  • 腐食防止、塩水噴霧試験
  • コンフォーマルコーティング (オプション)
ファームウェア設定のカスタマイズ
  • カードスピードモード
  • ライト可能/リード権限制御
  • 起動メカニズムの調整
  • S.M.A.R.T. ID 属性の調整
お客様特有仕様での検証
  • JEDEC 規格を超えるお客様特有のテスト、認定試験、
  • および検証に関する共同作業
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Our never-ending desire for amusement is provided by digitally enabled gaming machines, such as slot machines, which are frequently constructed using I/O rich embedded hardware (general-purpose Box-PC, Mini-ITX, and Micro-ATX) on top of proprietary software solution.

The foundational hardware platform, however, necessitates a 7–15-year lifetime support, which presents an unique challenge for component support. The answer is ATP, which specializes in legacy and longevity assistance.

Unique Challenges & Atp Solutions

Embedded form factors for legacy platforms
  • 512 MB to 8 GB SLC/pSLC/MLC microSD, SD
  • Industrial M.2 SATA3 or NVMe, mSATA, CF, CFast, eUSB, UFD, e.MMC, BGA SSD
  • DDR2/DDR3 VLP, 1.35V
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Wide ambient temperature Fanless platforms
  • Extreme temperature solution (-40°C to 105°C)
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
  • I-temp RCD
High Endurance for least maintenance (low cost of ownership)
  • High-endurance SLC/pSLC/3D TLC series
  • Capacity overprovisioning settings
Surprise power loss or glitch
  • MCU-based hardware power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Environmental erosion prevention
  • 30~50μ” gold fingers by customization
  • SIP package waterproof IP67
  • Anti-erosion, salt fog testing
  • Conformal Coating (Optional)
Customized FW setting
  • Card speed mode
  • Write capable, Read privilege control
  • Boot-up mechanism tuning
  • SMART ID attributes tuning
Customized validation/Label
  • Collaboration on customer specific test,
  • qualification, and validation that are beyond JEDEC standards
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Test & Measurement is a specialized application used in a variety of vertical sectors. It has its proprietary hardware design and typically lasts for several generations. These platforms often only support low density logger storage, while also demand more intensive data writing endurance. 

As a result, equipment manufacturers in this sector seek essential storage that the mass market no longer offers, including 512MB/1~8G SLC flash cards for OS boot-drive or micro data logging, or DDR2/3 DRAM. ATP is pleased to have been a dedicated partner to these specialized professionals.

Unique Challenges & Atp Solutions

Embedded form factors for legacy platforms
  • 512 MB to 8 GB SLC/pSLC/MLC microSD, SD
  • Industrial M.2 SATA3 or NVMe, mSATA, CF, CFast, eUSB, UFD, e.MMC, BGA SSD
  • DDR2/DDR3 VLP, 1.35V
Need to maintain BOM consistency for long lifetime
  • 5 years+ longevity and BOM control
Wide ambient temperature Fanless platforms
  • Extreme temperature solution (-40°C to 105°C)
  • Thermal cycling validation
  • Thermal vs. Performance characterization & solutioning
  • Heatsink solutions
  • I-temp RCD
High Endurance for least maintenance (low cost of ownership)
  • High-endurance SLC/pSLC/3D TLC series
  • Capacity overprovisioning settings
Surprise power loss or glitch
  • MCU-based hardware power loss protection (PLP)
  • Customized power cycling tests
  • Sudden Power-Off Recovery (SPOR) by firmware
Environmental erosion prevention
  • 30~50μ” gold fingers by customization
  • SIP package waterproof IP67
  • Anti-erosion, salt fog testing
  • Conformal Coating (Optional)
Customized FW setting
  • Card speed mode
  • Write capable, Read privilege control
  • Boot-up mechanism tuning
  • SMART ID attributes tuning
Customized validation/Label
  • Collaboration on customer specific test,
  • qualification, and validation that are beyond JEDEC standards
Note: Listed ATP solutions are provided for reference only and may change without notice. Contact an ATP Distributor or Representative in your area to discuss how ATP can meet your specific requirements.

Featured Technologies

Industrial Temperature
Operational stability in extreme temperatures from -40°C to 85°C.
Conformal Coating

Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.

Read more

Thicker Gold Finger

30µ”-thick gold plating of the DRAM contact optimizes signal transmission quality between the connector and DRAM modules.

