PCIe® Gen3 High-Capacity NVMe M.2 SSD

Key Features

  • Superior Read/Write performance
  • LDPC & RAID Data Recovery for error correction
  • Thermal Management Solutions*
  • Global wear leveling
  • TRIM function support
  • End-to-End Data Path Protection
  • * Customization available on a project basis

Description

Its compact form factor and ultra-fast performance are among the key reasons why the M.2 2280 NVMe solid state module is gaining increasing adoption in embedded and industrial applications. Supporting the NVMe™protocol on the high-speed PCI Express® (PCIe®) Gen3 x4 interface, these modules deliver up to 2,700/1,500 MB/s sequential read/write and extra-long service life of up to 10,600 TB.*

When installed in enclosures with little or no airflow and constantly subjected to intense workloads under harsh conditions, these modules face overheating challenges. Multiple die stacking per integrated circuit (IC) and intensive components in the limited printed circuit board (PCB) space, especially for double-sided designs, also contribute to the overheating issue.

ATP M.2 2280 NVMe modules adopt a Customizable Thermal Management Solution. This includes firmware and hardware options, such as copper foil and fin-type heatsink, to effectively dissipate heat and ensure optimal levels of sustained performance.

With a maximum density of 3.84 TB, these high-capacity modules offer huge storage space to accommodate vast amounts of data and handle simultaneous queues of storage requests from multiple servers. ATP NVMe SSDs outperform Serial ATA 6 Gb/s SSDs with 4-6X faster access and over 3X lower latency, making them ideal for applications where microseconds count, such as those involving real-time customer interactions, time-critical data analytics, and more.

* Terabytes Written (TBW). Under highest Sequential write value. May vary by density, configuration and applications.

SpecificationsLatest Update: 2023-03-10 14:39

PCIe® Gen3 High-Capacity NVMe M.2 2280 SSD
Product LineSuperiorSuperior
NamingN600Si3N600Sc
InterfacePCIe G3 x4PCIe G3 x4
Flash TypeTLCTLC
Form FactorM.2 2280-D2-MM.2 2280-D2-M
Operating Temperature (Tcase)1-40°C to 85°C0°C to 70°C
Power Loss Protection OptionsFirmware BasedFirmware Based
Optional SED Features--
Capacity3.84 TB3.84 TB
Sequential Read (MB/s) up to2,2002,700
Sequential Write (MB/s) up to1,2501,500
Random Reads IOPS up to195,000195,000
Random Writes IOPS up to170,000170,000
Endurance (TBW)2 up to10,600 TB10,600 TB
Reliability MTBF @ 25°C>2,000,000 hours>2,000,000 hours
Dimensions (mm)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink)80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA); 80.0 x 24.4 x 12.5 (M.2 2280 with 8mm heatsink)
CertificationsRoHS, VCCI, CE, FCCRoHS, VCCI, CE, FCC
Warranty2 years2 years

1 Case Temperature, the composite temperature as indicated by SMART temperature attributes.
2 Under highest Sequential write value. May vary by density, configuration and applications.
3 Data subject to change.

TechnologyView All Technologies

Technologies & Add-On ServicesProduct Line
Superior
S.M.A.R.T.
S.M.A.R.T.
available
Firmware-based Power Loss  Protection
Firmware-based Power Loss Protection
available
AutoRefresh
AutoRefresh
available
Advanced Wear Leveling
Advanced Wear Leveling
available
Dynamic Data Refresh
Dynamic Data Refresh
available
End-to End Data Path Protection
End-to End Data Path Protection
available
Auto-Read Calibration
Auto-Read Calibration
available
Secure Erase
Secure Erase
customizable
TCG Opal 2.0
TCG Opal 2.0
customizable
 Dynamic Thermal Throttling
Dynamic Thermal Throttling
available
Industrial Temperature
Industrial Temperature
available
Conformal Coating
Conformal Coating
customizable
Joint Validation
Joint Validation
customizable
customizable:Customization option available on a project basis.

Downloads

  • ATP High-Capacity M.2 NVMe product flyer
    English
    2022-01-28755.96KB
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