M.2 NVMe with Heatsink

Key Features

  • Thermal Management Solutions* Customization available on a project basis
  • High-Capacity NVMe Drive
  • LDPC & RAID Data Recovery
  • End-to-End Data Protection
  • S.M.A.R.T / TRIM / Global Wear Leveling

Description

Its compact form factor and ultra-fast performance are among the key reasons why the M.2 2280 NVMe solid state module is gaining increasing adoption in embedded and industrial applications. Supporting the NVMe™protocol on the high-speed PCI Express® (PCIe®) Gen3 x4 interface, these modules deliver up to 3,420/3,050 MB/s sequential read/write and extra-long service life of up to 10,600 TB.*

When installed in enclosures with little or no airflow and constantly subjected to intense workloads under harsh conditions, these modules face overheating challenges. Multiple die stacking per integrated circuit (IC) and intensive components in the limited printed circuit board (PCB) space, especially for double-sided designs, also contribute to the overheating issue.

ATP M.2 2280 NVMe modules adopt a Customizable Thermal Management Solution. This includes firmware and hardware options, such as copper foil and fin-type heatsink, to effectively dissipate heat and ensure optimal levels of sustained performance.

With a maximum density of 3.84 TB, these high-capacity modules offer huge storage space to accommodate vast amounts of data and handle simultaneous queues of storage requests from multiple servers. ATP NVMe SSDs outperform Serial ATA 6 Gb/s SSDs with 4-6X faster access and over 3X lower latency, making them ideal for applications where microseconds count, such as those involving real-time customer interactions, time-critical data analytics, and more.

* Terabytes Written (TBW). Under highest Sequential write value. May vary by density, configuration and applications.

Specifications

M.2 NVMe with Heatsink
Product NameM.2 NVMe with Heatsink
Product LineSuperior
NamingN600Si / N600Sc
Flash TypeTLC
Density120 GB to 3.84 TB
Performance Sequential Read up to (MB/s)3,420
Performance Sequential Write up to (MB/s)3,050
InterfacePCIe G3 x4
Operating Temperature (Tcase)*-40°C to 85°C
Reliability TBW** (max.)10,600 TB
Reliability MTBF @ 25°C>2,000,000 hours
Dimensions: L x W x H (mm)80.0 x 22.0 x 3.6

* Case Temperature, the composite temperature as indicated by SMART temperature attributes.
** Under highest Sequential write value. May vary by density, configuration and applications.

Product Line

Technologies & Add-On ServicesProduct Line
Superior
S.M.A.R.T.
S.M.A.R.T.
available
Advanced Wear Leveling
Advanced Wear Leveling
available
AutoRefresh
AutoRefresh
available
Dynamic Data Refresh
Dynamic Data Refresh
available
End-to End Data Protection
End-to End Data Protection
available
customizable:Customization option available on a project basis.

Downloads

  • ATP_Customizable Thermal Management Solutions _2021
    English
    2021-03-254.84MB
  • ATP_M.2 NVMe with Heatsink_flyer
    English
    2021-03-251.58MB
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