Conformal Coating
Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.
Anti-Sulfur Resistors
ATP NAND flash storage products offer an anti-sulfur resistor option to prevent the corrosive effects of sulfur contamination, guaranteeing continued dependable performance for a long time.
Vibration-Proof BGA Package
Soldered-down solutions can withstand vigorous shaking and are resistant against vibrations for reliable performance even during grueling operations.
Hardware-Based In-Flight-Data Power Loss Protection
#ATP EXCLUSIVE
This hardware-based power failure protection prevents data loss during a power loss event by ensuring that the last read/write/erase command is completed and data is stored safely in non-volatile flash memory. Select NVMe modules and SATA SSDs feature a new microcontroller unit (MCU)-based design that allows the PLP array to perform intelligently in various temperatures, power glitches and charge states to protect both device and data.
Read more
Firmware-Based Data-At-Rest Power Loss Protection
The firmware-based power failure protection effectively protects data written to the device prior to power loss. After the host receives a signal from the device that the WRITE operation has been successfully completed, newly written as well as previously written data are protected even if a sudden power loss occurs.
SiP (System in Package)
Manufacturing process that encapsulates all exposed components to provide protection and shielding.
View All Technologies

Recommended Products

Specifications

View product
PCIe® Gen4 NVMe M.2 SSD
Product LinePremium SuperiorSuperiorValue SuperiorSuperior
NamingN751Pi 1N651Si / N651ScN601Sc 2N601Vi / N601VcN601Sc 2 N601Si 2
InterfacePCIe G4 x4 PCIe G4 x4PCIe G4 x4PCIe G4 x4PCIe G4 x4PCIe G4 x4
Flash Type3D TLC (pSLC mode) 3D TLC3D TLC3D TLC3D TLC3D TLC
Form FactorM.2 2280-D6-M / M.2 2280-D2-MM.2 2280-D6-M / M.2 2280-D2-MM.2 2280 M-KeyM.2 2280-S3-MM.2 2242 M-KeyM.2 2230 M-Key
Operating Temperature-40°C to 85°C -40°C to 85°C / 0°C to 70°C0°C to 70°C-40°C to 85°C / 0°C to 70°C 0°C to 70°C-40°C to 85°C
Power Loss Protection OptionsHardware + Firmware Based / Firmware BasedHardware + Firmware Based / Firmware BasedHardware + Firmware Based / Firmware BasedFirmware BasedHardware + Firmware Based / Firmware BasedFirmware Based
Optional SED FeaturesAES 256-bit Encryption, TCG Opal 2.0 AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0AES 256-bit Encryption, TCG Opal 2.0
Capacity80 GB to 1.28 TB240 GB to 3.84 TB480 GB to 3.84 TB240 GB to 1.92 TB 480 GB to 1.92 TB 240 GB to 960 GB
Sequential Read (MB/s) up to6,4506,4507,0005,0007,0003,500
Sequential Write (MB/s) up to6,0506,0506,0004,3006,0003,400
Random Reads IOPS up to1,090,0001,091,000900,000800,000900,000600,000
Random Writes IOPS up to1,107,0001,245,000950,0001,100,000950,000750,000
Endurance (TBW)3 up to120,000 TB40,000 TB5,760 TB4,170 TB2,880 TB1,440 TB
Reliability MTBF @ 25°C>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours>3,000,000 hours
Dimensions (mm)480.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) / 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink)80.0 x 22.0 x 3.85; 80.0 x 24.4 x 12.5 (with 8 mm heatsink) / 80.0 x 22.0 x 3.6; 80.0 x 24.4 x 12.5 (with 8 mm heatsink)80.0 x 22.0 x 3.680.0 x 22.0 x 2.442.0 x 22.0 x 3.630.0 x 22.0 x 3.6
CertificationsCE, FCC, BSMI, UKCA, RoHS, REACH CE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, ULCE, FCC, BSMI, UKCA, RoHS, REACH, UL
Warranty5 years 2 years2 years2 years2 years2 years

1. 150K P/E cycle configuration drive available on a project basis.
2. Product specifications may be subject to change.
3. Under highest Sequential write value. May vary by density, configuration and applications.
4. M.2 2280-D6-M form factor (max height: 3.85mm), offers Hardware Based Power Loss Protection. M.2 2280-D2-M form factor (max height: 3.6mm), provides Firmware Based Power Loss Protection.

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