U.2 NVMe SSD

Key Features

  • Thermal Management Solutions* Customization available on a project basis.
  • High-Capacity NVMe Drive
  • LDPC & RAID Data Recovery
  • End-to-End Data Protection
  • S.M.A.R.T / TRIM / Global Wear Leveling

Description

ATP U.2 NVMe solid state drives (SSDs) support the NVMe™ protocol on the high-speed PCI Express® (PCIe®) Gen3 x4 interface, with maximum capacity reaching 8 TB. The massive storage space is encased in a very lean footprint, making U.2 SSDs ideal for space-restricted systems, such as embedded industrial PCs, point-of-sale (POS), and networking systems.

When installed in enclosures with little or no airflow and constantly subjected to intense workloads under harsh conditions, these SSDs face overheating challenges. Multiple die stacking per integrated circuit (IC) and intensive components in the limited printed circuit board (PCB) space, especially for double-sided designs, also contribute to the overheating issue.

Available with ATP’s Customizable Thermal Management Solution, these high-density thermal U.2 NVMe drives adopt both advanced firmware and hardware options, which include a thermal pad on the controller to effectively transfer heat from the device to the U.2 aluminum housing. This keeps the device cool and ensures sustained performance at high temperatures.

Up to 3,100/1,400 MB/s sequential read/write performance translates to accelerated workloads for real-time processing, and extreme endurance up to 21,000 TB* means longer service life for best total cost of ownership (TCO) value.

* Terabytes Written (TBW). Under highest Sequential write value. May vary by density, configuration and applications.

 

Specifications

U.2 SSD
Product NameU.2 SSD
Product LineSuperior
NamingN600Si
Flash TypeTLC
Density960 GB to 8 TB
Performance Sequential Read up to (MB/s)3,100
Performance Sequential Write up to (MB/s)1,400
InterfacePCIe G3 x4
Operating Temperature (Tcase)*-40°C to 85°C
Endurance TBW** (max.)21,000 TB
Reliability MTBF @ 25°C>2,000,000 hours
Dimensions: L x W x H (mm)100.0 x 69.85 x 7.0
* Case Temperature, the composite temperature as indicated by SMART temperature attributes.
** Under highest Sequential write value. May vary by density, configuration and applications.

Product Line

Technologies & Add-On ServicesProduct Line
Superior
S.M.A.R.T.
S.M.A.R.T.
available
Hardware-based Power Loss Protection
Hardware-based Power Loss Protection
available
Advanced Wear Leveling
Advanced Wear Leveling
available
AutoRefresh
AutoRefresh
available
Dynamic Data Refresh
Dynamic Data Refresh
available
Secure Erase
Secure Erase
available
Industrial Temperature
Industrial Temperature
available
End-to End Data Protection
End-to End Data Protection
available
TCG Opal 2.0
TCG Opal 2.0
available
customizable:Customization option available on a project basis.

Downloads

  • ATP_Customizable Thermal Management Solutions _2021
    English
    2021-03-254.84MB
  • ATP_U.2 SSD_flyer
    English
    2021-03-25242.84KB
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