Industrial / Automation
Built Rugged
Solutions to Unique Challenges
Unique Challenges
Solutions
Unique Challenges
Solutions
Unique Challenges
Solutions
Unique Challenges
Solutions
Unique Challenges
Solutions
Featured Technologies
Industrial Temperature
Operational stability in extreme temperatures from -40°C to 85°C.
Conformal Coating
Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.
Thicker Gold Finger
30µ”-thick gold plating of the DRAM contact optimizes signal transmission quality between the connector and DRAM modules.
Conformal Coating
Protects electronic circuits with a coating of the chemical compound Parylene to resist dust, chemical contaminants, extreme temperature, moisture and corrosion.
Anti-Sulfur Resistors
ATP NAND flash storage products offer an anti-sulfur resistor option to prevent the corrosive effects of sulfur contamination, guaranteeing continued dependable performance for a long time.
Vibration-Proof BGA Package
Soldered-down solutions can withstand vigorous shaking and are resistant against vibrations for reliable performance even during grueling operations.
Hardware-Based In-Flight-Data Power Loss Protection
This hardware-based power failure protection prevents data loss during a power loss event by ensuring that the last read/write/erase command is completed and data is stored safely in non-volatile flash memory. Select NVMe modules and SATA SSDs feature a new microcontroller unit (MCU)-based design that allows the PLP array to perform intelligently in various temperatures, power glitches and charge states to protect both device and data.
Firmware-Based Data-At-Rest Power Loss Protection
The firmware-based power failure protection effectively protects data written to the device prior to power loss. After the host receives a signal from the device that the WRITE operation has been successfully completed, newly written as well as previously written data are protected even if a sudden power loss occurs.
SiP (System in Package)
Manufacturing process that encapsulates all exposed components to provide protection and shielding.
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Specifications
View product| PCIe® NVMe M.2 Type 1620 HSBGA SSD | |||
|---|---|---|---|
| Product Line | Superior | Premium | Superior |
| Naming | N601Si 2 | N700Pi / N700Pc | N600Si / N600Sc |
| Interface | PCIe G4 x4 | PCIe G3 x4 | PCIe G3 x4 |
| Flash Type | 3D TLC | 3D TLC (pSLC mode) | 3D TLC |
| Form Factor | 291-Ball, HSBGA | 291-Ball, HSBGA | 291-Ball, HSBGA |
| Operating Temperature | -40°C to 85°C | -40°C to 85°C / 0°C to 70°C | -40°C to 85°C / 0°C to 70°C |
| Power Loss Protection Options | Firmware Based | Firmware Based | Firmware Based |
| Optional SED Features | AES 256-bit Encryption, TCG Opal 2.0 | AES 256-bit Encryption, TCG Opal 2.0 | - |
| Capacity | 240 GB to 960 GB | 40 GB to 160 GB | 120 GB to 480 GB |
| Sequential Read (MB/s) up to | 3,500 | 2,000 | 2,050 |
| Sequential Write (MB/s) up to | 3,400 | 1,600 | 1,550 |
| Random Reads IOPS up to | 600,000 | 135,600 | 138,000 |
| Random Writes IOPS up to | 750,000 | 112,000 | 112,600 |
| Endurance (TBW)1 up to | 1,440 TB | 4,280 TB | 768 TB |
| Reliability MTBF @ 25°C | >3,000,000 hours | >2,000,000 hours | >2,000,000 hours |
| Dimensions (mm) | 16.0 x 20.0 x 1.6 | 16.0 x 20.0 x 1.6 | 16.0 x 20.0 x 1.6 |
| Certifications | RoHS, REACH | RoHS, REACH | RoHS, REACH |
| Warranty | 1 year | 1 year | 1 year |
1. Under highest Sequential write value. May vary by density, configuration and applications.
2. Product specifications may be subject to change.
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