Solutions to Unique Challenges
Unique Challenges
Solutions
Unique Challenges
Solutions
Unique Challenges
Solutions
Unique Challenges
Solutions
Unique Challenges
Solutions
Featured Technologies

Industrial Temperature
Operational stability in extreme temperatures from -40°C to 85°C.

Conformal Coating
Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.

Thicker Gold Finger
30µ”-thick gold plating of the DRAM contact optimizes signal transmission quality between the connector and DRAM modules.

Conformal Coating
Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.

Anti-Sulfur Resistors
ATP NAND flash storage products offer an anti-sulfur resistor option to prevent the corrosive effects of sulfur contamination, guaranteeing continued dependable performance for a long time.

Vibration-Proof BGA Package
Soldered-down solutions can withstand vigorous shaking and are resistant against vibrations for reliable performance even during grueling operations.

Hardware-Based In-Flight-Data Power Loss Protection
This hardware-based power failure protection prevents data loss during a power loss event by ensuring that the last read/write/erase command is completed and data is stored safely in non-volatile flash memory. Select NVMe modules and SATA SSDs feature a new microcontroller unit (MCU)-based design that allows the PLP array to perform intelligently in various temperatures, power glitches and charge states to protect both device and data.

Firmware-Based Data-At-Rest Power Loss Protection
The firmware-based power failure protection effectively protects data written to the device prior to power loss. After the host receives a signal from the device that the WRITE operation has been successfully completed, newly written as well as previously written data are protected even if a sudden power loss occurs.

SiP (System in Package)
Manufacturing process that encapsulates all exposed components to provide protection and shielding.
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Specifications
View productPCIe® NVMe M.2 Type 1620 HSBGA SSD | |||
---|---|---|---|
Product Line | Superior | Premium | Superior |
Naming | N601Si 2 | N700Pi / N700Pc | N600Si / N600Sc |
Interface | PCIe G4 x4 | PCIe G3 x4 | PCIe G3 x4 |
Flash Type | 3D TLC | 3D TLC (pSLC mode) | 3D TLC |
Form Factor | 291-Ball, HSBGA | 291-Ball, HSBGA | 291-Ball, HSBGA |
Operating Temperature | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C / 0°C to 70°C |
Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based |
Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | - |
Capacity | 240 GB to 960 GB | 40 GB to 160 GB | 120 GB to 480 GB |
Sequential Read (MB/s) up to | 3,500 | 2,000 | 2,050 |
Sequential Write (MB/s) up to | 3,400 | 1,600 | 1,550 |
Random Reads IOPS up to | 600,000 | 135,600 | 138,000 |
Random Writes IOPS up to | 750,000 | 112,000 | 112,600 |
Endurance (TBW)1 up to | 1,440 TB | 4,280 TB | 768 TB |
Reliability MTBF @ 25°C | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours |
Dimensions (mm) | 16.0 x 20.0 x 1.6 | 16.0 x 20.0 x 1.6 | 16.0 x 20.0 x 1.6 |
Certifications | RoHS, REACH | RoHS, REACH | RoHS, REACH |
Warranty | 1 year | 1 year | 1 year |
1. Under highest Sequential write value. May vary by density, configuration and applications.
2. Product specifications may be subject to change.
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